Hermetic solution for thermal and optical sensor-in-package

Patent metadata

Field	Value
Publication number	US-9564569-B1
Application number	US-201514977932-A
Country	US
Kind code	B1
Filing date	Dec 22, 2015
Priority date	Jul 10, 2015
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

A sensor-in-package device, a process for fabricating a hermetically-sealed sensor-in-package device, and a process for fabricating a hermetically-sealed sensor-in-package device with a pre-assembled hat that employ example techniques in accordance with the present disclosure are described herein. In an implementation, the sensor-in-package device includes a substrate; at least one thermopile, at least one photodetector, at least one light-emitting diode, an ultraviolet light sensor, and a pre-assembled hat disposed on the first side of the substrate, where the pre-assembled hat includes a body; a first lid; and a second lid; where the body, the substrate, and the first lid define a thermopile cavity that houses the at least one thermopile, and where the body, the substrate, and the second lid define an optical cavity that houses at least one of the at least one photodetector, the at least one light-emitting diode, or the ultraviolet light sensor.

First claim

What is claimed is:

1. A sensor-in-package device, comprising:
a substrate having a first side and a second side;
at least one thermopile disposed on the first side of the substrate;
at least one photodetector disposed on the first side of the substrate;
at least one light-emitting diode disposed on the first side of the substrate;
an ultraviolet light sensor disposed on the first side of the substrate; and
a pre-assembled hat disposed on the first side of the substrate, where the pre-assembled hat includes
a body;
a first lid; and
a second lid;

where the body, the substrate, and the first lid define a thermopile cavity that houses the at least one thermopile, and where the body, the substrate, and the second lid define an optical cavity that houses at least one of the at least one photodetector, the at least one light-emitting diode, or the ultraviolet light sensor.

2. The sensor-in-package device in claim 1 , wherein the substrate is a ceramic substrate.

3. The sensor-in-package device in claim 1 , where the pre-assembled hat includes a ceramic body.

4. The sensor-in-package device in claim 1 , where the first lid includes a silicon lid.

5. The sensor-in-package device in claim 1 , where the second lid includes a glass lid.

6. The sensor-in-package device in claim 5 , wherein the glass lid includes a metallized glass lid.

7. The sensor-in-package device in claim 1 , where the pre-assembled hat includes a metallized track disposed between the ceramic body and at least one of the silicon lid or the glass lid.

8. The sensor-in-package device in claim 1 , wherein the thermopile cavity includes a hermetic seal.

9. The sensor-in-package device in claim 1 , wherein the optical cavity includes a hermetic seal.

10. The sensor-in-package device in claim 9 , further comprising:
a second hermetically-sealed optical cavity that includes a light-emitting diode.

11. The sensor-in-package device in claim 1 , further comprising:
at least one of an application-specific integrated circuit coupled to the second side of the ceramic substrate, a surface mount device coupled to the second side of the ceramic substrate, or at least one solder connection coupled to the second side of the ceramic substrate.

12. A process for fabricating a hermetically-sealed sensor-in-package device, comprising:
placing at least one die and at least one thermopile on a first side of a ceramic substrate in the ceramic package, where the ceramic package includes a ceramic body and the ceramic substrate;
hermetically-sealing a silicon lid on a first portion of the ceramic body, where the ceramic body, the ceramic substrate, and the silicon lid define a hermetically-sealed thermopile cavity that houses the at least one thermopile;
hermetically-sealing a glass lid on a second portion of the ceramic body, where the ceramic body, the ceramic substrate, and the glass lid define a hermetically-sealed optical cavity that houses the at least one die; and
placing at least one of at least one surface mount device, an application-specific integrated circuit, or at least one solder connection on a second side of the ceramic substrate.

13. The process for fabricating a hermetically-sealed sensor-in-package device in claim 12 , where the at least one die includes at least one of a photodetector, an ultraviolet light sensor, or a light-emitting diode.

14. The process for fabricating a hermetically-sealed sensor-in-package device in claim 12 , wherein the glass lid includes a metallized glass lid.

15. The process for fabricating a hermetically-sealed sensor-in-package device in claim 12 , wherein a metallized track is disposed between the ceramic body and at least one of the silicon lid or the glass lid.

16. A process for fabricating a hermetically-sealed sensor-in-package device with a pre-assembled hat, comprising:
placing at least one of an application-specific integrated circuit or a surface mount device on a first side of a ceramic substrate;
placing at least one of at least one thermopile, at least one photodetector, at least one light-emitting diode, or an ultraviolet light sensor on the second side of the ceramic substrate;
placing the pre-assembled hat on the second side of the ceramic substrate using a vacuum furnace, where the pre-assembled hat includes
a ceramic body;
a silicon lid disposed on a first portion of the ceramic body, where the silicon lid, the ceramic body, and the ceramic substrate form a hermetically-sealed thermopile cavity; and
a glass lid disposed on a second portion of the ceramic body, where the silicon lid, the ceramic body, and the ceramic substrate form a hermetically-sealed optical cavity; and

forming at least one solder connection on the first side of the ceramic substrate.

17. The process for fabricating a hermetically-sealed sensor-in-package device with a pre-assembled hat in claim 16 , wherein the glass lid includes a metallized glass lid.

18. The process for fabricating a hermetically-sealed sensor-in-package device with a pre-assembled hat in claim 16 , wherein a metallized track is disposed between the ceramic body and at least one of the silicon lid or the glass lid.

19. The process for fabricating a hermetically-sealed sensor-in-package device with a pre-assembled hat in claim 16 , where the at least one solder connection includes an array of solder balls.

20. The process for fabricating a hermetically-sealed sensor-in-package device with a pre-assembled hat in claim 16 , further comprising:
singulating the ceramic substrate to form individual sensor-in-package devices.

Assignees

• Maxim Integrated Products

Inventors

• Wang Ken
• Bhat Jerome C
• Tian Tian
• Ankireddi Seshasayee
• Nagaranjan Kumar
• Gaddamraja Seshasayee

Classifications

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W70/682

  comprising holes having chips therein · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H01L31/18

  Electricity · mapped topic

• H01L25/165

  Electricity · mapped topic