Adjustable fluid inlet assembly for a substrate processing apparatus and method

US11505864B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11505864-B2
Application numberUS-201716622070-A
CountryUS
Kind codeB2
Filing dateJun 21, 2017
Priority dateJun 21, 2017
Publication dateNov 22, 2022
Grant dateNov 22, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A substrate processing apparatus, includes a sealed pressure vessel, such as an Atomic Layer Deposition, ALD, apparatus, a fluid inlet assembly attached to a wall of the sealed pressure vessel, the fluid inlet assembly having a fluid inlet pipe passing through the wall, and a resilient element in the fluid inlet assembly around the fluid inlet pipe coupling the inlet pipe to the wall, where one of an interior surface and an exterior surface of the resilient element sees pressure prevailing within the pressure vessel and the other sees ambient pressure, and where the fluid inlet pipe prevents fluid carried inside from being in contact with the resilient element, and a relating method.

First claim

Opening claim text (preview).

The invention claimed is: 1. A substrate processing apparatus, comprising: a sealed pressure vessel forming an outer chamber that surrounds an inner chamber which is a sealed reaction chamber; a fluid inlet assembly attached to a wall of the sealed pressure vessel, the fluid inlet assembly having a fluid inlet pipe passing through the wall, where the sealed reaction chamber comprises a collar locking the fluid inlet pipe in a horizontal position, the apparatus further comprising: a resilient element in the fluid inlet assembly around the fluid inlet pipe coupling the fluid inlet pipe to the wall, where one of an interior surface and an exterior surface of the resilient element sees pressure prevailing within the pressure vessel and the other sees ambient pressure, and where the fluid inlet pipe prevents fluid carried inside from being in contact with the resilient element. 2. The apparatus of claim 1 , where the resilient element is configured to deform under displacements between fixed first and second end parts of the fluid inlet assembly. 3. The apparatus of claim 1 , where the resilient element is configured to cause mechanical pressure to the fluid inlet pipe. 4. The apparatus of claim 3 , where the direction of mechanical pressure is inwards, towards the sealed reaction chamber. 5. The apparatus of claim 1 , where the fluid inlet pipe is formed of two pipes arranged to slide inside each other. 6. The apparatus of claim 1 , where the fluid inlet pipe is arranged to be disassembled by removing at least a portion of the fluid inlet pipe inwards via an interior of the apparatus. 7. The apparatus of claim 1 , where the fluid inlet pipe is arranged to be disassembled by removing at least a portion of the fluid inlet pipe outwards to a direction pointing away from the apparatus. 8. The apparatus of claim 1 , where the fluid inlet pipe is arranged to be in a fixed position with respect to a wall of the sealed reaction chamber. 9. The apparatus of claim 1 , where the fluid inlet pipe is arranged to be in a rotatable position with respect to a wall of the sealed reaction chamber. 10. The apparatus of claim 1 , where the fluid inlet pipe is equipped with a heat distributing element to distribute heat along the fluid inlet pipe. 11. The apparatus of claim 10 , where the heat distributing element extends over a feedthrough point of the wall of the sealed pressure vessel. 12. The apparatus of claim 1 , where a contact point at which the fluid inlet pipe meets the sealed reaction chamber is a non-permanent fixing point. 13. The apparatus of claim 12 , where the contact point is sealed and/or enforced. 14. A method in a substrate processing apparatus, comprising: providing a sealed pressure vessel forming an outer chamber that surrounds an inner chamber which is a sealed reaction chamber, the sealed pressure vessel having a fluid inlet assembly attached to a wall of the sealed pressure vessel, the fluid inlet assembly having a fluid inlet pipe passing through the wall, where the sealed reaction chamber comprises a collar locking the fluid inlet pipe in a horizontal position, and providing a resilient element in the fluid inlet assembly around the fluid inlet pipe coupling the fluid inlet pipe to the wall, where one of an interior surface and an exterior surface of the resilient element sees pressure prevailing within the pressure vessel and the other sees ambient pressure, and where the fluid inlet pipe prevents fluid carried inside from being in contact with the resilient element, the method further comprising: causing mechanical pressure to the fluid inlet pipe via contraction of the resilient element, the direction of the mechanical pressure being towards the pressure vessel interior. 15. The method of claim 14 , where the mechanical pressure is caused by a pressure difference between the pressure prevailing within the pressure vessel and the ambient pressure.

Assignees

Inventors

Classifications

  • Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

  • Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

  • C30B25/14Primary

    Feed and outlet means for the gases; Modifying the flow of the reactive gases · CPC title

  • characterized by the apparatus · CPC title

  • Heated nozzles · CPC title

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Frequently asked questions

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What does patent US11505864B2 cover?
A substrate processing apparatus, includes a sealed pressure vessel, such as an Atomic Layer Deposition, ALD, apparatus, a fluid inlet assembly attached to a wall of the sealed pressure vessel, the fluid inlet assembly having a fluid inlet pipe passing through the wall, and a resilient element in the fluid inlet assembly around the fluid inlet pipe coupling the inlet pipe to the wall, where one…
Who is the assignee on this patent?
Picosun Oy
What technology area does this patent fall under?
Primary CPC classification C30B25/14. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Nov 22 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).