Layered metal oxide-silicon oxide films
US-2026078484-A1 · Mar 19, 2026 · US
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Agarwal Pulkit patents
Agarwal Pulkit is listed as an inventor on 79 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Agarwal Pulkit |
| Total patents | 79 |
| First publication | Jun 18, 2015 |
| Latest publication | Mar 19, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Plasma enhanced atomic layer deposition of silicon-containing films
US-2026055502-A1 · Feb 26, 2026 · US
Automated feedforward and feedback sequence for patterning CD control
US-12531220-B2 · Jan 20, 2026 · US
Plasma enhanced atomic layer deposition of silicon-containing films
US-12473633-B2 · Nov 18, 2025 · US
Nonconformal oxide film deposition using carbon-containing inhibitor
US-2025340984-A1 · Nov 6, 2025 · US
Modulated atomic layer deposition
US-12451346-B2 · Oct 21, 2025 · US
Rapid tuning of critical dimension non-uniformity by modulating temperature transients of multi-zone substrate supports
US-2025279299-A1 · Sep 4, 2025 · US
Dynamic process control in semiconductor manufacturing
US-2025266274-A1 · Aug 21, 2025 · US
Surface inhibition atomic layer deposition
US-2025179632-A1 · Jun 5, 2025 · US
Dynamic process control in semiconductor manufacturing
US-12322619-B2 · Jun 3, 2025 · US
Recent patents
Latest publications not already listed above.
Temperature control of a multi-zone pedestal
US-2025171902-A1 · May 29, 2025 · US
Thermal film deposition
US-2025166989-A1 · May 22, 2025 · US
Rapid tuning of critical dimension non-uniformity by modulating temperature transients of multi-zone substrate supports
US-12308264-B2 · May 20, 2025 · US
Substrate processing aparatuses with rotating mechanisms including shafts with gas flow paths
US-2025121465-A1 · Apr 17, 2025 · US
Increasing deposition rates of oxide films
US-2025087481-A1 · Mar 13, 2025 · US
Temperature control of a multi-zone pedestal
US-12209312-B2 · Jan 28, 2025 · US
Use of vacuum during transfer of substrates
US-12186851-B2 · Jan 7, 2025 · US
Trim and deposition profile control with multi-zone heated substrate support for multi-patterning processes
US-2024392443-A1 · Nov 28, 2024 · US
Apparatus for cleaning plasma chambers
US-2024395513-A1 · Nov 28, 2024 · US
In-situ core protection in multi-patterning
US-2024355624-A1 · Oct 24, 2024 · US
Modulated atomic layer deposition
US-2024332007-A1 · Oct 3, 2024 · US
Plasma enhanced atomic layer deposition of silicon-containing films
US-2024327973-A1 · Oct 3, 2024 · US
Trim and deposition profile control with multi-zone heated substrate support for multi-patterning processes
US-12071689-B2 · Aug 27, 2024 · US
Apparatus for cleaning plasma chambers
US-12057300-B2 · Aug 6, 2024 · US
Modulated atomic layer deposition
US-12040181-B2 · Jul 16, 2024 · US
Method and apparatus for modulating film uniformity
US-2024183034-A1 · Jun 6, 2024 · US
Method and apparatus for modulating film uniformity
US-11913113-B2 · Feb 27, 2024 · US
Seam mitigation and integrated liner for gap fill
US-2023175117-A1 · Jun 8, 2023 · US
Automated feedforward and feedback sequence for patterning cd control
US-2023170195-A1 · Jun 1, 2023 · US
Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film
US-11651963-B2 · May 16, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 69 |
| Applied Materials Inc | 10 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C23C16/52 | 37 |
| H10P14/69215 | 36 |
| H10P14/6339 | 35 |
| H01L21/0228 | 27 |
| H10P14/6336 | 27 |