Embedded electronic packaging and associated methods
US-2016351459-A1 · Dec 1, 2016 · US
Insulating materials, e.g. resins, glasses or ceramics
Insulating materials, e.g. resins, glasses or ceramics · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W76/18 |
| Official title | Insulating materials, e.g. resins, glasses or ceramics |
| Display label | Insulating materials, e.g. resins, glasses or ceramics |
| Total patents | 503 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 27 |
| 2016 | 41 |
| 2017 | 57 |
| 2018 | 64 |
| 2019 | 56 |
| 2020 | 41 |
| 2021 | 52 |
| 2022 | 46 |
| 2023 | 30 |
| 2024 | 45 |
| 2025 | 35 |
| 2026 | 9 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device
US-9502320-B2 · Nov 22, 2016 · US
Microelectronic assemblies with cavities, and methods of fabrication
US-9478504-B1 · Oct 25, 2016 · US
Semiconductor device
US-2016307813-A1 · Oct 20, 2016 · US
Semiconductor module and resin case
US-2016276234-A1 · Sep 22, 2016 · US
Embedded electronic packaging and associated methods
US-9443789-B2 · Sep 13, 2016 · US
Plastic cooler for semiconductor modules
US-2016260654-A1 · Sep 8, 2016 · US
Semiconductor Package Having a Multi-Layered Base
US-2016254203-A1 · Sep 1, 2016 · US
Glass frit wafer bond protective structure
US-9425115-B2 · Aug 23, 2016 · US
Glass frit wafer bond protective structure
US-2016218045-A1 · Jul 28, 2016 · US
Method of trimming a component and a component trimmed by such a method
US-2016219719-A1 · Jul 28, 2016 · US
Semiconductor device and method for manufacturing semiconductor device
US-9385061-B2 · Jul 5, 2016 · US
Electronic module and method of manufacturing the same
US-2016181175-A1 · Jun 23, 2016 · US
Power semiconductor module, method for manufacturing the same, and power converter
US-9373555-B2 · Jun 21, 2016 · US
Semiconductor package having EMI shielding and method of fabricating the same
US-9368456-B2 · Jun 14, 2016 · US
Manufacturing method of semiconductor package and semiconductor package
US-2016163565-A1 · Jun 9, 2016 · US
Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
US-9362208-B2 · Jun 7, 2016 · US
Case including semiconductor nanocrystals, and optoelectronic device including the same
US-9362189-B2 · Jun 7, 2016 · US
Integrated circuit assemblies with reinforcement frames, and methods of manufacture
US-9355997-B2 · May 31, 2016 · US
Semiconductor device
US-2016148853-A1 · May 26, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W76/18?
- CPC H10W76/18 is the Cooperative Patent Classification code for “Insulating materials, e.g. resins, glasses or ceramics.”
- How many patents are filed under CPC H10W76/18 (Insulating materials, e.g. resins, glasses or ceramics)?
- Our database includes 503 publications tagged with this CPC code.
- Is patent activity under CPC H10W76/18 growing?
- Publication counts under this code: 45 in 2024 vs 35 in 2025 (latest complete years).