Curable maleimide resin composition, adhesive, primer, chip coating agent, and semiconductor device
US-2024247128-A1 · Jul 25, 2024 · US
containing oxygen in the form of ether bonds in the main chain
containing oxygen in the form of ether bonds in the main chain · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G73/127 |
| Official title | {containing oxygen in the form of ether bonds in the main chain} |
| Display label | containing oxygen in the form of ether bonds in the main chain |
| Total patents | 93 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 3 |
| 2017 | 3 |
| 2018 | 7 |
| 2019 | 7 |
| 2020 | 6 |
| 2021 | 5 |
| 2022 | 13 |
| 2023 | 14 |
| 2024 | 20 |
| 2025 | 9 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Curable resin composition, semiconductor encapsulation material, adhesive, adhesive film, prepreg, interlayer insulating material, and printed-wiring board
US-2023416466-A1 · Dec 28, 2023 · US
Maleimide resin composition, prepreg, laminate, resin film, printed wiring board, and semiconductor package
US-2023391940-A1 · Dec 7, 2023 · US
High temperature benzoxazine resins, methods, and uses thereof
US-2023365730-A1 · Nov 16, 2023 · US
Provisional fixation material and method for producing electronic component
US-2023348767-A1 · Nov 2, 2023 · US
Poly(etherimide-phthalonitrile) adhesives and related methods
US-11795357-B2 · Oct 24, 2023 · US
Compositions and methods of additive manufacturing of aromatic thermoplastics and articles made therefrom
US-2023235187-A1 · Jul 27, 2023 · US
Material for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning process
US-11676814-B2 · Jun 13, 2023 · US
Poly(etherimide-phthalonitrile) adhesives and related methods
US-2023103527-A1 · Apr 6, 2023 · US
Resin composition and article made therefrom
US-11618820-B2 · Apr 4, 2023 · US
Compositions and methods of additive manufacturing of aromatic thermoplastics and articles made therefrom
US-11618832-B2 · Apr 4, 2023 · US
Resin sheet
US-2023097896-A1 · Mar 30, 2023 · US
Resin sheet
US-2023090587-A1 · Mar 23, 2023 · US
Resin sheet
US-2023064310-A1 · Mar 2, 2023 · US
Method for fabricating multiphenylethynyl-containing and lightly crosslinked polyimides capable of memorizing shapes and augmenting thermomechanical stability
US-11577448-B1 · Feb 14, 2023 · US
Multiphenylethynyl-Containing and Lightly Crosslinked Polyimides Capable of Memorizing Shapes and Augmenting Thermomechanical Stability
US-2022388222-A1 · Dec 8, 2022 · US
Lightly Crosslinked Polyimides with Phenylethynyl Pendants for Shape-Memory Effect and Programmed Enhancement in Tg and Modulus
US-2022388223-A1 · Dec 8, 2022 · US
Method for fabricating lightly crosslinked polyimides with phenylethynyl pendants for shape-memory effect and programmed enhancement in Tg and modulus
US-11504899-B1 · Nov 22, 2022 · US
Resin composition, laminate sheet, and multilayer printed wiring board
US-11377546-B2 · Jul 5, 2022 · US
Heat-curable maleimide resin composition
US-2022195096-A1 · Jun 23, 2022 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G73/127?
- CPC C08G73/127 is the Cooperative Patent Classification code for “containing oxygen in the form of ether bonds in the main chain.”
- How many patents are filed under CPC C08G73/127 (containing oxygen in the form of ether bonds in the main chain)?
- Our database includes 93 publications tagged with this CPC code.
- Is patent activity under CPC C08G73/127 growing?
- Publication counts under this code: 20 in 2024 vs 9 in 2025 (latest complete years).