Resin composition, laminate including the resin composition, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device including the semiconductor wafer with resin composition layer

Patent metadata

Field	Value
Publication number	US-10808103-B2
Application number	US-201716304908-A
Country	US
Kind code	B2
Filing date	May 29, 2017
Priority date	May 31, 2016
Publication date	Oct 20, 2020
Grant date	Oct 20, 2020

Abstract

The present invention provides a resin composition for an underfill material, comprising a maleimide compound (A) and a secondary monoamino compound (B), wherein the secondary monoamino compound (B) has a boiling point of 120° C. or more.

First claim

The invention claimed is:

1. A resin composition for an underfill material, comprising a maleimide compound (A) and a secondary monoamino compound (B),
wherein the maleimide compound (A) comprises a maleimide compound represented by the following formula (2):

wherein n 2 represents an integer of 1 or more and 30 or less, and
wherein the secondary monoamino compound (B) has a boiling point of 120° C. or more.

2. The resin composition according to claim 1 , wherein the maleimide compound (A) further comprises at least one selected from the group consisting of 2,2-bis{4-(4-maleimidophenoxy)phenyl}propane, 1,2-bis(maleimido)ethane, 1,4-bis(maleimido)butane, 1,6-bis(maleimido)hexane, N,N′-1,3-phenylenedimaleimide, N,N′-1,4-phenylenedimaleimide, N-phenylmaleimide, a maleimide compound represented by the following formula (1), and a maleimide compound represented by the following formula (3):

wherein R 1 each independently represents a hydrogen atom or a methyl group, and n 1 represents an integer of 1 or more;

wherein R 2 each independently represents a hydrogen atom, a methyl group or an ethyl group, and R 3 each independently represents a hydrogen atom or a methyl group.

3. The resin composition according to claim 1 , wherein the maleimide compound (A) further comprises at least one selected from the group consisting of 2,2-bis{4-(4-maleimidophenoxy)phenyl}propane, the maleimide compound represented by formula (1), and the maleimide compound represented by formula (3):

wherein R 1 each independently represents a hydrogen atom or a methyl group, and n 1 represents an integer of 1 or more;

wherein R 2 each independently represents a hydrogen atom, a methyl group or an ethyl group, and R 3 each independently represents a hydrogen atom or a methyl group.

4. The resin composition according to claim 1 , wherein the secondary monoamino compound (B) comprises at least one selected from the group consisting of bis(2-methoxyethyl)amine, bis(2-ethoxyethyl)amine, bis(4-biphenylyl)amine, bis(3-biphenylyl)amine, Bindschedler's Green Leuco base, 2-acetamidoethanol, acetamidomethanol, 1-acetamidonaphthalene, bis(4-tert-butylphenyl)amine and a compound represented by the following formula (4):

wherein R 4 represents an aryl group, an aralkyl group, an alkyl group or a cycloalkyl group, R 5 represents an alkylene group, R 6 each independently represents an alkyl group, and n 3 represents an integer of 1 to 3.

5. The resin composition according to claim 4 , wherein the compound (B) comprises the compound represented by formula (4).

6. The resin composition according to claim 5 , wherein the compound (B) is trimethoxy[3-(phenylamino)propyl]silane and/or [3-(cyclohexylamino)propyl]trimethoxysilane.

7. The resin composition according to claim 1 , wherein a content of the compound (B) is 0.5 to 30% by mass based on a total content of the maleimide compound (A).

8. The resin composition according to claim 1 , further comprising an organic compound (C) having an acidic site.

9. The resin composition according to claim 8 , wherein the compound (C) comprises at least one selected from the group consisting of abietic acid, neoabietic acid, dehydroabietic acid, pimaric acid, isopimaric acid, palustric acid, diphenolic acid, dihydroabietic acid, tetrahydroabietic acid, and an acid-modified rosin resin.

10. The resin composition according to claim 1 , further comprising an inorganic filler (D).

11. The resin composition according to claim 10 , wherein the inorganic filler (D) comprises at least one selected from the group consisting of silica, aluminum hydroxide, alumina, boehmite, boron nitride, aluminum nitride, magnesium oxide and magnesium hydroxide.

12. The resin composition according to claim 11 , wherein the inorganic filler (D) comprises silica.

13. The resin composition according to claim 1 , further comprising a flexibility-imparting component (E).

14. The resin composition according to claim 13 , wherein the flexibility-imparting component (E) comprises an acrylic oligomer and/or an acrylic polymer.

15. The resin composition according to claim 1 , comprising a pre-applied underfill material.

16. A laminate, comprising: a supporting material; and a layer comprising the resin composition according to claim 1 stacked on the supporting material.

17. A semiconductor wafer with a resin composition layer, comprising: a semiconductor wafer; and the layer comprising the resin composition of the laminate according to claim 16 stacked on the semiconductor wafer.

18. A substrate for mounting a semiconductor with a resin composition layer, comprising: a substrate for mounting a semiconductor; and the layer comprising the resin composition of the laminate according to claim 16 stacked on the substrate for mounting the semiconductor.

19. A semiconductor device, comprising: the semiconductor wafer with a resin composition layer according to claim 17 .

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Takiguchi Takenori
• Higashiguchi Kohei
• Kida Tsuyoshi

Classifications

• H10W74/40

  characterised by their materials · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W74/012

  of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/47 Primary

  comprising organic materials, e.g. plastics or resins · CPC title