Systems for integrated decomposition and scanning of a semiconducting wafer

Patent metadata

Field	Value
Publication number	US-11049741-B2
Application number	US-201816200074-A
Country	US
Kind code	B2
Filing date	Nov 26, 2018
Priority date	Dec 1, 2017
Publication date	Jun 29, 2021
Grant date	Jun 29, 2021

Abstract

Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

First claim

What is claimed is:

1. A method for decomposing and scanning a surface of a semiconducting wafer utilizing a nozzle comprising:
spraying a decomposition fluid onto a surface of a semiconducting wafer with a nebulizer;
positioning a nozzle above the surface of the semiconducting wafer following spraying of the decomposition fluid onto the surface of the semiconducting wafer with the nebulizer;
introducing a scan fluid to an inlet port of the nozzle and directing a stream of the scan fluid onto the surface of the semiconducting wafer via a first nozzle port;
directing the stream of the scan fluid through an elongated channel of the nozzle along the surface of the semiconducting wafer toward a second nozzle port of the nozzle; and
removing the stream of the scan fluid from the surface of the semiconducting wafer via the second nozzle port in fluid communication with an outlet port of the nozzle.

2. The method of claim 1 , wherein the elongated channel has a length of approximately a radius of the semiconducting wafer.

3. The method of claim 1 , wherein spraying a decomposition fluid onto a surface of a semiconducting wafer with a nebulizer includes directly spraying the decomposition fluid onto the surface of the semiconducting wafer with the nebulizer.

4. The method of claim 1 , further comprising rotating the semiconducting wafer during spraying the decomposition fluid onto the surface of the semiconducting wafer with the nebulizer.

5. The method of claim 1 , further comprising mixing two or more fluids inline to produce the scan fluid prior to introducing the scan fluid to the inlet port of the nozzle.

6. The method of claim 1 , wherein introducing a scan fluid to an inlet port of the nozzle and directing a stream of the scan fluid onto the surface of the semiconducting wafer via a first nozzle port includes introducing the scan fluid to the inlet port of the nozzle and directing the stream of the scan fluid onto the surface of the semiconducting wafer via the first nozzle port through operation of a first pump.

7. The method of claim 6 , wherein removing the stream of the scan fluid from the surface of the semiconducting wafer via the second nozzle port in fluid communication with an outlet port of the nozzle includes removing the stream of the scan fluid from the surface of the semiconducting wafer via the second nozzle port in fluid communication with the outlet port of the nozzle through operation of a second pump.

8. The method of claim 1 , further comprising rotating the semiconducting wafer subsequent to directing the stream of the scan fluid through the elongated channel of the nozzle along the surface of the semiconducting wafer toward the second nozzle port of the nozzle and prior to removing the stream of the scan fluid from the surface of the semiconducting wafer via the second nozzle port in fluid communication with the outlet port of the nozzle.

9. The method of claim 8 , wherein the stream of the scan fluid contacts substantially the entire surface of the semiconducting wafer during a single rotation of the semiconducting wafer.

10. The method of claim 1 , further comprising touching a bottom surface of a nozzle hood of the nozzle to an indexing surface to adjust a position of the nozzle within a nozzle housing, prior to directing the stream of the scan fluid onto the surface of the semiconducting wafer via the first nozzle port.

11. The method of claim 10 , further comprising locking the position of the nozzle within the nozzle housing during touching of the bottom surface of the nozzle hood of the nozzle to the indexing surface.

12. The method of claim 11 , wherein locking the position of the nozzle within the nozzle housing includes activating an electromagnet to engage a coupler within the nozzle housing, wherein the nozzle is moveably coupled to the nozzle housing via the coupler.

13. The method of claim 1 , further comprising rotating the nozzle from a first position over the surface of the semiconducting wafer to a second position over the surface of the semiconducting wafer, prior to removing the stream of the scan fluid from the surface of the semiconducting wafer via the second nozzle port, wherein introducing the scan fluid to the inlet port of the nozzle and directing the stream of the scan fluid onto the surface of the semiconducting wafer via the first nozzle port occurs with the nozzle in the first position, and wherein a portion of the elongated channel extends past an outer edge of the semiconducting wafer with the nozzle in the second position.

Assignees

• Elemental Scientific Inc

Inventors

• Yost Tyler
• Wiederin Daniel R
• Marth Beau
• Kaser Jared
• Hein Jonathan
• Lee Jae Seok
• Kim Jae Min
• Sudyka Stephen H

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/277

  Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers · CPC title

• H10P74/207

  Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title

• H10P72/3406

  involving removal of lid, door or cover · CPC title

• H10P72/3306

  Horizontal transfer of a single workpiece · CPC title