Systems for integrated decomposition and scanning of a semiconducting wafer

Patent metadata

Field	Value
Publication number	US-11244841-B2
Application number	US-201816200038-A
Country	US
Kind code	B2
Filing date	Nov 26, 2018
Priority date	Dec 1, 2017
Publication date	Feb 8, 2022
Grant date	Feb 8, 2022

Abstract

Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.

First claim

What is claimed is:

1. A nozzle system for scanning a surface of a semiconducting wafer comprising:
a nozzle including
a nozzle body defining an inlet port in fluid communication with a first nozzle port, and defining a second nozzle port in fluid communication with an outlet port, the nozzle body configured to receive a fluid through the inlet port and direct the fluid through the first nozzle port to introduce the fluid to a surface of a semiconducting wafer, the nozzle body configured to remove the fluid from the surface of the semiconducting wafer via the second nozzle port and direct the fluid from the second nozzle port through the outlet port, and
a nozzle hood extending from the nozzle body adjacent the first nozzle port and the second nozzle port and defining a channel disposed between the first nozzle port and the second nozzle port, the nozzle hood configured to direct the fluid from the first nozzle port to the second nozzle port along the surface of the semiconducting wafer; and

a nozzle housing including
a housing body defining an interior portion and an aperture through which at least a portion of the nozzle can pass when transitioning between an extended position and a retracted position.

2. The nozzle system of claim 1 , wherein the nozzle housing further includes a sensor positioned at least partially within the interior portion, the sensor configured to measure the presence or absence of fluid passing through a fluid line coupled to the inlet port or the outlet port.

3. The nozzle system of claim 1 , wherein the nozzle is moveably coupled to the nozzle housing via a coupler.

4. The nozzle system of claim 3 , wherein the coupler defines an aperture, and wherein the nozzle housing includes a protrusion extending through the aperture.

5. The nozzle system of claim 4 , wherein a top portion of the aperture rests on a portion of the protrusion when the nozzle is in the extended position.

6. The nozzle system of claim 4 , wherein the nozzle housing further includes a lock structure configured to interact with the coupler to hold the nozzle in the retracted position.

7. The nozzle system of claim 6 , wherein the lock structure includes an electromagnet.

8. The nozzle system of claim 6 , wherein the protrusion does not support the aperture when the nozzle is in the retracted position.

9. The nozzle system of claim 1 , wherein the channel is an elongated channel having opposing rounded ends defined by the nozzle hood.

10. The nozzle system of claim 9 , wherein the first nozzle port is positioned tangent to an edge of a first rounded edge of the elongated channel, and wherein the second nozzle port is positioned at a center of a second rounded edge of the elongated channel distal to the first nozzle port.

11. The nozzle system of claim 1 , wherein the channel has a length of approximately a radius of the semiconducting wafer.

12. A nozzle for scanning a surface of a semiconducting wafer comprising:
a nozzle body defining an inlet port in fluid communication with a first nozzle port, and defining a second nozzle port in fluid communication with an outlet port, the nozzle body configured to receive a fluid through the inlet port and direct the fluid through the first nozzle port to introduce the fluid to a surface of a semiconducting wafer, the nozzle body configured to remove the fluid from the surface of the semiconducting wafer via the second nozzle port and direct the fluid from the second nozzle port through the outlet port; and
a nozzle hood extending from the nozzle body adjacent the first nozzle port and the second nozzle port and defining a channel disposed at least partially between the first nozzle port and the second nozzle port, the nozzle hood configured to direct the fluid from the first nozzle port to the second nozzle port along the surface of the semiconducting wafer.

13. The nozzle of claim 12 , wherein the nozzle body includes opposing side walls, each of the opposing side walls including a tapered portion coupled to a vertical side wall.

14. The nozzle of claim 13 , wherein each vertical side wall defines at least a portion of the nozzle hood.

15. The nozzle of claim 12 , wherein the channel is an elongated channel having opposing rounded ends defined by the nozzle hood.

16. The nozzle of claim 15 , wherein the first nozzle port is positioned tangent to an edge of a first rounded edge of the elongated channel.

17. The nozzle of claim 16 , wherein the second nozzle port is positioned at a center of a second rounded edge of the elongated channel distal to the first nozzle port.

18. The nozzle of claim 12 , wherein the channel has a length of approximately a radius of the semiconducting wafer.

19. The nozzle of claim 12 , wherein the channel has a volume of up to approximately 300 μL.

20. The nozzle of claim 12 , wherein the nozzle body comprises at least one of chlorotrifluoroethylene (CTFE) or polytetrafluoroethylene (PTFE).

Assignees

• Elemental Scientific Inc

Inventors

• Yost Tyler
• Wiederin Daniel R
• Marth Beau
• Kaser Jared
• Hein Jonathan
• Lee Jae Seok
• Kim Jae Min
• Sudyka Stephen H

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P74/277

  Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers · CPC title

• H10P74/207

  Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title

• H10P72/3406

  involving removal of lid, door or cover · CPC title

• H10P72/3306

  Horizontal transfer of a single workpiece · CPC title