Optical patterning systems and methods

Patent metadata

Field	Value
Publication number	US-11448965-B2
Application number	US-201917262015-A
Country	US
Kind code	B2
Filing date	Jul 22, 2019
Priority date	Jul 23, 2018
Publication date	Sep 20, 2022
Grant date	Sep 20, 2022

Abstract

Disclosed herein are methods for patterning two-dimensional atomic layer materials, the methods comprising: illuminating a first location of an optothermal substrate with electromagnetic radiation, wherein the optothermal substrate converts at least a portion of the electromagnetic radiation into thermal energy, and wherein the optothermal substrate is in thermal contact with a two-dimensional atomic layer material; thereby: generating an ablation region at a location of the two-dimensional atomic layer material proximate to the first location of the optothermal substrate, wherein at least a portion of the ablation region has a temperature sufficient to ablate at least a portion of the two-dimensional atomic layer material within the ablation region, thereby patterning the two-dimensional atomic layer material. Also disclosed herein are systems for performing the methods described herein, patterned two-dimensional atomic layer materials made by the methods described herein and methods of use thereof.

First claim

What is claimed is:

1. A method of patterning a two-dimensional atomic layer material, the method comprising:
illuminating a first location of an optothermal substrate with electromagnetic radiation;
wherein the electromagnetic radiation has a power density of from 0.1 mW/μm 2 to 5 mW/μm 2 ;
wherein the optothermal substrate comprises a plasmonic substrate having a plasmon resonance energy and the electromagnetic radiation comprises a wavelength that overlaps with at least a portion of the plasmon resonance energy of the plasmonic substrate, such that the optothermal substrate converts at least a portion of the electromagnetic radiation into thermal energy via plasmon-enhanced photothermal effects; and

wherein the optothermal substrate is in thermal contact with a two-dimensional atomic layer material;

thereby:
generating an ablation region at a location of the two-dimensional atomic layer material proximate to the first location of the optothermal substrate via plasmon-enhanced photothermal effects, wherein at least a portion of the ablation region has a temperature sufficient to ablate at least a portion of the two-dimensional atomic layer material within the ablation region; and
ablating at least a portion of the two-dimensional atomic layer material within the ablation region proximate to the first location of the optothermal substrate;
thereby patterning the two-dimensional atomic layer material.

2. The method of claim 1 , wherein the electromagnetic radiation has a power density of from 0.1 mW/μm 2 to 2.5 mW/μm 2 .

3. The method of claim 1 , wherein the electromagnetic radiation is provided by a laser.

4. The method of claim 1 , wherein the electromagnetic radiation is provided by a light source and the light source is configured to illuminate a mirror and the mirror is configured to reflect the electromagnetic radiation from the light source to illuminate the first location of the optothermal substrate.

5. The method of claim 1 , wherein the two-dimensional atomic layer material comprises a transition metal dichalcogenide, hexagonal BN, graphene, black phosphorous, or combinations thereof.

6. The method of claim 1 , wherein the two-dimensional atomic layer material comprises a transition metal dichalcogenide selected from the group consisting of MoS 2 , WSe 2 , MoTe 2 , WS 2 , and combinations thereof.

7. The method of claim 1 , wherein the two-dimensional atomic layer material is disposed on the optothermal substrate.

8. The method of any one of claim 1 , wherein the ablation region has a diameter of from 300 nm to 10 μm.

9. The method of claim 1 , wherein the portion of the two-dimensional atomic material is ablated in an amount of time of 10 4 seconds to 10 seconds.

10. The method of claim 1 , further comprising illuminating a second location of the optothermal substrate, thereby:
generating a second ablation region at a location of the two-dimensional atomic layer material proximate to the second location of the optothermal substrate via plasmon-enhanced photothermal effects, wherein at least a portion of the second ablation region has a temperature sufficient to ablate at least a portion of the two-dimensional atomic layer material within the second ablation region; and
ablating at least a portion of the two-dimensional atomic layer material within the second ablation region proximate to the second location of the optothermal substrate.

