Resin composition and article made therefrom

Patent metadata

Field	Value
Publication number	US-11618820-B2
Application number	US-202017071322-A
Country	US
Kind code	B2
Filing date	Oct 15, 2020
Priority date	Sep 15, 2020
Publication date	Apr 4, 2023
Grant date	Apr 4, 2023

Abstract

A resin composition includes 80 parts by weight to 160 parts by weight of a vinyl-containing resin, 0.1 part by weight to 1.0 part by weight of a first compound and 0.1 part by weight to 2.0 parts by weight of a second compound; wherein the vinyl-containing resin includes a vinyl-containing polyphenylene ether resin, a maleimide resin, a bis(vinylphenyl)ethane, a triallyl isocyanurate, a vinyl-containing polyolefin resin or a combination thereof, the first compound includes a structure of Formula (1) to Formula (3) or a combination thereof, and the second compound includes a structure of Formula (4) to Formula (6) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

First claim

What is claimed is:

1. A resin composition, comprising 80 parts by weight to 160 parts by weight of a vinyl group-containing resin, 0.1 part by weight to 1.0 part by weight of a first compound and 0.1 part by weight to 2.0 parts by weight of a second compound;
wherein:
the vinyl group-containing resin comprises a vinyl group-containing polyphenylene ether resin, a maleimide resin, a bis(vinylphenyl)ethane, a triallyl isocyanurate or a combination thereof;
the first compound comprises a compound of Formula (1), a compound of Formula (2), a compound of Formula (3), or a combination thereof:

the second compound comprises a compound of Formula (4), a compound of Formula (5), a compound of Formula (6), or a combination thereof:

2. The resin composition of claim 1 , wherein the vinyl group-containing polyphenylene ether resin comprises a vinylbenzyl group-containing polyphenylene ether resin, a methacrylate group-containing polyphenylene ether resin, a chain-extended vinyl group-containing polyphenylene ether resin or a combination thereof.

3. The resin composition of claim 1 , characterized by not comprising a cycloolefin copolymer.

4. The resin composition of claim 1 , further comprising cyanate ester resin, active ester, hydrogenated polyolefin resin, vinylbenzyl-dicyclopentadiene phenylene ether, bis(vinylbenzyl)ether, divinylbenzene, triallyl cyanurate, 1,2,4-trivinyl cyclohexane, diallyl bisphenol A, styrene monomer, polystyrene, acrylate, epoxy resin, phenolic resin, benzoxazine resin, styrene maleic anhydride resin, amine curing agent, polyamide, polyimide, or a combination thereof.

5. The resin composition of claim 1 , further comprising flame retardant, inorganic filler, curing accelerator, polymerization inhibitor, solvent, silane coupling agent, surfactant, coloring agent, toughening agent, core-shell rubber, or a combination thereof.

6. An article made from the resin composition of claim 1 , comprising a prepreg, a resin film, a laminate or a printed circuit board.

7. The article of claim 6 , having a Z-axis coefficient of thermal expansion as measured by reference to IPC-TM-650 2.4.24.5 of less than or equal to 50 ppm/° C.

8. The article of claim 6 , having a Z-axis ratio of thermal expansion as measured by reference to IPC-TM-650 2.4.24.5 of less than or equal to 1.50%.

9. The article of claim 6 , having a 72-hour water absorption ratio as measured by reference to IPC-TM-650 2.6.2.1a of less than or equal to 0.30%.

10. The article of claim 6 , having a water absorption ratio after 5 hours of moisture absorption in a pressure cooking test as measured by reference to IPC-TM-650 2.6.16.1 of less than or equal to 0.50%.

11. The article of claim 6 , characterized by absence of delamination in a solder dip test conducted by reference to IPC-TM-650 2.4.23 after being subject to a pressure cooking test conducted by reference to IPC-TM-650 2.6.16.1.

12. The article of claim 6 , characterized by absence of weave exposure or branch-like pattern under visual inspection.

13. A resin composition, comprising 40 parts by weight of a vinyl group-containing polyphenylene ether resin, 0.1 part by weight to 1.0 part by weight of a first compound and 0.1 part by weight to 2.0 parts by weight of a second compound;
wherein:
the first compound comprises a compound of Formula (1), a compound of Formula (2), a compound of Formula (3), or a combination thereof:

the second compound comprises a compound of Formula (4), a compound of Formula (5), a compound of Formula (6), or a combination thereof:

14. The resin composition of claim 13 , wherein the vinyl group-containing polyphenylene ether resin comprises a vinylbenzyl group-containing polyphenylene ether resin, a methacrylate group-containing polyphenylene ether resin, a chain-extended vinyl group-containing polyphenylene ether resin or a combination thereof.

15. The resin composition of claim 13 , further comprising a maleimide resin, a bis(vinylphenyl)ethane, a triallyl isocyanurate, a vinyl group-containing polyolefin resin or a combination thereof in an amount of between 5 parts by weight and 120 parts by weight.

16. The resin composition of claim 15 , wherein the maleimide resin comprises 4,4′-diphenylmethane bismaleimide, oligomer of phenylmethane maleimide, bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide, 3,3′-dimethyl-5,5′-dipropyl-4,4′-diphenylmethane bismaleimide, m-phenylene bismaleimide, 4-methyl-1,3-phenylene bismaleimide, 1,6-bismaleimide-(2,2,4-trimethyl)hexane, N-2,3-xylylmaleimide, N-2,6-xylyl maleimide, N-phenylmaleimide, vinyl benzyl maleimide, maleimide resin containing aliphatic long chain structure, prepolymer of diallyl compound and maleimide resin, prepolymer of diamine and maleimide resin, prepolymer of multi-functional amine and maleimide resin, prepolymer of acid phenol compound and maleimide resin, or a combination thereof,
wherein the maleimide resin containing aliphatic long chain structure comprises:

wherein n=1 to 10;

wherein average n=1.3;

wherein n=1 to 10;

wherein m1=3 (average), m2=3 (average); or

wherein n=1 to 10.

17. The resin composition of claim 13 , characterized by not comprising a cycloolefin copolymer.

18. An article made from the resin composition of claim 13 , comprising a prepreg, a resin film, a laminate or a printed circuit board.

19. The article of claim 18 , having a Z-axis coefficient of thermal expansion as measured by reference to IPC-TM-650 2.4.24.5 of between 30 ppm/° C. and 50 ppm/° C.

20. The article of claim 18 , having a Z-axis ratio of thermal expansion as measured by reference to IPC-TM-650 2.4.24.5 of between 1.20% and 1.50%.

Assignees

• Elite Material Co Ltd

Inventors

• Hsu Ching-Hsien

Classifications

• C08L79/085 Primary

  Unsaturated polyimide precursors · CPC title

• C08L71/126

  modified by chemical after-treatment · CPC title

• C08G73/127

  containing oxygen in the form of ether bonds in the main chain · CPC title

• C08L71/123 Primary

  not modified by chemical after-treatment · CPC title

• C08L79/08

  Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title