Plasma processing system workpiece carrier with thermally isolated heater plate blocks

Patent metadata

Field	Value
Publication number	US-11322337-B2
Application number	US-201715594297-A
Country	US
Kind code	B2
Filing date	May 12, 2017
Priority date	Aug 1, 2014
Publication date	May 3, 2022
Grant date	May 3, 2022

Abstract

A workpiece carrier is described for a plasma processing chamber that has isolated heater plate blocks. In one example, a plasma processing system has a plasma chamber, a plasma source electrically coupled with a showerhead included within the plasma chamber, a workpiece holder in a processing region of the plasma chamber having a puck to carry a workpiece, wherein the workpiece holder includes a heater plate having a plurality of thermally isolated blocks each thermally coupled to the puck, wherein each block includes a heater to heat a respective block of the heater plate, and wherein the workpiece holder includes a cooling plate fastened to and thermally coupled to the heater plate, the cooling plate defining a cooling channel configured to distribute a heat transfer fluid to transfer heat from the cooling plate, and a temperature controller to independently control each heater.

First claim

What is claimed is:

1. A plasma processing system comprising:
a plasma chamber;
a plasma source electrically coupled with a showerhead included within the plasma chamber;
a workpiece holder in a processing region of the plasma chamber having a puck to carry a workpiece, wherein the workpiece holder includes a heater plate having a plurality of separate thermally isolated blocks each thermally coupled to the puck,
wherein each block includes a heater to heat a respective block of the heater plate, and
wherein the workpiece holder includes a cooling plate fastened to and thermally coupled to the heater plate, the cooling plate including a cooling channel configured to distribute a heat transfer fluid to transfer heat from the cooling plate, wherein the heater extends down into the cooling plate, and the cooling channel laterally adjacent to the heater; and
a temperature controller to independently control each heater.

2. The plasma processing system of claim 1 , wherein the heaters comprise longitudinal resistive heater rods oriented with their longitudinal axis perpendicular to a top surface of the puck.

3. The plasma processing system of claim 1 , wherein the blocks of the heater plate are thermally isolated from each other block by a gap between each block.

4. The plasma processing system of claim 3 , wherein the gap is filled with an insulating material.

5. The plasma processing system of claim 1 , wherein the blocks are arranged in concentric rings across a surface of the heater plate and wherein the blocks are either rectangular, triangular, or hexagonal with straight or curved sides.

6. The plasma processing system of claim 1 , wherein the heater blocks have a heat transfer surface in physical contact with the cooling plate to transfer heat from each respective heater block to the cooling plate.

7. The plasma processing system of claim 6 , wherein the heater blocks and the cooling plate are formed of aluminum and the heat transfer surface is brazed to the cooling plate.

8. The plasma processing system of claim 6 , wherein the heat transfer surface is adjacent to and surrounds the heater.

9. The plasma processing system of claim 1 , further comprising a base plate fastened to the cooling plate opposite the puck, and wherein the cooling channels are open to the base plate, the workpiece holder further comprising a plurality of seals to seal the cooling channels against the base plate.

10. The plasma processing system of claim 9 , wherein the base plate is formed of a material with lower thermal conductivity than the cooling plate.

11. The plasma processing system of claim 10 , wherein the material is selected from titanium, stainless steel, alumina, ceramic, and nickel.

12. A plasma processing chamber comprising:
a chamber housing defining a plasma processing region of the plasma processing chamber;
an inlet defined at a top of the plasma processing chamber, wherein the inlet is configured to receive precursors into the chamber;
a substrate support, comprising:
a puck, a heater plate having a plurality of separate thermally isolated blocks each thermally coupled to the puck, wherein each block includes a heater to heat a respective block of the heater plate, and a cooling plate fastened to and thermally coupled to the heater plate, the cooling plate including a cooling channel configured to distribute a heat transfer fluid to transfer heat from the cooling plate, wherein the heater extends down into the cooling plate, and the cooling channel laterally adjacent to the heater; and
a temperature controller to independently control each heater.

13. The plasma processing chamber of claim 12 , wherein the heaters comprise longitudinal resistive heater rods oriented with their longitudinal axis perpendicular to a top surface of the puck.

14. The plasma processing chamber of claim 12 , wherein the blocks of the heater plate are thermally isolated from each other block by a gap between each block.

15. The plasma processing chamber of claim 14 , wherein the gap is filled with an insulating material.

16. The plasma processing chamber of claim 12 , wherein the blocks are arranged in concentric rings across a surface of the heater plate and wherein the blocks are either rectangular, triangular, or hexagonal with straight or curved sides.

17. The plasma processing chamber of claim 12 , wherein the heater blocks have a heat transfer surface in physical contact with the cooling plate to transfer heat from each respective heater block to the cooling plate.

18. The plasma processing chamber of claim 17 , wherein the heater blocks and the cooling plate are formed of aluminum and the heat transfer surface is brazed to the cooling plate.

19. The plasma processing chamber of claim 17 , wherein the heat transfer surface is adjacent to and surrounds the heater.

20. A processing chamber comprising:
a chamber housing defining a plasma processing region of the processing chamber;
an inlet defined at a top of the processing chamber, wherein the inlet is configured to receive precursors into the chamber;
a substrate support, comprising:
a puck, a heater plate having a plurality of separate thermally isolated blocks each thermally coupled with the puck, wherein each block includes a heater to heat a respective block of the heater plate, and a cooling plate thermally coupled with the heater plate, the cooling plate including a cooling channel configured to distribute a heat transfer fluid to transfer heat from the cooling plate, wherein the heater extends down into the cooling plate, and the cooling channel laterally adjacent to the heater;
a temperature controller to independently control each heater; and
a showerhead positioned within the chamber housing, wherein the showerhead is electrically coupled with a plasma source configured to generate a plasma within the processing chamber.

Assignees

• Applied Materials Inc

Inventors

• Lubomirsky Dmitry
• Nguyen Son T
• Nguyen Anh N
• Palagashvili David

Classifications

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/0432 Primary

  mainly by conduction · CPC title

• H10P72/0421

  for drying etching · CPC title