Die pickup module and die bonding apparatus including the same
US-12090642-B2 · Sep 17, 2024 · US
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Choi Eui Sun patents
Choi Eui Sun is listed as an inventor on 5 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Choi Eui Sun |
| Total patents | 5 |
| First publication | Feb 1, 2018 |
| Latest publication | Sep 17, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of operating bill transport path switching device in atm
US-2023316844-A1 · Oct 5, 2023 · US
Die pickup module and die bonding apparatus including the same
US-11600515-B2 · Mar 7, 2023 · US
Worn banknote identification method and ATM using the same
US-10318802-B2 · Jun 11, 2019 · US
Worn banknote identification method and atm using the same
US-2018032805-A1 · Feb 1, 2018 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Semes Co Ltd | 2 |
| Samsung Electronics Co Ltd | 2 |
| Nautilus Hyosung Inc | 2 |
| Hyosung Tns Inc | 2 |
| Industry-Academic Cooperation Foundation Yonsei Univ | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/78 | 2 |
| H10P72/0446 | 2 |
| H10P72/0442 | 2 |
| H10P72/7402 | 2 |
| H10P72/3206 | 2 |