Substrate placing table

Patent metadata

Field	Value
Publication number	US-10283398-B2
Application number	US-201515521217-A
Country	US
Kind code	B2
Filing date	Sep 17, 2015
Priority date	Oct 30, 2014
Publication date	May 7, 2019
Grant date	May 7, 2019

Abstract

A substrate placing table, which is installed inside a processing container for processing a wafer, includes: a stage configured to place a water on an upper surface thereof and including an inner peripheral flow channel and an outer peripheral flow channel formed therein to circulate a heat medium of a predetermined temperature therethrough; a support table configured to support the stage; and a temperature adjusting plate installed between the stage and the support table, and including a temperature adjusting mechanism configured to adjust a temperature of a heat radiation portion at which heat is radiated between the stage and the support table.

First claim

What is claimed is:

1. A substrate placing table for placing a substrate thereon, comprising;
a stage configured to place the substrate on an upper surface thereof, and including a heat medium flow channel formed therein to circulate a heat medium of a predetermined temperature therethrough;
a support table configured to support the stage; and
a temperature adjusting plate installed between the stage and the support table, and including a temperature adjusting mechanism configured to adjust a temperature of a heat radiation portion at which heat is radiated between the stage and the support table and configured to be another heat medium flow channel through which the heat medium circulates;
a stage heat medium supply pipe connected to the heat medium flow channel of the stage to supply the heat medium to the heat medium flow channel; and
an adjusting plate heat medium supply pipe configured to connect between the heat medium flow channel and the another heat medium flow channel of the temperature adjusting plate, and configured to supply, to the another heat medium flow channel, the heat medium which has been supplied from the stage heat medium supply pipe and subsequently, passed through the heat medium flow channel.

2. The substrate placing table according to claim 1 , wherein the stage and the temperature adjusting plate are fixed to each other by a plurality of fixing members configured to fix an outer peripheral portion of the stage and an outer peripheral portion of the temperature adjusting plate to each other, and
wherein a gap is formed between the stage and the temperature adjusting plate in an area inward of the plurality of fixing members.

Assignees

• Tokyo Electron Ltd

Inventors

• Tanaka Atsushi
• Ogawa Ryohei

Classifications

• H10P50/283

  by chemical means · CPC title

• H10P72/0432 Primary

  mainly by conduction · CPC title

• H10P72/0421

  for drying etching · CPC title

• H10P50/242

  of Group IV materials · CPC title

• H10P72/7624 Primary

  characterised by the mechanical construction of the susceptor, stage or support · CPC title