11. The method of claim 10 , wherein the optothermal substrate is translocated to illuminate the second location; wherein the electromagnetic radiation is provided by a light source, and the light source is translocated to illuminate the second location; wherein the electromagnetic radiation is provided by a light source, the light source being configured to illuminate a mirror and the mirror is configured to reflect the electromagnetic radiation from the artificial light source to illuminate the optothermal substrate, and the mirror is translocated to illuminate the second location; or a combination thereof.

12. The method of claim 1 , further comprising removing the patterned two-dimensional atomic layer material from the optothermal substrate by etching the optothermal substrate, thereby creating a free-standing patterned two-dimensional atomic layer material.

13. The method of claim 12 , further comprising depositing the free-standing patterned two-dimensional atomic layer material onto a substrate.

14. A patterned two-dimensional atomic layer material made using the method of claim 1 .

15. A method of use of the patterned two-dimensional atomic layer material of claim 14 , wherein the patterned two-dimensional atomic layer material is used for optical devices, electronic devices, optoelectronic devices, or combinations thereof.

16. The method of claim 1 , wherein the optothermal substrate comprises a plurality of plasmonic particles.

17. The method of claim 16 , wherein the plurality of plasmonic particles are a plurality of metal particles, the plurality of metal particles comprising a metal selected from the group consisting of Au, Ag, Pd, Pt, Cu, Cr, Al, Mg, Ni, and combinations thereof.

18. A system for patterning a two-dimensional atomic layer material, the system comprising:
an optothermal substrate in thermal contact with a two-dimensional atomic layer material, wherein the optothermal substrate comprises a plasmonic substrate having a plasmon resonance energy; and
a light source configured to illuminate the optothermal substrate at a first location with electromagnetic radiation, wherein the electromagnetic radiation has a power density of from 0.1 mW/μm 2 to 5 mW/μm 2 and the electromagnetic radiation comprises a wavelength that overlaps with at least a portion of the plasmon resonance energy of the plasmonic substrate, such that the optothermal substrate converts at least a portion of the electromagnetic radiation into thermal energy via plasmon-enhanced photothermal effects;
thereby:
generating an ablation region at a location of the two-dimensional atomic layer material proximate to the first location of the optothermal substrate via plasmon-enhanced photothermal effects, wherein at least a portion of the ablation region has a temperature sufficient to ablate at least a portion of the two-dimensional atomic layer material within the ablation region; and
ablating at least a portion of the two-dimensional atomic layer material within the ablation region proximate to the first location of the optothermal substrate,
thereby patterning the two-dimensional atomic layer material.

19. The system of claim 18 , further comprising an instrument configured to capture an electromagnetic signal from the optothermal substrate and/or the two-dimensional atomic layer material.

20. The system of claim 19 , further comprising a computing device comprising a processor and a memory operably coupled to the processor, the memory having further computer-executable instructions stored thereon that, when executed by the processor, cause the processor to:
receive an electromagnetic signal from the instrument;
process the electromagnetic signal to obtain a characteristic of the optothermal substrate and/or the two-dimensional atomic layer material; and
output the characteristic of the optothermal substrate and/or the two-dimensional atomic layer material.

Assignees

• Univ Texas

Inventors

• Zheng Yuebing
• Lin Linhan
• Li Jingang

Classifications

• G03F7/202 Primary

  Masking pattern being obtained by thermal means, e.g. laser ablation · CPC title

• G03F7/213

  Exposing with the same light pattern different positions of the same surface at the same time {(G03F7/70 takes precedence)} · CPC title

• G03F7/0043

  Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof (G03F7/0044 takes precedence) · CPC title

• G03F7/704

  Scanned exposure beam, e.g. raster-, rotary- and vector scanning (mask projection exposure involving relative movement of patterned beam and workpiece during imaging G03F7/70358) · CPC title

• G03F7/702

  Reflective illumination, i.e. reflective optical elements other than folding mirrors, e.g. extreme ultraviolet [EUV] illumination systems · CPC title