Carrier film for transferring microelement

Patent metadata

Field	Value
Publication number	US-11458704-B2
Application number	US-201816766744-A
Country	US
Kind code	B2
Filing date	Nov 29, 2018
Priority date	Nov 29, 2017
Publication date	Oct 4, 2022
Grant date	Oct 4, 2022

Abstract

The present invention relates to a carrier film for transferring a microelement, wherein, when a microelement is pressurized, a uniform pressurizing force is provided to the entire microelement, and a damage to the microelement can be prevented. The carrier film for transferring a microelement comprises: a load control layer having a first elastic modulus and having a space formed in a part of the interior thereof; and an adhesive layer having a second elastic modulus that is smaller than the first elastic modulus, the adhesive layer being provided on the upper portion of the load control layer and configured such that a microelement supposed to be transferred to a target substrate is attached thereto. The load control layer has a first zero-rigidity area that maintains a first stress in a first deformation range from a first strain to a second strain.

First claim

The invention claimed is:

1. A carrier film for transferring micro-devices, comprising:
a load control layer having a first elastic modulus and having a space partially formed therein; and
an adhesive layer formed on the load control layer and adapted to adhesively attach a micro-device to be transferred to a target substrate thereto, the adhesive layer having a second elastic modulus smaller than the first elastic modulus,
wherein the load control layer has a first zero-stiffness region in which a first stress is maintained in a first strain section ranging from a first strain to a second strain,
wherein the load control layer comprises a plurality of unit load control layers separated from one another with a gap therebetween.

2. The carrier film according to claim 1 , further comprising:
a displacement control layer interposed between the load control layer and the adhesive layer,
the displacement control layer having a third elastic modulus greater than the first elastic modulus.

3. The carrier film according to claim 1 , further comprising:
a reinforcing layer interposed between a base portion providing compressive force to the carrier film and the load control layer to allow a second stress greater than the first stress to be maintained in the first strain section,
the reinforcing layer having a fourth elastic modulus greater than the first elastic modulus.

4. The carrier film according to claim 1 , wherein a starting strain of the first strain section is adjusted depending on a thickness of the load control layer with the first stress maintained.

5. The carrier film according to claim 1 , wherein the space in the load control layer is formed in a porous shape.

6. The carrier film according to claim 1 , wherein the space in the load control layer is divided by partitions adapted to be folded when a load is applied thereto.

7. A carrier film for transferring micro-devices, comprising:
a load control layer having a first elastic modulus and having a space partially formed therein; and
an adhesive layer formed on the load control layer and adapted to adhesively attach a micro-device to be transferred to a target substrate thereto, the adhesive layer having a second elastic modulus smaller than the first elastic modulus,
wherein the load control layer has a first zero-stiffness region in which a first stress is maintained in a first strain section ranging from a first strain to a second strain,
wherein the load control layer comprises a first load control layer having a first strength and a second load control layer having a second strength smaller than the first strength,
the first load control layer having a second zero-stiffness region in which a third stress is maintained in a second strain section ranging from a third strain to a fourth strain,
the second load control layer having a third zero-stiffness region in which a fourth stress smaller than the third stress is maintained in the second strain section.

8. The carrier film according to claim 7 , wherein the first load control layer and the second load control layer are placed on the same plane to be adjacent to each other.

9. The carrier film according to claim 7 , wherein the first load control layer and the second load control layer are formed of different materials.

10. The carrier film according to claim 7 , wherein the space in the load control layer is formed such that the first load control layer has a first spatial density and the second load control layer has a second spatial density higher than the first spatial density.

11. A carrier film for transferring micro-devices, comprising:
a load control layer having a first elastic modulus and having a space partially formed therein; and
an adhesive layer formed on the load control layer and adapted to adhesively attach a micro-device to be transferred to a target substrate thereto, the adhesive layer having a second elastic modulus smaller than the first elastic modulus,
wherein the load control layer has a first zero-stiffness region in which a first stress is maintained in a first strain section ranging from a first strain to a second strain,
wherein the load control layer comprises a third load control layer having a third strength and a fourth load control layer having a fourth strength greater than the third strength,
the third load control layer having a fourth zero-stiffness region in which a fifth stress is maintained in a third strain section ranging from a fifth strain to a sixth strain,
the fourth load control layer having a fifth zero-stiffness region in which a sixth stress greater than the fifth stress is maintained in a fourth strain section ranging from a seventh strain greater than the sixth strain to an eighth strain.

12. The carrier film according to claim 11 , wherein the fourth load control layer is formed on the third load control layer.

13. The carrier film according to claim 11 , wherein the third load control layer and the fourth load control layer are formed of different materials.

14. He carrier film according to claim 11 , wherein the space in the load control layer is formed such that the third load control layer has a third spatial density and the fourth load control layer has a fourth spatial density lower than the third spatial density.

Assignees

• Ct Advanced Meta Mat

Inventors

• Kim Kwangseop
• Kim Chan
• Yoon Min Ah
• Kim Jae Hyun
• Jung Hyun June
• Lee Hak Joo

Classifications

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P72/7434

  used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate · CPC title

• H10P72/7428

  used to support diced chips prior to mounting · CPC title

• H10P72/0442

  Apparatus for placing on an insulating substrate, e.g. tape · CPC title

• H10P72/7402 Primary

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title