Molded range and proximity sensor with optical resin lens

Patent metadata

Field	Value
Publication number	US-11693149-B2
Application number	US-202117411948-A
Country	US
Kind code	B2
Filing date	Aug 25, 2021
Priority date	Aug 21, 2015
Publication date	Jul 4, 2023
Grant date	Jul 4, 2023

Abstract

A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.

First claim

The invention claimed is:

1. A structure, comprising:
a semiconductor die having a first surface and a second surface;
a light sensor in the semiconductor die and between the first surface and the second surface;
a light emitting device on the first surface of the semiconductor die;
a glue stopper element on the first surface and between the light emitting device and the light sensor;
a first resin lens that encapsulates the light emitting device on the first surface;
a second resin lens that encapsulates the light sensor on the first surface; and
a molding compound surrounds the first resin lens, surrounds the second resin lens, is on the glue stopper element, and is on the semiconductor die.

2. The structure of claim 1 , comprising a wire that couples the light emitting device to the semiconductor die.

3. The structure of claim 1 wherein the first resin lens abuts the light emitting device.

4. The structure of claim 1 , comprising a molding compound on the semiconductor die and surrounding the first resin lens and the second resin lens.

5. The structure of claim 4 wherein the molding compound includes a first opening aligned with the light emitting device and a second opening aligned with the light sensor; and
wherein the first resin lens is in the first opening and the second resin lens is in the second opening.

6. The structure of claim 5 wherein the first resin lens and the second resin lens are each coplanar with the molding compound.

7. The structure of claim 4 , comprising a baffle layer over the molding compound, the baffle layer partially covering one or more of the first resin lens and the second resin lens.

8. The structure of claim 1 , comprising a glass layer over one or more of the first resin lens and the second resin lens.

9. The structure of claim 4 , comprising a glass lens in the molding compound and over the first resin lens.

10. The structure of claim 9 , comprising a gap in the molding compound and between the glass lens and the first resin lens.

11. The structure of claim 10 wherein the gap includes air.

12. A device, comprising:
a substrate having a plurality of conductive contact leads;
an encapsulation layer over the substrate, the plurality of conductive contact leads exposed from the encapsulation layer; and
a plurality of structures in the encapsulation layer and coupled to one or more conductive contact leads of the plurality of conductive contact leads, the plurality of structures including:
a semiconductor die including a light sensor in the semiconductor die;
a light emitting device on a surface of the semiconductor die; and
a glue stopper element on the surface of the semiconductor die and between the light emitting device and the light sensor.

13. The device of claim 12 wherein the substrate is a printed circuit board.

14. The device of claim 12 , wherein the plurality of structures include:
a first resin lens that encapsulates the light emitting device on the surface; and
a second resin lens that encapsulates the light sensor on the surface.

15. The device of claim 12 , comprising a glass layer over the encapsulation layer.

16. A method, comprising:
mounting a light emitting device on a first surface of a semiconductor die, the semiconductor die having a light receiving sensor on the first surface laterally with respect to the light emitting device;
forming a glue stopper element on the first surface and between the light emitting device and the light receiving sensor;
after the forming the glue stopper element, forming a first optical resin overlying the light emitting device; and
after the forming the glue stopper element, forming a second optical resin overlying the light receiving sensor.

17. The method of claim 16 , comprising:
forming a molding compound over the first surface of the semiconductor die and surrounding the first optical resin and the second optical resin.

18. The method of claim 17 , wherein the forming the molding compound includes:
forming the molding compound over the first optical resin and the second optical resin; and
exposing the first optical resin and the second optical resin from the molding compound by planarizing the molding compound.

19. The method of claim 16 , comprising attaching a substrate onto a second surface of the semiconductor die, the second surface opposite to the first surface.

20. The method of claim 19 , comprising forming a conductive contact structure on the substrate.

Assignees

• St Microelectronics Res & Dev Ltd
• St Microelectronics Pte Ltd

Inventors

• Wong Wing Shenq
• Price Andy
• Christison Eric

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W70/65 Primary

  Shapes or dispositions of interconnections · CPC title

• H10F55/25

  wherein the radiation-sensitive devices and the electric light source are all semiconductor devices · CPC title