Method for making a heat dissipation structure
US-11380603-B2 · Jul 5, 2022 · US
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Lei Cong patents
Lei Cong is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lei Cong |
| Total patents | 9 |
| First publication | Nov 9, 2017 |
| Latest publication | Jul 5, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for manufacturing an ultrathin heat dissipation structure
US-10923411-B2 · Feb 16, 2021 · US
Heat dissipation structure, method for making the same, and electronic device having the same
US-10658265-B2 · May 19, 2020 · US
Method for making a heat dissipation structure
US-2020043827-A1 · Feb 6, 2020 · US
Resin composition, adhesive layer, and circuit board utilizing same
US-2019330500-A1 · Oct 31, 2019 · US
Method for manufacturing an ultrathin heat dissipation structure
US-2019320550-A1 · Oct 17, 2019 · US
Ultrathin heat dissipation structure
US-10448540-B2 · Oct 15, 2019 · US
Heat dissipation structure, method for making the same, and electronic device having the same
US-2018082924-A1 · Mar 22, 2018 · US
Ultrathin heat dissipation structure and a method for manufacturing same
US-2017325356-A1 · Nov 9, 2017 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Avary Holding Shenzhen Co Ltd | 7 |
| Hongqisheng Prec Electronics Qinhuangdao Co Ltd | 7 |
| Garuda Tech Co Ltd | 3 |
| Fukui Prec Component Shenzhen | 2 |
| Qing Ding Prec Electronics Huaian Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/735 | 8 |
| H10W40/258 | 8 |
| H01L23/3736 | 5 |
| H10W40/25 | 4 |
| H10W40/10 | 4 |