Metal-clad laminate, metal foil with resin, and wiring board

Patent metadata

Field	Value
Publication number	US-11477883-B2
Application number	US-201816629811-A
Country	US
Kind code	B2
Filing date	Jun 22, 2018
Priority date	Jul 12, 2017
Publication date	Oct 18, 2022
Grant date	Oct 18, 2022

Abstract

A metal-clad laminate includes: an insulating layer; and a metal foil being in contact with at least one surface of the insulating layer. The insulating layer contains a cured product of a resin composition containing a polyphenylene ether copolymer having an intrinsic viscosity of 0.03 to 0.12 dl/g measured in methylene chloride at 25° C. and having an average of 1.5 to 3 specific groups per molecule at its molecular terminal, a thermosetting curing agent having two or more carbon-carbon unsaturated double bonds at its molecular terminal, and a thermoplastic elastomer. The metal foil includes a metal substrate, and a cobalt-containing barrier layer provided on at least a contact surface of the metal substrate, the contact surface being in contact with the insulating layer. The contact surface has a ten-point average roughness Rz of 2 μm or less as a surface roughness.

First claim

The invention claimed is:

1. A metal-clad laminate comprising:
an insulating layer; and
a metal foil being in contact with at least one surface of the insulating layer, wherein:
the insulating layer contains a cured product of a resin composition containing a polyphenylene ether copolymer having an intrinsic viscosity of 0.03 to 0.12 dl/g measured in methylene chloride at 25° C. and having an average of 1.5 to 3 groups represented by following formula (1) or (2) per molecule at its molecular terminal, a thermosetting curing agent having two or more carbon-carbon unsaturated double bonds at its molecular terminal, and a thermoplastic elastomer;
the metal foil includes a metal substrate, and a cobalt-containing barrier layer provided on at least a contact surface of the metal substrate, the contact surface being in contact with the insulating layer; and
the contact surface has a ten-point average roughness Rz of 2 μm or less as a surface roughness,

wherein R 1 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and R 2 represents an alkylene group having 1 to 10 carbon atoms,

wherein R 3 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms.

2. The metal-clad laminate according to claim 1 , wherein the thermoplastic elastomer contains a styrene-based thermoplastic elastomer.

3. The metal-clad laminate according to claim 2 , wherein the styrene-based thermoplastic elastomer contains at least one obtained by hydrogenating all or a part of double bonds selected from the group consisting of a methyl styrene (ethylene/butylene) methyl styrene copolymer, a styrene (ethylene/propylene) styrene copolymer, a styrene (ethylene/butylene) styrene copolymer, a styrene (butadiene/isoprene) styrene copolymer, and a styrene isoprene styrene copolymer.

4. The metal-clad laminate according to claim 2 , wherein the styrene-based thermoplastic elastomer contains at least one selected from the group consisting of a hydrogenated methylstyrene (ethylene/butylene) methylstyrene copolymer, a hydrogenated methylstyrene (ethylene-ethylene/propylene) methylstyrene copolymer, a hydrogenated styrene isoprene copolymer, a hydrogenated styrene isoprene styrene copolymer, a hydrogenated styrene (ethylene/butylene) styrene copolymer, a hydrogenated styrene (ethylene/propylene) styrene copolymer, and a hydrogenated styrene (ethylene-ethylene/propylene) styrene copolymer.

5. The metal-clad laminate according to claim 1 , wherein a ratio of a total of a content of the polyphenylene ether copolymer and a content of the thermosetting curing agent to a content of the thermoplastic elastomer is 50:50 to 90:10 at a ratio by mass.

6. The metal-clad laminate according to claim 1 , wherein:
the resin composition further contains a silane coupling agent; and
the silane coupling agent has at least one selected from the group consisting of a vinyl group, a styryl group, a methacrylic group, and an acrylic group in its molecule.

7. The metal-clad laminate according to claim 1 , wherein:
a content of the polyphenylene ether copolymer is 30 to 70 parts by mass with respect to a total of 100 parts by mass of the polyphenylene ether copolymer, the thermosetting curing agent, and the thermoplastic elastomer; and
a content of the cured product is 20 to 40 parts by mass with respect to a total of 100 parts by mass of the polyphenylene ether copolymer, the thermosetting curing agent, and the thermoplastic elastomer.

8. A metal foil with resin comprising:
an insulating adhesive layer; and
a metal foil being in contact with at least one surface of the insulating adhesive layer,

wherein:
the insulating adhesive layer contains a resin composition or a semi-cured product of the resin composition, the resin composition containing a polyphenylene ether copolymer having an intrinsic viscosity of 0.03 to 0.12 dl/g measured in methylene chloride at 25° C. and having an average of 1.5 to 3 groups represented by following formula (1) or (2) per molecule at its molecular terminal, a thermosetting curing agent having two or more carbon-carbon unsaturated double bonds at its molecular terminal, and a thermoplastic elastomer;
the metal foil includes a metal substrate, and a cobalt-containing barrier layer provided on at least a contact surface of the metal substrate, the contact surface being in contact with the insulating adhesive layer; and
the contact surface has a ten-point average roughness Rz of 2 μm or less as a surface roughness,

wherein R 1 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and R 2 represents an alkylene group having 1 to 10 carbon atoms,

wherein R 3 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms.

9. The metal foil with resin according to claim 8 , wherein:
a content of the polyphenylene ether copolymer is 30 to 70 parts by mass with respect to a total of 100 parts by mass of the polyphenylene ether copolymer, the thermosetting curing agent, and the thermoplastic elastomer.

10. A wiring board comprising:
an insulating layer; and
wiring being in contact with at least one surface of the insulating layer, wherein:
the insulating layer contains a cured product of a resin composition containing a polyphenylene ether copolymer having an intrinsic viscosity of 0.03 to 0.12 dl/g measured in methylene chloride at 25° C. and having an average of 1.5 to 3 groups represented by following formula (1) or (2) per molecule at its molecular terminal, a thermosetting curing agent having two or more carbon-carbon unsaturated double bonds at its molecular terminal, and a thermoplastic elastomer;
the wiring includes a metal substrate, and a cobalt-containing barrier layer provided on at least a contact surface of the metal substrate, the contact surface being in contact with the insulating layer; and
the contact surface has a ten-point average roughness Rz of 2 μm or less as a surface roughness,

wherein R 1 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and R 2 represents an alkylene group having 1 to 10 carbon atoms,

wherein R 3 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms.

11. The wiring board according to claim 10 , wherein:
a content of the polyphenylene ether copolymer is 30 to 70 parts by mass with respect to a total of 100 parts by mass of the polyphenylene ether copolymer, the thermosetting curing agent, and the thermoplastic elastomer; and
a content of the cured product is 20 to 40 parts by mass with respect to a total of 100 parts by mass of the polyphenylene ether copolymer, the thermosetting curing agent, and the thermoplastic elastomer.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Tsuda Kosuke
• Saito Hirosuke
• Fujiwara Hiroaki

Classifications

• H05K1/0366

  reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title

• C08F290/06

  Polymers provided for in subclass C08G · CPC title

• B32B2255/205

  Metallic coating · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• B32B15/14

  next to a fibrous or filamentary layer · CPC title