Low-power-consumption audio/video recording and communication doorbell
US-2017272652-A1 · Sep 21, 2017 · US
Housing for an optoelectronic device, and method for producing same, and lid for a housing
US11515221B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11515221-B2 |
| Application number | US-201816001323-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 6, 2018 |
| Priority date | Jun 6, 2017 |
| Publication date | Nov 29, 2022 |
| Grant date | Nov 29, 2022 |
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- Title
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Abstract
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The invention relates to a housing for an optoelectronic device and to a method for producing such a housing. For producing a lid for the housing, an infrared-transparent material is used, into which at least one glass window is integrated.
First claim
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What is claimed is: 1. A housing for at least one electronic device, the housing including a base part, wherein the base part includes a first mounting area for the at least one electronic device, the housing further including a lid made of a material that is transparent to infrared radiation, wherein the lid made of material that is transparent to infrared radiation has at least one glass window integrated therein, wherein the lid is connected to the base part so as to hermetically seal the housing, wherein the material that is transparent to infrared radiation has an average transmittance of more than 40% across an entire wavelength range between 1.5 μm to 5 μm. 2. The housing as claimed in claim 1 , wherein the at least one glass window is transparent to at least one of UV radiation and visible light. 3. The housing as claimed in claim 1 , wherein the lid made of an infrared radiation transparent material is made of silicon, aluminum oxide, in particular sapphire, or germanium. 4. The housing as claimed in claim 1 , wherein the at least one glass window is made of a glass having a coefficient of mean linear thermal expansion (α) at 20 to 300° C. of 2 to 5 ppm/K. 5. The housing as claimed in claim 1 , wherein the at least one glass window, at 20° C., is under a stress ranging between −100 MPa of compressive stress and +30 MPa of tensile stress. 6. The housing as claimed in claim 1 , wherein the at least one glass window is made of a glass having a coefficient of mean linear thermal expansion (α) at 20 to 300° C. of 3 to 5 ppm/K and a glass transition temperature (Tg) between 300 and 600° C. 7. The housing as claimed in claim 1 , wherein the at least one glass window has been integrated into the lid by fusing. 8. The housing as claimed in claim 1 , wherein the first mounting area is arranged under a portion of the lid made of material that is transparent to infrared radiation and the housing further includes a second mounting area arranged under the at least one glass window. 9. The housing as claimed in claim 1 , wherein the at least one glass window is made of borosilicate glass. 10. A housing for at least one electronic device, the housing including a base part, wherein the base part includes a mounting area for the at least one electronic device, the housing further including a lid made of a material that is transparent to infrared radiation, wherein the lid made of material that is transparent to infrared radiation has at least one glass window integrated therein, wherein the lid is connected to the base part so as to hermetically seal the housing, wherein the lid is made of an infrared radiation transparent material selected from a group consisting of silicon, aluminum oxide, sapphire, germanium, and mixtures thereof, wherein the at least one glass window is transparent to at least one of UV radiation or visible light. 11. A housing for at least one electronic device, the housing including a base part, wherein the base part includes a mounting area for the at least one electronic device, the housing further including a lid, wherein the lid has a plurality of windows integrated therein that are made of a material transparent to a first range of wavelengths of light and the lid is transparent to a second range of wavelengths of light that differs from the first range of wavelengths of light, wherein the lid is connected to the base part so as to hermetically seal the housing, wherein the lid is made of an infrared radiation transparent material selected from a group consisting of silicon, aluminum oxide, sapphire, germanium, and mixtures thereof.
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Frequently asked questions
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- What does patent US11515221B2 cover?
- The invention relates to a housing for an optoelectronic device and to a method for producing such a housing. For producing a lid for the housing, an infrared-transparent material is used, into which at least one glass window is integrated.
- Who is the assignee on this patent?
- Schott Ag
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 29 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).