Group III-V semiconductor structures having crystalline regrowth layers and methods for forming such structures

Patent metadata

Field	Value
Publication number	US-11515410-B2
Application number	US-202017085171-A
Country	US
Kind code	B2
Filing date	Oct 30, 2020
Priority date	Oct 30, 2020
Publication date	Nov 29, 2022
Grant date	Nov 29, 2022

Abstract

A Group III-V semiconductor structure having a semiconductor device. The semiconductor device has a source and drain recess regions extending through a barrier layer and into a channel layer. A regrown, doped Group III-V ohmic contact layer is disposed on and in direct contact with the source and drain recess regions. A gate electrode is disposed in a gap in the regrown, doped Group III-V ohmic contact layer and on the barrier layer A dielectric structure is disposed over the ohmic contact layer and over the barrier layer and extending continuously from a region over the source recess region to one side of the stem to portion and then extending continuously from an opposite side of the stem portion to a region over the drain recess region, a portion of the dielectric structure being in contact with the stem portion and the barrier layer.

First claim

What is claimed is:

1. A semiconductor device, comprising:
an epitaxial group III-V channel layer;
an epitaxial Group III-V barrier layer disposed over the channel layer;
a source recess region and drain recess region extending vertically through the barrier layer and into the channel layer;
a doped Group III-V ohmic contact layer disposed directly on bottom and inner sidewalls of the source recess and the drain recess, the doped ohmic contact layer being of the same material as the channel layer, the doped ohmic contact layer having a portion extending horizontally on the barrier layer and having a gap therein between the source recess and the drain recess;
a gate electrode disposed in the gap and on the barrier layer, the gate electrode having a lower, vertically extending stem portion; and
a dielectric structure disposed over the ohmic contact layer and over the barrier layer and extending continuously from a region over the source recess to one side of the stem portion and then extending continuously from an opposite side of the stem portion to a region over the drain recess, a first portion of the dielectric structure being in contact with the stem portion and the barrier layer, a second portion of the dielectric structure within the source recess and the drain recess.

2. The semiconductor device recited in claim 1 wherein the dielectric structure includes: a first dielectric layer disposed on and extending over the horizontally extending ohmic contact layer and being in contact with the stem portion; and a second dielectric layer disposed on the first dielectric layer and of a material different from the first dielectric layer and in contact with the stem portion and the bottom of a horizontal portion of the gate electrode.

3. The semiconductor device recited in claim 1 wherein the dielectric structure comprises:
a first dielectric layer;
a second dielectric layer; and
a third dielectric layer;
wherein the first dielectric layer is disposed on and extends over the horizontally extending ohmic contact layer and is in contact with the third dielectric layer,
wherein the third dielectric layer is in contact with the stem portion, and
wherein the second dielectric layer is disposed on the first and third dielectric layers and has a material different from the first dielectric layer and is in contact with the stem portion and the bottom of the horizontal portion of the gate electrode.

4. The semiconductor device recited in claim 1 wherein the dielectric structure is disposed on the barrier layer and is in contact with sides of the stem portion and under, and in contact with a bottom portion of a horizontal portion, the bottom portion of the horizontal portion being at a vertical elevation higher than a top surface of the horizontally extending portion of the ohmic contact layer.

5. The semiconductor device recited in claim 1 wherein the doped Group III-V ohmic contact layer in contact with the source and drain recesses and the barrier layer and a field region is single crystal material.

6. The semiconductor device recited in claim 1 wherein, a portion of the doped Group III-V ohmic contact layer in direct contact with a portion of the dielectric structure is polycrystal while a portion of the group III-V ohmic contact layer in the source and drain recesses is single crystal.

7. The semiconductor device recited in claim 1 wherein the channel layer and the doped Group III-V ohmic contact layer comprise GaN.

8. The semiconductor device recited in claim 2 wherein the barrier layer comprises Al x Ga 1-x N where x is between 0 and 1.

9. The semiconductor device recited in claim 2 wherein the barrier layer comprises Sc y Al 1-y N where y is between 0 and 0.5.

10. The semiconductor device recited in claim 1 wherein, a portion of the doped Group III-V ohmic contact layer in direct contact with a portion of the dielectric structure and in the source and drain regions is polycrystal.

11. The semiconductor device recited in claim 1 wherein the doped Group III-V ohmic contact layer comprises AlN.

12. The semiconductor device recited in claim 1 wherein the doped Group III-V ohmic contact layer comprises InN.

13. The semiconductor device recited in claim 1 wherein the barrier layer comprises Al x Ga 1-x N where x is between 0 and 1.

14. The semiconductor device recited in claim 1 wherein the barrier layer comprises Sc y Al 1-y N.

15. The semiconductor device recited in claim 1 wherein the barrier layer comprises B x Al 1-x N.

16. The semiconductor device recited in claim 1 wherein the barrier layer comprises Sc y Al i-y N, where y is ≥0.18.

Assignees

• Raytheon Co

Inventors

• Laroche Jeffrey R
• Ip Kelly P
• Kazior Thomas E
• Chumbes Eduardo M

Classifications

• H10W74/137

  the encapsulations being directly on the semiconductor body (H10W74/134 takes precedence) · CPC title

• H10W74/134

  the encapsulations being in grooves in the semiconductor body · CPC title

• H10D64/0125

  characterised by the sectional shape, e.g. T or inverted T · CPC title

• H01L29/7787 Primary

  Electricity · mapped topic

• H01L29/0843

  Electricity · mapped topic