Multilayer ceramic electronic parts with conductive resin

Patent metadata

Field	Value
Publication number	US-11315733-B2
Application number	US-202017005775-A
Country	US
Kind code	B2
Filing date	Aug 28, 2020
Priority date	Sep 20, 2019
Publication date	Apr 26, 2022
Grant date	Apr 26, 2022

Abstract

A multilayer ceramic electronic component includes a ceramic body having a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The conductive carbon is included in the conductive resin layer in an amount of 0.5 to 5.0 parts by weight based on 100 parts by weight of the conductive metal.

First claim

What is claimed is:

1. A multilayer ceramic electronic component, comprising:
a ceramic body including a dielectric layer and an internal electrode;
an electrode layer connected to the internal electrode; and
a conductive resin layer disposed on the electrode layer, and including a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin,
wherein the conductive carbon is included in the conductive resin layer in an amount of 0.5 to 5.0 parts by weight based on 100 parts by weight of the conductive metal.

2. The multilayer ceramic electronic component of claim 1 , wherein the metal having the lower melting point than the conductive metal is tin (Sn).

3. The multilayer ceramic electronic component of claim 2 , wherein the tin (Sn) is included in the conductive resin layer in an amount of 10 to 50 parts by weight based on 100 parts by weight of the conductive metal.

4. The multilayer ceramic electronic component of claim 1 , wherein the conductive carbon is at least one of graphene, carbon nanotubes, and carbon black.

5. The multilayer ceramic electronic component of claim 4 , wherein the conductive carbon is graphene, and a length of a long axis of the graphene of the conductive carbon is 0.2 nm to 10 μm.

6. The multilayer ceramic electronic component of claim 4 , wherein the conductive carbon is graphene, and a length of a short axis of the graphene of the conductive carbon is 0.2 nm to 10 μm.

7. The multilayer ceramic electronic component of claim 1 , wherein the conductive carbon is provided as at least one conductive carbon disposed in an area of 1 μm×1 μm (width×height) in a cross-section of the conductive resin layer.

8. A multilayer ceramic electronic component, comprising:
a ceramic body including a dielectric layer and an internal electrode;
an electrode layer connected to the internal electrode; and
a conductive resin layer disposed on the electrode layer, and including a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin,
wherein the conductive resin layer has a composition having two peaks in Raman analysis thereof.

9. The multilayer ceramic electronic component of claim 8 , wherein the composition of the conductive resin layer has the two peaks including a peak in a D band and a peak in a G band.

10. The multilayer ceramic electronic component of claim 8 , wherein the conductive carbon is graphene.

11. The multilayer ceramic electronic component of claim 10 , wherein the graphene is included in the conductive resin layer in an amount of 0.5 to 5.0 parts by weight based on 100 parts by weight of the conductive metal.

12. The multilayer ceramic electronic component of claim 10 , wherein a length of a long axis of the graphene is 0.2 nm to 10 μm.

13. The multilayer ceramic electronic component of claim 10 , wherein a length of a short axis of the graphene is 0.2 nm to 10 μm.

14. The multilayer ceramic electronic component of claim 8 , wherein the metal having the lower melting point than the conductive metal is tin (Sn).

15. The multilayer ceramic electronic component of claim 14 , wherein the tin (Sn) is included in the conductive resin layer in an amount of 10 to 50 parts by weight based on 100 parts by weight of the conductive metal in the conductive resin layer.

16. A multilayer ceramic electronic component, comprising:
a ceramic body including first internal electrodes and second internal electrodes that are alternately stacked with dielectric layers disposed therebetween; and
first and second external electrodes disposed an external surface of the ceramic body and respectively connected to the first and second internal electrodes,
wherein each of the first and second external electrodes includes a conductive resin layer including a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin, and
content of the conductive carbon in the conductive resin layer is 0.4 wt % to 5.0 wt %.

17. The multilayer ceramic electronic component of claim 16 , wherein the conductive carbon is at least one of graphene and carbon black.

18. The multilayer ceramic electronic component of claim 16 , wherein the metal having the lower melting point than the conductive metal is included in the conductive resin layer in an amount of 10 to 50 parts by weight based on 100 parts by weight of the conductive metal in the conductive resin layer.

19. The multilayer ceramic electronic component of claim 16 , wherein the first and second external electrodes are disposed on respective opposing surface of the ceramic body, and each include an electrode layer disposed between the conductive resin layer and the respective opposing surface of the ceramic body.

20. The multilayer ceramic electronic component of claim 16 , wherein the conductive metal of the conductive resin layer of the first and second external electrodes includes at least one of copper (Cu), nickel (Ni), silver (Ag), and silver-palladium (Ag—Pd).

21. A multilayer ceramic electronic component, comprising:
a ceramic body including a dielectric layer and an internal electrode;
an electrode layer connected to the internal electrode; and
a conductive resin layer disposed on the electrode layer, and including tin (Sn), a conductive metal having a melting point higher than tin (Sn), a base resin, and graphene or carbon black,
wherein the tin (Sn) is included in the conductive resin layer in an amount of 10 to 50 parts by weight based on 100 parts by weight of the conductive metal in the conductive resin layer.

22. The multilayer ceramic electronic component of claim 21 , wherein the graphene in the conductive resin layer is 0.5 to 5.0 parts by weight based on 100 parts by weight of the conductive metal.

23. The multilayer ceramic electronic component of claim 21 , wherein the carbon black in the conductive resin layer is 0.5 to 5.0 parts by weight based on 100 parts by weight of the conductive metal.

24. The multilayer ceramic electronic component of claim 21 , wherein a length of a long axis of the graphene in the conductive resin layer is 0.2 nm to 10 μm.

Assignees

• Samsung Electro Mech

Inventors

• Park Hye Hun
• Oh Won Kuen
• Lee Tae Gyeom
• Jo Ji Hong

Classifications

• H01G4/2325 Primary

  characterised by the material of the terminals · CPC title

• H01G4/005

  Electrodes · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G2/06 Primary

  specially adapted for mounting on a printed-circuit support · CPC title

• H01G4/12

  Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title