Stretchable flexible substrate including first insulating layer, second insulating layer, first metal layer, and second metal layer

US2016353567A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016353567-A1
Application numberUS-201615158591-A
CountryUS
Kind codeA1
Filing dateMay 19, 2016
Priority dateMay 25, 2015
Publication dateDec 1, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A stretchable flexible substrate according to one aspect of the present disclosure includes: an electronic component; a first insulating layer located around the electronic component and having first and second main surfaces facing each other; a first metal layer that is in contact with the first main surface; a second metal layer that is in contact with the second main surface and electrically connected to the electronic component; and a second insulating layer that seals the electronic component, first insulating layer, and second metal layer, in plan view, a curved wiring portion extending from a central portion made up of at least the electronic component, portions of the first insulating layer and first and second metal layers, the curved wiring portion being made up of at least other portions of the first insulating layer, first and second metal layers, and the curved wiring portion being curved at least partially.

First claim

Opening claim text (preview).

What is claimed is: 1 . A stretchable flexible substrate comprising: an electronic component; a first insulating layer that is located around the electronic component and has a first main surface and a second main surface that face each other; a first metal layer that is in contact with the first main surface; a second metal layer that is in contact with the second main surface and is electrically connected to the electronic component; and a second insulating layer that seals the electronic component, the first insulating layer, and the second metal layer, wherein: in plan view, at least one curved wiring portion extends from a central portion, the central portion being made up of at least the electronic component, a first portion of the first insulating layer, a first portion of the first metal layer and a first portion of the second metal layer, and the at least one curved wiring portion being made up of at least a second portion of the first insulating layer that is different from the first portion, a second portion of the first metal layer that is different from the first portion, and a second portion of the second metal layer that is different from the first portion; and the at least one curved wiring portion is curved at least partially. 2 . The stretchable flexible substrate according to claim 1 , wherein the stretchable flexible substrate is stretchable due to a change in curvature of the at least one curved wiring portion. 3 . The stretchable flexible substrate according to claim 1 , wherein in the central portion, the electronic component is surrounded by the first portion of the first insulating layer. 4 . The stretchable flexible substrate according to claim 1 , further comprising an adhesive layer that is provided between the electronic component and the first metal layer and is in contact with the electronic component. 5 . The stretchable flexible substrate according to claim 1 , wherein the first metal layer is a metal foil. 6 . The stretchable flexible substrate according to claim 1 , wherein both of the first insulating layer and the second insulating layer are each a resin layer; and the second insulating layer is softer than the first insulating layer. 7 . The stretchable flexible substrate according to claim 1 , further comprising a third insulating layer that seals the first metal layer, wherein the second insulating layer is stacked on the third insulating layer. 8 . The stretchable flexible substrate according to claim 7 , wherein the first metal layer is flush with a boundary face between the second insulating layer and the third insulating layer. 9 . The stretchable flexible substrate according to claim 7 , wherein the first insulating layer is flush with a boundary face between the second insulating layer and the third insulating layer. 10 . The stretchable flexible substrate according to claim 4 , further comprising a third insulating layer that seals the first metal layer, wherein: the second insulating layer is stacked on the third insulating layer; and the adhesive layer is flush with a boundary face between the second insulating layer and the third insulating layer. 11 . The stretchable flexible substrate according to claim 7 , wherein both of the first insulating layer and the third insulating layer are each a resin layer; and the third insulating layer is softer than the first insulating layer. 12 . The stretchable flexible substrate according to claim 1 , further comprising a gap that passes through the first insulating layer, wherein the first metal layer and the second metal layer are electrically connected to each other through the gap. 13 . The stretchable flexible substrate according to claim 12 , wherein the gap is filled with the second metal layer.

Assignees

Inventors

Classifications

  • Position of a single component · CPC title

  • characterised by the use of flexible or folded printed circuits · CPC title

  • associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title

  • Sensor · CPC title

  • H05K1/0283Primary

    Stretchable printed circuits · CPC title

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Frequently asked questions

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What does patent US2016353567A1 cover?
A stretchable flexible substrate according to one aspect of the present disclosure includes: an electronic component; a first insulating layer located around the electronic component and having first and second main surfaces facing each other; a first metal layer that is in contact with the first main surface; a second metal layer that is in contact with the second main surface and electrically…
Who is the assignee on this patent?
Panasonic Ip Man Co Ltd
What technology area does this patent fall under?
Primary CPC classification H05K1/0283. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Dec 01 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).