Electronic device

Patent metadata

Field	Value
Publication number	US-2016143128-A1
Application number	US-201514838488-A
Country	US
Kind code	A1
Filing date	Aug 28, 2015
Priority date	Nov 18, 2014
Publication date	May 19, 2016
Grant date	—

Abstract

An electronic device includes: a casing; a board disposed inside the casing and having a heating element mounted thereon; an opposing member disposed inside the casing and having an opposing face opposed to a face of the board on which the heating element is mounted; a heat sink formed by alternately laminating thermal diffusion sheets and adhesive layers each having an opening at a location corresponding to the heating element on the opposing face of the opposing member; and a press member configured to press the heating element against a region of the heat sink corresponding to the opening of the adhesive layer, thus joining the thermal diffusion sheets together at the location of the opening.

First claim

What is claimed is:

1 . An electronic device comprising:
a casing; a board disposed inside the casing and having a heating element mounted thereon; an opposing member disposed inside the casing and having an opposing face opposed to a face of the board on which the heating element is mounted; a heat sink formed by alternately laminating thermal diffusion sheets and adhesive layers each having an opening at a location corresponding to the heating element on the opposing face of the opposing member; and a press member configured to press the heating element against a region of the heat sink corresponding to the opening of the adhesive layer, thus joining the thermal diffusion sheets together at the location of the opening.

2 . The electronic device according to claim 1 , further comprising:
an electronic component provided on an upper face of the opposing member opposite to the opposing face, wherein a recess portion recessed in a direction away from the upper face is formed in a region of the opposing member corresponding to the heating element.

3 . The electronic device according to claim 2 ,
wherein the recess portion is filled with a thermal insulator.

4 . The electronic device according to claim 1 , further comprising:
a heat transfer member provided at joined portions of the plurality of thermal diffusion sheets, the heat transfer member passing through the joined portions.

5 . The electronic device according to claim 1 , further comprising:
an insulating layer laminated on an adhesive layer laminated at a farthest position from the opposing face of the opposing member among the adhesive layers, wherein the press member presses the heating element via the insulating layer against the region of the heat sink corresponding to the opening of the adhesive layer.

6 . The electronic device according to claim 1 ,
the press member comprising: a head portion being in contact with a face of the board opposite to the face on which the heating element is mounted; and a rod-shaped screw portion extending from the head portion to pass through the board, and being movably engaged with a screw hole formed in the opposing member, wherein in conjunction with movement of the rod-shaped screw portion, the head portion presses the board in a direction toward the heat sink, so as to press the heating element against the region of the heat sink corresponding to the opening of the adhesive layer.

Assignees

• Fujitsu Ltd

Inventors

• Tsunoda Yosuke
• Wei Jie
• Suzuki Masumi

Classifications

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H05K2201/10409

  Screws · CPC title

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• H05K2201/066

  Heatsink mounted on the surface of the printed circuit board [PCB] · CPC title

• H05K1/0209 Primary

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title