Method for making a heat dissipation structure

Patent metadata

Field	Value
Publication number	US-11380603-B2
Application number	US-201916596250-A
Country	US
Kind code	B2
Filing date	Oct 8, 2019
Priority date	Sep 18, 2016
Publication date	Jul 5, 2022
Grant date	Jul 5, 2022

Abstract

An electronic device includes a heat dissipation structure. The heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The flexible substrate is disposed on the graphite sheet, and the second surface faces the graphite sheet. At least one containing cavity is formed between the flexible substrate and the graphite sheet. The heat insulating material is filled in the containing cavity. A cover plate is disposed on the first surface. At least one groove is formed on the flexible substrate from the first surface to the second surface. The groove is sealed by the cover plate to formed a sealed cavity. A phase changing material is filled in the sealed cavity.

First claim

What is claimed is:

1. A method for making a heat dissipation structure comprising:
providing a flexible substrate and a graphite sheet, the flexible substrate comprising a first surface and a second surface facing away from the first surface, the graphite sheet comprising a third surface and a fourth surface facing away from the third surface;
forming at least one recess on at least one the flexible substrate and the graphite sheet, the at least one recess is recessed from the second surface of the flexible substrate to the first surface of the flexible substrate, and/or recessed from the third surface of the graphite sheet to the fourth surface of the graphite sheet;
forming at least one groove on the flexible substrate from the first surface of the flexible substrate to the second surface of the flexible substrate;
filling a heat insulating material in the at least one recess;
filling a phase changing material in the at least one groove;
connecting a cover plate to the first surface of the flexible substrate, thereby sealing the at least one groove to define a sealed cavity; and
connecting the second surface of the flexible substrate to the third surface of the graphite sheet to seal the at least one recess to define a containing cavity, to cause a heat insulating material to be sealed in the containing cavity.

2. The method for making a heat dissipation structure of the claim 1 , before connecting the second surface of the flexible substrate to the third surface of the graphite sheet, the method for making a heat dissipation structure further comprising forming an adhesive layer on the first surface to surround each of the least one groove; when connecting the second surface of the flexible substrate to the third surface of the graphite sheet, the adhesive layer binds the cover plate and the graphite sheet.

3. The method for making a heat dissipation structure of the claim 1 , the flexible substrate further comprises a bottom surface and a side wall surrounding the bottom surface; the side wall, the bottom surface and the cover plate cooperate to form the sealed cavity; the method for making a heat dissipation structure further comprising:
forming a plurality of microgrooves in the flexible substrate from the bottom surface to the second surface of the flexible substrate and in communication with the sealed cavity, areas of the microgrooves on the bottom surface decreasing along a direction from a position at the bottom surface near the containing cavity to other positions at the bottom surface away from the containing cavity.

4. The method for making a heat dissipation structure of the claim 1 , wherein the heat insulating material is selected from a group consisting of air, polyimide resin, polyester resin, asbestos, and polypropylene resin.

5. The method for making a heat dissipation structure of the claim 1 , wherein the flexible substrate has a thickness of about 18 μm to about 175 μm.

6. The method for making a heat dissipation structure of the claim 1 , wherein the at least one groove is formed by etching, mechanical cutting, laser cutting, or punching.

7. The method for making a heat dissipation structure of the claim 1 , wherein the phase changing material comprises paraffin, polyethylene glycol 1000, lauric acid, or any combination thereof.

8. The method for making a heat dissipation structure of the claim 1 , wherein the cover plate is connected to the first surface of the flexible substrate by an adhesive layer.

9. The method for making a heat dissipation structure of the claim 8 , wherein the adhesive layer is formed on the first surface to surround each groove.

10. The method for making a heat dissipation structure of the claim 8 , wherein the adhesive layer is made of materials having a heat conducting capability.

Assignees

• Avary Holding Shenzhen Co Ltd
• Hongqisheng Prec Electronics Qinhuangdao Co Ltd

Inventors

• Shen Fu-Yun
• Lei Cong
• Ho Ming-Jaan
• Hsu Hsiao-Ting

Classifications

• H10W40/735

  by melting or evaporation of solids · CPC title

• H10W40/25

  characterised by their materials · CPC title

• H10W40/10 Primary

  Arrangements for heating · CPC title

• H10W40/258 Primary

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H05K3/0017

  Etching of the substrate by chemical or physical means · CPC title