Semiconductor package

Patent metadata

Field	Value
Publication number	US-11569175-B2
Application number	US-202117239141-A
Country	US
Kind code	B2
Filing date	Apr 23, 2021
Priority date	Aug 25, 2020
Publication date	Jan 31, 2023
Grant date	Jan 31, 2023

Abstract

A semiconductor package includes a redistribution substrate including a first redistribution layer; a semiconductor chip electrically connected to the first redistribution layer; a vertical connection structure adjacent a periphery of the semiconductor chip and electrically connected to the first redistribution layer; and an encapsulant on the vertical connection structure. The vertical connection structure includes a metal pillar having a bottom surface facing the redistribution substrate, a top surface positioned opposite to the bottom surface, and a side surface positioned between the bottom surface and the top surface. The vertical connection structure further includes a plating layer on each of the bottom surface, the top surface, and the side surface of the metal pillar, and having a roughened surface.

First claim

What is claimed is:

1. A semiconductor package comprising:
a redistribution substrate comprising a first redistribution layer;
a semiconductor chip on the redistribution substrate and electrically connected to the first redistribution layer;
a vertical connection structure adjacent a periphery of the semiconductor chip on the redistribution substrate and electrically connected to the first redistribution layer;
an encapsulant on the redistribution substrate, the semiconductor chip, and the vertical connection structure;
a redistribution structure on the encapsulant and comprising a second redistribution layer electrically connected to the vertical connection structure; and
a connection bump on the redistribution substrate opposite to the semiconductor chip and electrically connected to the first redistribution layer,
wherein the vertical connection structure comprises:
a metal pillar having a bottom surface facing the redistribution substrate, a top surface opposite to the bottom surface, and a side surface between the bottom surface and the top surface; and
a plating layer having a roughened surface on each of the bottom surface, the top surface, and the side surface of the metal pillar, wherein the bottom surface is in electrical contact with the first redistribution layer.

2. The semiconductor package of claim 1 , wherein the roughened surface of the plating layer has a surface roughness of about 0.5 μm or more.

3. The semiconductor package of claim 1 , wherein the roughened surface of the plating layer is in direct contact with the encapsulant.

4. The semiconductor package of claim 1 , wherein the redistribution substrate further comprises at least one first insulating layer between the first redistribution layer and the semiconductor chip and between the first redistribution layer and the vertical connection structure, and wherein a bottom of the plating layer comprising the roughened surface directly contacts the at least one first insulating layer of the redistribution substrate, the bottom of the plating layer extending between the bottom surface of the metal pillar and the at least one first insulating layer.

5. The semiconductor package of claim 1 , wherein the metal pillar has a circular or polygonal cross-sectional shape in a direction parallel to an upper surface of the redistribution substrate, and the plating layer continuously extends along a perimeter of the cross-sectional shape of the metal pillar.

6. The semiconductor package of claim 1 , wherein the metal pillar has a tapered shape in which a lower portion thereof that is adjacent to the redistribution substrate is wider than an upper portion thereof.

7. The semiconductor package of claim 1 , wherein the redistribution structure further comprises a redistribution via extending through a part of the encapsulant covering an upper portion of the vertical connection structure to electrically connect the second redistribution layer to the vertical connection structure, and wherein a top of the plating layer is in contact with the redistribution via, the top of the plating layer extending on the top surface of the metal pillar.

8. The semiconductor package of claim 7 , wherein the redistribution structure further comprises a second insulating layer between the second redistribution layer and the encapsulant, and the redistribution via extends through the second insulating layer and the encapsulant to electrically connect the second redistribution layer to the vertical connection structure.

9. The semiconductor package of claim 1 , wherein the encapsulant comprises an opening on a top surface of the vertical connection structure, and
the redistribution structure further comprises a second insulating layer between the second redistribution layer and the encapsulant and extending into the opening of the encapsulant, and a redistribution via extending through the second insulating layer in the opening to electrically connect the second redistribution layer to the vertical connection structure.

10. A semiconductor package comprising:
a redistribution substrate comprising a first redistribution layer;
a core structure on the redistribution substrate and comprising a first through-hole and at least one second through-hole adjacent a periphery of the first through-hole;
a semiconductor chip in the first through-hole of the core structure and electrically connected to the first redistribution layer;
at least one vertical connection structure in the at least one second through-hole of the core structure and electrically connected to the first redistribution layer;
an encapsulant on the redistribution substrate, the semiconductor chip, the core structure, and the at least one vertical connection structure; and
a redistribution structure on the encapsulant and comprising a second redistribution layer electrically connected to the at least one vertical connection structure,
wherein the at least one vertical connection structure comprises a metal pillar extending in a vertical direction and a first plating layer on a surface of the metal pillar,
the core structure comprises a metal frame adjacent a periphery of the semiconductor chip and the at least one vertical connection structure, and a second plating layer on a surface of the metal frame, wherein the first and second through-holes extend through the metal frame such that the metal frame extends around a periphery of the semiconductor chip, and
each of the first and second plating layers comprises a respective roughened surface.

11. The semiconductor package of claim 10 , wherein the surface of the metal pillar having the first plating layer with the roughened surface thereon comprises a top surface and a bottom surface of the metal pillar, and the surface of the metal frame having the second plating layer with the roughened surface thereon comprises a top surface and a bottom surface of the metal frame.

12. The semiconductor package of claim 10 , wherein the respective roughened surface of each of the first and second plating layers has a surface roughness of about 0.5 μm or more.

13. The semiconductor package of claim 10 , wherein the metal pillar and the metal frame comprise a same first metal material, and
the first and second plating layers comprise a same second metal material.

14. The semiconductor package of claim 10 , wherein each of the core structure and the at least one vertical connection structure has a tapered shape in which a lower portion thereof that is adjacent to the redistribution substrate is wider than an upper portion thereof.

15. The semiconductor package of claim 10 , wherein respective portions of the encapsulant substantially fill a first space between the first through-hole and the semiconductor chip, and a second space between the at least one second through-hole and the at least one vertical connection structure, and wherein the first and second plating layers are in direct contact with the respective portions of the encapsulant.

16. The semiconductor package of claim 10 , wherein the core structure is electrically insulated from the vertical connection structure.

17. The semiconductor package of claim 10 , wherein the first redistribution layer comprises a ground pattern, a signal pattern, and a power pattern, and wherein the core structure is electrically connected to the ground pattern of the first redistribution layer.

18. A semiconductor package comprising:
a redistribution substrate comprising a redistribution layer;
a semiconductor chip on the redistribution substrate and electrically connected to

Assignees

• Samsung Electronics Co Ltd

Inventors

• Mun Kyungdon
• Kang Myungsam
• Ko Youngchan
• Kwon Yieok
• Kim Jeongseok
• Lee Gongje
• Cho Bongju

Classifications

• H01L23/49833

  Electricity · mapped topic

• H01L23/49822

  Electricity · mapped topic

• H01L24/08

  Electricity · mapped topic

• H01L25/0657

  Electricity · mapped topic

• H01L2224/73204

  Electricity · mapped topic