Substrate processing systems, apparatus, and methods with factory interface environmental controls

Patent metadata

Field	Value
Publication number	US-11450539-B2
Application number	US-201816112197-A
Country	US
Kind code	B2
Filing date	Aug 24, 2018
Priority date	Aug 12, 2013
Publication date	Sep 20, 2022
Grant date	Sep 20, 2022

Abstract

Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.

First claim

What is claimed is:

1. An electronic device processing system, comprising:
a factory interface including a factory interface chamber;
a load lock apparatus coupled to the factory interface, the load lock apparatus comprising one or more valves;
a first sensor to detect a humidity level in the factory interface chamber;
a second sensor to detect a flow rate of an inert gas flowed into the factory interface chamber, wherein the second sensor is included on a delivery line coupled between an inert gas supply and the factory interface chamber;
and
an environmental control system coupled to the factory interface, the environmental control system comprising a processor and a memory, the processor to:
cause an inert gas to be provided into the factory interface chamber;
cause the inert gas exhausted from the factory interface chamber to be circulated back into the factory interface chamber;
identify at least one of a temperature condition, an oxygen level condition, or a humidity level condition associated with a type of substrate process to be performed;
control the humidity level in the factory interface chamber based on detection by the first sensor; and
responsive to determining that the at least one of the temperature condition, the oxygen level condition, or the humidity level condition identified factory interface is satisfied, open the one or more valves of the load lock apparatus to enable passing of substrates between the factory interface chamber and the load lock apparatus.

2. The electronic device processing system of claim 1 further comprising an exhaust conduit, wherein the inert gas is at least partially circulated back into the factory interface chamber by way of the exhaust conduit.

3. The electronic device processing system of claim 2 , further comprising a filter in series with the exhaust conduit.

4. The electronic device processing system of claim 3 , wherein the filter is configured to filter particulates.

5. The electronic device processing system of claim 3 , wherein the filter is a moisture-reducing filter.

6. The electronic device processing system of claim 3 , wherein the filter is a moisture absorbent filter.

7. The electronic device processing system of claim 3 , wherein the filter is within the factory interface chamber.

8. The electronic device processing system of claim 2 , further comprising:
a chamber door on the factory interface chamber; and
a channel in the chamber door, the channel having an entrance from the factory interface chamber and the channel being coupled to the exhaust conduit.

9. The electronic device processing system of claim 8 , wherein the chamber door has a bottom and wherein the entrance of the channel is at the bottom of the chamber door.

10. The electronic device processing system of claim 9 , further comprising a filter in series with the exhaust conduit, wherein the exhaust conduit is between the chamber door and the filter and progresses above the filter.

11. The electronic device processing system of claim 1 , further comprising:
a third sensor to detect an oxygen level in the factory interface chamber, wherein the environmental control system is further operational to control the oxygen level in the factory interface chamber based on detection by the third sensor.

12. The electronic device processing system of claim 1 , wherein the processor is further to:
monitor a consumption of the inert gas at the factory interface chamber based on detection by at least the second sensor of the flow rate of the inert gas provided into the factory interface chamber.

13. The electronic device processing system of claim 1 , wherein the type of the substrate process corresponds to at least one of a plasma vapor deposition process, a chemical vapor deposition process, an etch process, an annealing process, a pre-clean process, a metal removal process, or a metal oxide removal process.

Assignees

• Applied Materials Inc

Inventors

• Koshti Sushant S
• Hruzek Dean C
• Majumdar Ayan
• Menk John C
• Lee Helder T
• Patil Sangram
• Rajaram Sanjay
• Baumgarten Douglas B
• Merry Nir

Classifications

• H10P72/3406 Primary

  involving removal of lid, door or cover · CPC title

• H10P72/0604 Primary

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0468 Primary

  comprising a chamber adapted to a particular process · CPC title

• H01L21/67253

  Electricity · mapped topic