Flexible light emitting device comprising a polyimide resin

US11557697B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11557697-B2
Application numberUS-202117405547-A
CountryUS
Kind codeB2
Filing dateAug 18, 2021
Priority dateJul 10, 2008
Publication dateJan 17, 2023
Grant dateJan 17, 2023

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

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An object is to provide a highly reliable light emitting device which is thin and is not damaged by external local pressure. Further, another object is to manufacture a light emitting device with a high yield by preventing defects of a shape and characteristics due to external stress in a manufacture process. A light emitting element is sealed between a first structure body in which a fibrous body is impregnated with an organic resin and a second structure body in which a fibrous body is impregnated with an organic resin, whereby a highly reliable light emitting device which is thin and has intensity can be provided. Further, a light emitting device can be manufactured with a high yield by preventing defects of a shape and characteristics in a manufacture process.

First claim

Opening claim text (preview).

The invention claimed is: 1. A flexible light emitting device comprising: a layer comprising a polyimide resin; a first insulating layer over the layer comprising the polyimide resin, the first insulating layer comprising a second insulating layer and a third insulating layer; a transistor over the first insulating layer, the transistor comprising a first gate electrode and a second gate electrode overlapping with a semiconductor layer; a gate insulating layer between the semiconductor layer and the second gate electrode; a fourth insulating layer over the second gate electrode, the fourth insulating layer comprising a first opening; a fifth insulating layer over the fourth insulating layer, the fifth insulating layer comprising a second opening overlapping with the first opening; a sixth insulating layer over the fifth insulating layer; a first electrode of a light emitting element over the sixth insulating layer; a seventh insulating layer having a curved surface; an EL layer over the first electrode and in contact with the curved surface; and a second electrode over the EL layer, wherein the seventh insulating layer covers a side surface of the first electrode, wherein the semiconductor layer comprises crystalline silicon, wherein the seventh insulating layer overlaps with the second gate electrode, and wherein the first opening and the second opening overlap with the semiconductor layer. 2. A flexible light emitting device comprising: a layer comprising a polyimide resin; a first insulating layer over the layer comprising the polyimide resin, the first insulating layer comprising a second insulating layer comprising silicon oxide and a third insulating layer comprising silicon nitride; a transistor over the first insulating layer, the transistor comprising a first gate electrode and a second gate electrode overlapping with a semiconductor layer in which a channel is formed; a gate insulating layer between the semiconductor layer and the second gate electrode, the gate insulating layer comprising silicon oxide; a fourth insulating layer over the second gate electrode, the fourth insulating layer comprising a first opening and any one of silicon oxide and silicon nitride; a fifth insulating layer over the fourth insulating layer, the fifth insulating layer comprising a second opening overlapping with the first opening and any one of silicon oxide and silicon nitride; a sixth insulating layer over the fifth insulating layer, the sixth insulating layer comprising an organic material; a first electrode of a light emitting element over the sixth insulating layer, the first electrode comprising an indium tin oxide; a seventh insulating layer having a curved surface; an EL layer over the first electrode and in contact with the curved surface; and a second electrode over the EL layer, wherein the seventh insulating layer covers a side surface of the first electrode, and wherein the semiconductor layer comprises crystalline silicon. 3. A flexible light emitting device comprising: a layer comprising a polyimide resin; a first insulating layer over the layer comprising the polyimide resin, the first insulating layer comprising a second insulating layer comprising silicon oxide and a third insulating layer comprising silicon nitride; a transistor over the first insulating layer, the transistor comprising a first gate electrode and a second gate electrode overlapping with a semiconductor layer in which a channel is formed; a gate insulating layer between the semiconductor layer and the second gate electrode, the gate insulating layer comprising silicon oxide; a fourth insulating layer over the second gate electrode, the fourth insulating layer comprising a first opening and any one of silicon oxide and silicon nitride; a fifth insulating layer over the fourth insulating layer, the fifth insulating layer comprising a second opening overlapping with the first opening and any one of silicon oxide and silicon nitride; a sixth insulating layer over the fifth insulating layer, the sixth insulating layer comprising an organic material; a first electrode of a light emitting element over the sixth insulating layer, the first electrode comprising an indium tin oxide; a seventh insulating layer having a curved surface; an EL layer over the first electrode and in contact with the curved surface; and a second electrode over the EL layer, wherein the seventh insulating layer covers a side surface of the first electrode, wherein the semiconductor layer comprises crystalline silicon, wherein an end portion of the seventh insulating layer extends beyond an end portion of the semiconductor layer, and wherein the end portion of the seventh insulating layer overlaps with the first electrode. 4. The flexible light emitting device according to claim 1 , wherein the transistor is electrically connected to the light emitting element. 5. The flexible light emitting device according to claim 2 , wherein the transistor is electrically connected to the light emitting element. 6. The flexible light emitting device according to claim 3 , wherein the transistor is electrically connected to the light emitting element. 7. The flexible light emitting device according to claim 1 , further comprising a second layer comprising a polyimide resin. 8. The flexible light emitting device according to claim 2 , further comprising a second layer comprising a polyimide resin. 9. The flexible light emitting device according to claim 3 , further comprising a second layer comprising a polyimide resin.

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What does patent US11557697B2 cover?
An object is to provide a highly reliable light emitting device which is thin and is not damaged by external local pressure. Further, another object is to manufacture a light emitting device with a high yield by preventing defects of a shape and characteristics due to external stress in a manufacture process. A light emitting element is sealed between a first structure body in which a fibrous b…
Who is the assignee on this patent?
Semiconductor Energy Lab
What technology area does this patent fall under?
Primary CPC classification H01L33/44. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 17 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 11 related publications on this page (citations in our corpus or others sharing the same primary CPC).