Hybrid switch control
US-10756722-B2 · Aug 25, 2020 · US
US11677396B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11677396-B2 |
| Application number | US-202017123316-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 16, 2020 |
| Priority date | Dec 16, 2020 |
| Publication date | Jun 13, 2023 |
| Grant date | Jun 13, 2023 |
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Hybrid power switching stages and driver circuits are disclosed. An example semiconductor power switching device comprises a high-side switch and a low-side switch connected in a half-bridge configuration, wherein the high-side switch comprises a GaN power transistor and the low-side switch comprises a Si MOSFET. The Si—GaN hybrid switching stage provides enhanced performance, e.g. reduced switching losses, in a cost-effective solution which takes advantage of characteristics of power switching devices comprising both GaN power transistors and Si MOSFETs. Also disclosed is a gate driver for the Si—GaN hybrid switching stage, and a semiconductor power switching stage comprising the gate driver and a Si—GaN hybrid power switching device having a half-bridge or full-bridge switching topology.
Opening claim text (preview).
The invention claimed is: 1. A power semiconductor switching stage comprising: a hybrid power semiconductor switching device comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, wherein: the high-side switch is a Gallium Nitride (GaN) semiconductor power switching device implemented with at least one transistor, wherein every transistor of the high-side switch is an enhancement-mode GaN power transistor having a source, a drain and a gate; and the low-side switch is a Silicon (Si) semiconductor power switching device implemented with at least one transistor, wherein every transistor of the low-side switch is an enhancement-mode Si MOSFET having a source, a drain and a gate; the drain of every GaN power transistor is connected to a DC bus, the source of every GaN power transistor is connected to a switch node, the drain of every Si MOSFET is connected to the switch node, and the source of every Si MOSFET is connected to a source bus; a MOSFET half-bridge gate driver comprising a high-side driver and a low-side driver; a gate drive output of the low-side driver being connected to the gate of every Si MOSFET through a first gate drive circuit comprising a gate resistor to provide a gate drive of a first voltage range for driving every Si MOSFET; a gate drive output of the high-side driver being connected to the gate of every GaN power transistor through a second gate drive circuit comprising a gate resistor and a voltage level shift circuit to provide a gate drive of a second voltage range for driving every GaN power transistor. 2. The power semiconductor switching stage of claim 1 , wherein the low-side switch comprises a plurality of Si MOSFETs connected in parallel. 3. The power semiconductor switching stage of claim 1 , wherein the high-side switch comprises a plurality of GaN power transistors connected in parallel. 4. The power semiconductor switching stage of claim 1 wherein, for a supply voltage V DD , said first voltage range for driving every Si MOSFET is a range from 0V to V DD , and the second voltage range for driving every GaN power transistor is level shifted to provide a positive turn-on gate voltage and a negative turn-off gate voltage. 5. The power semiconductor switching stage of claim 4 , wherein the voltage level shift circuit comprises a capacitor in parallel with a resistor, connected in series between the gate resistor and the gate of every GaN power transistor, and a clamp circuit connected between the gate of every GaN power transistor and the source of every GaN power transistor for clamping the positive turn-on gate voltage and the negative turn-off gate voltage. 6. The power semiconductor switching stage of claim 5 , wherein the clamp circuit comprises a diode clamp. 7. The power semiconductor switching stage of claim 1 , which is part of a half-bridge or full-bridge power switching stage. 8. The power semiconductor switching stage of claim 1 , wherein every GaN power transistor is a GaN HEMT. 9. The power semiconductor switching stage of claim 1 , wherein said MOSFET half-bridge gate driver is integrated with a driver controller. 10. A gate driver for a hybrid power switching device comprising a high-side switch and a low-side switch connected in series in a half-bridge configuration, wherein: the high-side switch is a Gallium Nitride (GaN) semiconductor power switching device implemented with at least one transistor, wherein every transistor of the high-side switch is an enhancement mode GaN power transistor having a source, a drain and a gate; and the low-side switch is an enhancement-mode Silicon (Si) semiconductor power switching device implemented with at least one transistor, wherein every power transistor of the low-side switch is a Si MOSFET having a source, a drain and a gate; the drain of every GaN power transistor is connected to a DC bus, the source of every GaN power transistor is connected to a switch node, the drain of every Si MOSFET is connected to the switch node, and the source of every Si MOSFET is connected to a source bus; the gate driver comprising: a half-bridge driver comprising a high-side driver and a low-side driver; a gate drive output of the low-side driver being connected through a first gate drive circuit comprising a first gate resistor to provide a gate drive voltage output of a first voltage range for driving the gate of every Si MOSFET of the low-side switch; a gate drive output of the high-side driver being connected through a second gate drive circuit comprising a gate resistor and a voltage level shift circuit to provide a gate drive voltage output of a second voltage range for driving the gate of every GaN transistor of the high-side switch. 11. The gate driver of claim 10 , wherein for a supply voltage V DD , the first voltage range for driving the Si semiconductor power switching device is in a range from 0V to V DD and the second voltage range for driving the GaN semiconductor power switching device is level shifted to provide a positive turn-on gate voltage and a negative turn-off gate voltage. 12. The gate driver of claim 11 , wherein the level shift circuit comprises a capacitor in parallel with a resistor, connected in series between the gate resistor and the gate of every GaN power transitor, and a clamp circuit connected between the gate of every GaN power transistor and the source of every GaN power transistor for clamping the positive turn-on gate voltage and the negative turn-off gate voltage. 13. The gate driver of claim 12 , wherein the clamp circuit comprises a diode clamp. 14. The gate driver of claim 10 , integrated with a driver controller. 15. A power semiconductor switching stage comprising: a hybrid power semiconductor switching device comprising: a high-side switch and a low-side switch connected in series in a half-bridge configuration, wherein: the high-side switch is a Gallium Nitride (GaN) semiconductor power switching device, implemented with a plurality of power transistors connected in parallel, wherein every power transistor of the high-side switch is an enhancement-mode GaN power transistor, having a drain, a source and a gate; the low-side switch is a Silicon (Si) semiconductor power switching device, implemented with a plurality of power transistors connected in parallel, wherein every power transistor of the low-side switch is an enhancement-mode Si MOSFET, having a drain, a source and a gate; the drain of every GaN power transistor is connected to a DC bus, the source of every GaN power transistor is connected to a switch node, the drain of every Si MOSFET is connected to the common switch node, and the source of every Si MOSFET is connected to a source bus; a gate driver comprising a MOSFET half-bridge gate driver comprising a high-side driver and a low-side driver; a gate drive output of the low-side driver being connected to the gate of every Si MOSFET through a first gate drive circuit comprising a gate resistor to provide a gate drive of a first voltage range for driving the plurality of Si MOSFETs; a gate drive output of the high-side driver being connected to the gate of every GaN power transistor through a second gate drive circuit comprising a gate resistor and a voltage level shift circuit to provide a gate drive of a second voltage range, different from the first voltage range, for driving the plurality of GaN power transistors. 16. The power semiconductor switching stage of claim 15 wherein, for a power supply voltage V DD , said first voltage range for driving the plurality of Si MOSFETs is in a range from 0V to V DD , and t
the output circuit comprising more than one controlled field-effect transistor · CPC title
Low side switches, i.e. the lower potential [DC] or neutral wire [AC] being directly connected to the switch and not via the load · CPC title
Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes · CPC title
High side switches, i.e. the higher potential [DC] or life wire [AC] being directly connected to the switch and not via the load · CPC title
Power supply means, e.g. to the switch driver · CPC title
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