Reactant vaporizer and related systems and methods
US-11377732-B2 · Jul 5, 2022 · US
US11624113B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11624113-B2 |
| Application number | US-202017011828-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 3, 2020 |
| Priority date | Sep 13, 2019 |
| Publication date | Apr 11, 2023 |
| Grant date | Apr 11, 2023 |
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Systems and methods related to temperature zone control systems can include a reactant source cabinet that is configured to be at least partially evacuated, a vessel base that is configured to hold solid source chemical reactant therein, and a lid that is coupled to a distal portion of the vessel base. The lid may include one or more lid valves. The system may further include a plurality of gas panel valves that are configured to deliver gas from a gas source to the vessel. The system may include a heating element that is configured to heat the one or more lid valves. The system may include a heat shield, a first portion of which is disposed between the one or more lid valves and the vessel base. A second portion of the heat shield may be disposed between the first heating element and the plurality of gas panel valves.
Opening claim text (preview).
What is claimed is: 1. A temperature zone control system comprising: a reactant source cabinet configured to be at least partially evacuated; a vessel base configured to hold solid source chemical reactant therein, the vessel base configured to be disposed within the reactant source cabinet; a lid coupled to a distal portion of the vessel base, the lid comprising one or more lid valves; a plurality of gas panel valves configured to deliver gas from a gas source to the vessel; a first heating element configured to heat the one or more lid valves; and a heat shield, a first portion of which is disposed between the one or more lid valves and the vessel base, and a second portion of which is disposed between the first heating element and the plurality of gas panel valves, the heat shield configured to impede a transfer of heat from the lid valve to the vessel base. 2. The system of claim 1 , further comprising a cooling element in thermal communication with a proximal portion of the vessel base, and configured to preferentially cool the proximal portion of the vessel base, thereby establishing a temperature gradient from the proximal portion to the distal portion of the vessel base. 3. The system of claim 2 , wherein the cooling element in conjunction with the first heating element maintains the one or more lid valves above a first threshold temperature without raising the vessel base above a second threshold temperature that is lower than the first threshold temperature. 4. The system of claim 1 , wherein the first portion of the heat shield comprises a first plate, and the second portion of the heath shield comprises a second plate, the first plate disposed at an angle to the second plate. 5. The system of claim 4 , wherein the first plate is disposed between the one or more lid valves and the vessel base, and wherein the second plate is disposed approximately parallel to an axis of the vessel base. 6. The system of claim 5 , further comprising a second heating element, the second heating element disposed such that the second plate is disposed between the one or more lid valves and the plurality of gas panel valves. 7. The system of claim 1 , wherein the heat shield is configured to impede a heat transfer to the vessel base such that a ratio of a rate of heat transfer from the first heating element to the one or more lid valves to a rate of heat transfer from the first heating element to the vessel base is greater than about 5. 8. The system of claim 1 , wherein the first portion of the heat shield is configured to be disposed between the one or more lid valves and at least a portion of the lid. 9. The system of claim 1 , wherein the first heating element is configured to maintain the one or more lid valves above a first threshold temperature without raising the vessel base above a second threshold temperature that is lower than the first threshold temperature. 10. The system of claim 1 , wherein each of the one or more lid valves comprises a respective filter configured to prevent a passage of particulate matter therethrough. 11. The system of claim 10 , wherein a porosity of at least one of the plurality of filters is configured to prevent a passage of the reactant therethrough below a threshold temperature and to allow a passage of the reactant therethrough above the threshold temperature.
Gas plumbing upstream of the reaction chamber · CPC title
by evaporation without using carrier gas in contact with the source material (C23C16/4486 takes precedence) · CPC title
characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials · CPC title
Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps · CPC title
by radiant heating of the substrate · CPC title
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