Plating method, insoluble anode for plating, and plating apparatus
US-12157951-B2 · Dec 3, 2024 · US
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Owatari Akira patents
Owatari Akira is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Owatari Akira |
| Total patents | 2 |
| First publication | Jul 21, 2022 |
| Latest publication | Dec 3, 2024 |
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ebara Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/47 | 2 |
| H10W20/0245 | 2 |
| H10W20/0261 | 2 |
| H10W20/023 | 2 |
| C25D21/12 | 2 |