Lead-free solder alloy and in-vehicle electronic circuit

Patent metadata

Field	Value
Publication number	US-9837757-B2
Application number	US-201414782142-A
Country	US
Kind code	B2
Filing date	Apr 3, 2014
Priority date	Apr 2, 2013
Publication date	Dec 5, 2017
Grant date	Dec 5, 2017

Abstract

With the increasing density of in-vehicle electronic circuits, not only conventional cracks at bonding interfaces such as between the substrate and the solder attachment site or a component and the solder attachment site but also novel cracking problems of cracks occurring in the Sn matrix in the interior of the bonded solder have appeared. To solve the above problem, a lead-free solder alloy with 1-4 mass % Ag, 0.6-0.8 mass % Cu, 1-5 mass % Sb, 0.01-0.2 mass % Ni and the remainder being Sn is used. A solder alloy, which not only can withstand harsh temperature cycling characteristics from low temperatures of −40° C. to high temperatures of 125° C. but can also withstand external forces that occur when riding up on a curb or colliding with a vehicle in front for long periods, and an in-vehicle electronic circuit device using the solder alloy can thereby be obtained.

First claim

The invention claimed is:

1. A lead-free solder alloy consisting of:
3.2 to 3.8 wt % of Ag;
0.6 to 0.8 wt % of Cu;
2 to 5 wt% of Sb;
0.01 to 0.2 wt % of Ni;
5 to 5.5 wt % of Bi;
0.001 to 0.01 wt% of Co; and
a balance of Sn.

2. The lead-free solder alloy according to claim 1 , wherein a rate of residual shear strength after 3,000 cycles of a temperature cycle test with respect to an initial value is 30% or more.

3. The lead-free solder alloy according to claim 2 , wherein the solder alloy is joined to a board having undergone a Cu-OSP process.

4. An in-vehicle electronic circuit comprising a solder joint portion consisting of the lead-free solder alloy according to claim 2 .

5. An ECU electronic circuit comprising a solder joint portion consisting of the lead-free solder alloy according to claim 2 .

6. The lead-free solder alloy according to claim 1 , wherein the solder alloy is joined to a board having undergone a Cu-OSP process.

7. The lead-free solder alloy according to claim 6 , wherein a rate of residual shear strength after 3,000 cycles of a temperature cycle test with respect to an initial value is 30% or more.

8. The lead-free solder alloy according to claim 7 , wherein the solder alloy is joined to a board having undergone a Cu-OSP process.

9. An in-vehicle electronic circuit comprising a solder joint portion consisting of the lead-free solder alloy according to claim 7 .

10. An ECU electronic circuit comprising a solder joint portion consisting of the lead-free solder alloy according to claim 7 .

11. An in-vehicle electronic circuit comprising a solder joint portion consisting of the lead-free solder alloy according to claim 6 .

12. An ECU electronic circuit comprising a solder joint portion consisting of the lead-free solder alloy according to claim 6 .

13. An in-vehicle electronic circuit comprising a solder joint portion consisting of the lead-free solder alloy according to claim 1 .

14. An in-vehicle electronic circuit unit comprising the electronic circuit according to claim 13 .

15. An ECU electronic circuit comprising a solder joint portion consisting of the lead-free solder alloy according to claim 1 .

16. An ECU electronic circuit unit comprising the ECU electronic circuit according to claim 15 .

17. The lead-free solder alloy according to claim 1 , which contains 3 to 5 wt% of Sb.

18. A lead-free solder alloy consisting of:
1 to 4 wt % of Ag;
0.6 to 0.8 wt % of Cu;
2 to 5 wt % of Sb;
0.01 to 0.2 wt % of Ni;
5 to 5.5 wt % of Bi;
0.001 to 0.1 wt % of Co; and
a balance of Sn.

19. The lead-free solder alloy according to claim 18 , which contains 3 to 5 wt % of Sb.

Assignees

• Senju Metal Industry Co

Inventors

• Yoshikawa Shunsaku
• Hirai Naoko
• Tachibana Ken
• Tachibana Yoshie

Classifications

• B23K2101/36

  Electric or electronic devices · CPC title

• B23K35/262

  Sn as the principal constituent · CPC title

• B23K35/0222

  for use in soldering or brazing (B23K35/0205 takes precedence) · CPC title

• C22C13/00

  Alloys based on tin · CPC title

• B23K2101/42

  Printed circuits · CPC title