Die pickup module and die bonding apparatus including the same

Patent metadata

Field	Value
Publication number	US-11600515-B2
Application number	US-202017002009-A
Country	US
Kind code	B2
Filing date	Aug 25, 2020
Priority date	Aug 27, 2019
Publication date	Mar 7, 2023
Grant date	Mar 7, 2023

Abstract

Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vacuum gripper for partially vacuum adsorbing a rear surface of the die picked up by the non-contact picker and an inverting driving unit for inverting the vacuum gripper to invert the die so that a rear surface of the die gripped by the vacuum gripper faces upward.

First claim

What is claimed is:

1. A die pickup module comprising:
a wafer stage for supporting a wafer including dies attached on a dicing tape;
a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape;
a non-contact picker for picking up the die from the dicing tape in a non-contact manner so as not to contact a front surface of the die;
a vacuum gripper for partially vacuum adsorbing a rear surface of the die picked up by the non-contact picker, the vacuum gripper including a gripper arm configured in a fork shape, the gripper arm including finger members each having a vacuum hole for vacuum adsorbing rear surface edge portions of the die; and
an inverting driving unit for inverting the vacuum gripper to invert the die gripped by the vacuum gripper.

2. The die pickup module of claim 1 ,
wherein the non-contact picker comprises an ultrasonic vibration unit for maintaining the die in a non-contact state using ultrasonic vibration.

3. The die pickup module of claim 2 ,
wherein the ultrasonic vibration unit comprises an ultrasonic vibrator for generating the ultrasonic vibration, a horn for transmitting the ultrasonic vibration and a vibration plate connected to the horn and vibrated by the ultrasonic vibration.

4. The die pickup module of claim 1 ,
wherein the non-contact picker comprises an ultrasonic vibration unit that provides repulsive force for pushing the die using ultrasonic vibration and a vacuum chuck that provides suction force to the die using vacuum pressure so that the die is maintained in a non-contact state.

5. The die pickup module of claim 4 ,
wherein the vacuum chuck is coupled to an end of the ultrasonic vibration unit and has vacuum holes for forming the suction force,
wherein the vacuum holes are connected to a vacuum pump through a vacuum line passing through the ultrasonic vibration unit.

6. The die pickup module of claim 4 ,
wherein the ultrasonic vibration unit comprises an ultrasonic vibrator for generating the ultrasonic vibration, a horn for transmitting the ultrasonic vibration and a vibration plate connected to the horn and vibrated by the ultrasonic vibration.

7. The die pickup module of claim 1 ,
wherein the non-contact picker comprises an ultrasonic vibration unit that provides repulsive force for pushing the die using ultrasonic vibration and a Bernoulli chuck that forms a flow of air on the die so that the die is maintained in a non-contact state and provides suction force to the die by using negative pressure generated by the flow of air.

8. The die pickup module of claim 7 ,
wherein the Bernoulli chuck has an air injection nozzle coupled to an end of the ultrasonic vibration unit and for forming the flow of air, and vacuum holes for sucking air injected from the air injection nozzle,
wherein the air injection nozzle is connected to an air supplying unit for supplying the air through an air line passing through the ultrasonic vibration unit.

9. The die pickup module of claim 7 ,
wherein the ultrasonic vibration unit comprises an ultrasonic vibrator for generating the ultrasonic vibration, a horn for transmitting the ultrasonic vibration and a vibration plate connected to the horn and vibrated by the ultrasonic vibration.

10. The die pickup module of claim 1 ,
wherein the gripper arm comprises a pair of gripper arms for vacuum adsorbing rear surface edge portions of the die and a gripper driving unit for moving the gripper arms in a direction closer to each other and a direction away from each other.

11. The die pickup module of claim 10 further comprising,
a vertical driving unit mounted on the gripper driving unit and for moving the non-contact picker in a vertical direction to pick up the die.

12. The die pickup module of claim 1 further comprising,
a vertical driving unit for moving the non-contact picker in a vertical direction to pick up the die; and
a horizontal driving unit for moving the vacuum gripper in a horizontal direction to receive the die picked up by the non-contact picker.

13. The die pickup module of claim 1 ,
wherein the die ejector comprises ejector members arranged in a telescope shape and an ejector driving unit for simultaneously raising the ejector members and sequentially descending the ejector members one by one from outside to inside.

14. The die pickup module of claim 13 ,
wherein the ejector driving unit comprises,
disk-shaped flanges formed at a lower end of the ejector members in a horizontal direction, arranged in a vertical direction, and having a diameter gradually increasing upward;
a driving head arranged in a lower portion of the flanges and having circular ring-shaped upper surfaces respectively facing lower surfaces of the flanges;
a head driving unit for rotating the driving head; and
cam followers mounted in a lower portion of the flanges and placed on upper surfaces of the driving head,
wherein the upper surfaces of the driving head include first inclined surfaces for simultaneous raise of the ejector members and second inclined surfaces for sequential descend of the ejector members.

15. The die pickup module of claim 13 ,
wherein the die ejector further comprises stopper members for maintaining a gap between the ejector members.

16. The die pickup module of claim 13 ,
wherein the die ejector further comprises a hood having an opening, into which the ejector members are inserted, and vacuum holes for vacuum adsorbing the dicing tape, and an ejector body coupled to the hood and in a cylinder shape with a closed lower portion.

17. A die pickup module comprising:
a wafer stage for supporting a wafer including dies attached on a dicing tape;
a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape;
a non-contact picker for picking up the die from the dicing tape in a non-contact manner so as not to contact a front surface of the die;
a vacuum gripper for partially vacuum adsorbing a rear surface of the die picked up by the non-contact picker; and
an inverting driving unit for inverting the vacuum gripper to invert the die gripped by the vacuum gripper,
wherein the die ejector comprises ejector members arranged in a telescope shape and an ejector driving unit for simultaneously raising the ejector members and sequentially descending the ejector members one by one from outside to inside,
wherein the ejector driving unit comprises,
disk-shaped flanges formed at a lower end of the ejector members in a horizontal direction, arranged in a vertical direction, and having a diameter gradually increasing upward;
a driving head arranged in a lower portion of the flanges and having circular ring-shaped upper surfaces respectively facing lower surfaces of the flanges;
a head driving unit for rotating the driving head; and
cam followers mounted in a lower portion of the flanges and placed on upper surfaces of the driving head,

wherein the upper surfaces of the driving head include first inclined surfaces for simultaneous raise of the ejector members and second inclined surfaces for sequential descend of the ejector members, and
wherein the driving head comprises a permanent magnet for providing magnetic force so that the cam followers are in close contact with upper surfaces of the driving head.

18. A die bonding apparatus comprising:
a die pickup module for picking up a die to be picked up from a wafer including dies attached on a dicing tape and inverting the picked up die; and
a die bonding module for bonding a die inverted by the di

Assignees

• Semes Co Ltd
• Samsung Electronics Co Ltd

Inventors

• Jeong Chang Bu
• Lee Min Gu
• Choi Eui Sun
• Lee Kang San
• Min Dae Ho
• Seok Seung Dae

Classifications

• H10P72/7604

  the wafers being placed on a susceptor, stage or support · CPC title

• H10P72/14

  Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls · CPC title

• H10P72/78 Primary

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title

• H10P72/0442 Primary

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title