Support frame with integrated thermal management features

Patent metadata

Field	Value
Publication number	US-9547344-B2
Application number	US-201414197662-A
Country	US
Kind code	B2
Filing date	Mar 5, 2014
Priority date	Mar 5, 2014
Publication date	Jan 17, 2017
Grant date	Jan 17, 2017

Abstract

This invention describes a novel solution to providing heat redistribution and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing components in the computing device is absorbed by heat management features integrated within a supporting mid-frame. Liquid (e.g., coolants) contained in the portion of the heat management features most proximate to the processing components evaporates due to the absorbed heat, and is conducted (via convection) towards the other end of the heat management features, where the temperature is cooler. Once sufficiently cooled, the evaporated coolant condenses back into liquid form and flows back towards the other end of the heat management features.

First claim

What is claimed is:

1. A mobile computing device, comprising:
a front panel comprising a display panel;
a back panel;
a mid-frame comprising a plurality of integrated thermal management structures encased by the mid-frame, the mid-frame being configured to provide mechanical support for the mobile computing device and disposed between the front panel and the back panel; and
a printed circuit board (PCB) disposed between at least a portion of the front panel and at least a portion of the mid-frame, the PCB comprising a plurality of components including at least one processor, wherein the plurality of integrated thermal management structures comprise:
a plurality of vapor chambers each surrounded by a respective chamber configured to contain at least one of a sintering powder or a wick structure having a plurality of grooves such that the at least one of the sintering powder or the wick structure contact a respective exterior portion of each of the vapor chambers;
a first region of the mid-frame configured to be proximate to a heat source; and
a second region of the mid-frame, wherein the mid-frame is configured to contain a liquid coolant, wherein the mid-frame is configured for a portion of the liquid coolant evaporated by heat absorbed from the heat source to be condensed in the second region of the mid-frame, wherein the mid-frame is further configured for a condensed portion of the liquid coolant to flow from the second region of the mid-frame to the first region of the mid-frame.

2. The mobile computing device according to claim 1 , wherein the mobile computing device comprises at least one device from the group consisting of:
a smart phone;
a tablet;
a personal data assistant;
a video game console;
a netbook;
a laptop computer; and
a portable media player.

3. The mobile computing device according to claim 1 , wherein the plurality of components comprises at least one component from the group consisting of:
a central processing unit (CPU);
a graphics processing unit (GPU);
an application processor (AP);
a flash memory device; and
a power amplifier device.

4. The mobile computing device of claim 1 , wherein a plurality of thermal management structures are configured such that the condensed portion of the liquid coolant flows from the second region of the mid-frame to the first region of the mid-frame once the liquid condenses due to capillary action caused by the wick structure of the plurality of thermal management structures.

5. The mobile computing device of claim 4 , wherein the first region of the mid-frame is operable to have a higher temperature than the second region of the mid-frame.

6. The mobile computing device of claim 4 , wherein the first region of the mid-frame is disposed in a portion of the mid-frame with a greater proximity to the PCB than the second region of the mid-frame.

7. The mobile computing device of claim 1 , wherein the liquid coolant comprises deionized water.

8. The mobile computing device of claim 1 , wherein the plurality of thermal management structures are comprised of a material with high thermal conductivity.

9. The mobile computing device of claim 1 , wherein the mid-frame comprises a metal frame.

10. The mobile computing device of claim 9 , wherein the wick structure is comprised of a different material than the metal frame comprising the mid-frame.

11. The mobile computing device of claim 9 , wherein the wick structure is comprised of the same material as the metal frame comprising the mid-frame.

12. A mobile computing device comprising:
a front panel comprising a lens device and a display panel;
a back panel;
a mid-frame disposed between the front panel and the back panel, the mid-frame comprising a plurality of integrated heat pipes and being configured to provide mechanical support for the mobile computing device, wherein the plurality of integrated heat pipes are encased within the mid-frame and comprise a plurality of vapor chambers, each vapor chamber surrounded by a chamber configured to contain a sintering powder that contacts an exterior of the vapor chamber;
a battery disposed between at least a portion of the mid-frame and at least a portion of the back panel;
a plurality of shield layers disposed between a second portion of the mid-frame and a second portion of the back panel;
a printed circuit board (PCB) disposed between the plurality of shield layers, the PCB comprising a plurality of components including at least one processor;
a back cover disposed between the second portion of the back panel and the PCB.

13. The mobile computing device of claim 12 , wherein the plurality of vapor chambers are configured to redistribute heat produced by the plurality of the components of the PCB by causing a portion of a coolant comprised the plurality of vapor chambers to:
evaporate in a portion of the plurality of vapor chambers having a higher temperature;
condense in a portion of the plurality of vapor chambers having a lower temperature; and
flow back to the first portion of the plurality of vapor chambers as a condensed liquid.

14. An apparatus for providing thermal management, the apparatus comprising:
a metal frame configured to provide mechanical support;
a plurality of thermal management structures integrated within an interior of the metal frame, wherein the plurality of thermal management structures comprise:
a plurality of vapor chambers each surrounded by a respective chamber configured to contain at least one of a sintering powder or a wick structure having a plurality of grooves such that the at least one of the sintering powder or the wick structure contact a respective exterior portion of each of the vapor chambers;
a first region of the metal frame configured to be proximate to a heat source; and
a second region of the metal frame, wherein the metal frame is configured to contain a liquid coolant, wherein the metal frame is configured for a portion of the liquid coolant is evaporated by heat absorbed from the heat source to be condensed in the second region of the metal frame, wherein the metal frame is further configured for a condensed portion of the liquid coolant to flow from the second region of the metal frame to the first region of the metal frame.

Assignees

• Futurewei Technologies Inc

Inventors

• Han Qian

Classifications

• H05K7/20336

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• G06F1/203 Primary

  for portable computers, e.g. for laptops · CPC title

• G06F1/1656

  Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

• G06F2200/201

  Cooling arrangements using cooling fluid · CPC title