Heat-insulation device and electronic product

Patent metadata

Field	Value
Publication number	US-11229130-B2
Application number	US-201916968565-A
Country	US
Kind code	B2
Filing date	Feb 1, 2019
Priority date	Feb 9, 2018
Publication date	Jan 18, 2022
Grant date	Jan 18, 2022

Abstract

A heat-insulation device and an electronic product, the heat-insulation device is of a closed hollow structure, and includes a first cover body and a second cover body arranged opposite to each other; a vacuum cavity is formed in the heat-insulation device; the first cover body is made of a heat-conducting material; and a heat-conducting element is provided in the vacuum cavity, and a first end of the heat-conducting element is in contact with an inner wall surface of the first cover body.

First claim

The invention claimed is:

1. A heat-insulation device, being of a closed hollow structure, and comprising a first cover body and a second cover body arranged opposite to each other;
wherein:
a vacuum cavity is formed in the heat-insulation device;
the first cover body is made of a heat-conducting material; and
a heat-conducting element is provided in the vacuum cavity, and a first end of the heat-conducting element is in contact with an inner wall surface of the first cover body;
wherein the heat-conducting element is movably arranged in the vacuum cavity.

2. The heat-insulation device of claim 1 , wherein a second end of the heat-conducting element is in contact with an inner wall surface of the second cover body.

3. The heat-insulation device of claim 1 , wherein the first cover body is arranged close to a heating element, and an area of the first cover body corresponding to the heat-conducting element and an area of the first cover body corresponding to the heating element are at least partially overlapped.

4. The heat-insulation device of claim 1 , wherein the second cover body is arranged close to a heat-sensitive device, and the second cover body comprises a first area corresponding to the heat-conducting element and a second area corresponding to the heat-sensitive device, wherein the first area and the second area are arranged in a staggered manner or at least partially overlapped.

5. The heat-insulation device of claim 1 , wherein the heat-conducting element is capable of rotating and/or moving within the vacuum cavity.

6. The heat-insulation device of claim 1 , wherein a rotatable rotating shaft is provided in the vacuum cavity, and the heat-conducting element is connected with the rotating shaft.

7. The heat-insulation device of claim 1 , further comprising a first driving component, wherein the first driving component is connected with the rotating shaft and is capable of driving the rotating shaft to rotate.

8. The heat-insulation device of claim 7 , wherein the first driving component comprises a rotating motor or a manual rotating part, the first driving component is located outside the vacuum cavity, one of the first cover body and the second cover body is provided with an installation through hole, and one end of the rotating shaft is connected with the first driving component after passing through the installation through hole.

9. The heat-insulation device of claim 7 , further comprising a second driving component, wherein the second driving component is capable of driving the heat-conducting element to move.

10. The heat-insulation device of claim 9 , wherein the second driving component comprises a linear motor, and the linear motor is located outside the vacuum cavity, one of the first cover body and the second cover body is provided with an installation through hole, and the linear motor is connected with the heat-conducting element through the installation through hole; or, the second driving component comprises a manual toggle part, wherein one of the first cover body and the second cover body is provided with an installation through hole, one end of the manual toggle part is located outside the vacuum cavity, and the other end of the manual toggle part is connected with the heat-conducting element through the installation through hole.

11. The heat-insulation device of claim 1 , wherein the second cover body is provided with a groove, and the groove is configured to accommodate the heat-sensitive device.

12. The heat-insulation device of claim 1 , wherein a plurality of heat-conducting elements are provided, and the plurality of heat-conducting elements are arranged at intervals.

13. The heat-insulation device of claim 1 , wherein the heat-conducting element is integrated with the first cover body;
or, the heat-conducting element is integrated with the second cover body.

14. The heat-insulation device of claim 1 , wherein the second cover body is made of a heat-insulation material or a heat-conducting material.

15. An electronic product, comprising: a heating element; and
a heat-insulation device, being of a closed hollow structure, and comprising a first cover body and a second cover body arranged opposite to each other; wherein: a vacuum cavity is formed in the heat-insulation device; the first cover body is made of a heat-conducting material; and a heat-conducting element is provided in the vacuum cavity, and a first end of the heat-conducting element is in contact with an inner wall surface of the first cover body, the heat-conducting element is movably arranged in the vacuum cavity;
wherein the heating element is arranged close to the first cover body of the heat-insulation device.

16. The electronic product of claim 15 , further comprising a heat-sensitive device, wherein the heat-sensitive device is arranged close to the second cover body of the heat-insulation device.

17. The electronic product of claim 16 , wherein a plurality of heating elements are provided, the plurality of the heating elements are arranged around the first cover body, and the heat-sensitive device is accommodated in a groove of the second cover body.

18. The electronic product of claim 16 , wherein a plurality of heat-sensitive devices and a plurality of heat-insulation devices are provided, each of the heat-sensitive devices is accommodated in one groove of the second cover body, the plurality of heat-insulation devices are sequentially arranged, and at least a part of one of two adjacent heat-insulation devices is accommodated in a groove of the other heat-insulation device.

19. The electronic product of claim 15 , wherein the second cover body of the heat-insulation device constitutes a part of a shell of the electronic product.

Assignees

• Zte Corp

Inventors

• Wu Dianfeng

Classifications

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/259

  Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/00 Primary

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• H05K5/0209

  Thermal insulation, e.g. for fire protection or for fire containment or for high temperature environments · CPC title