Multilayer ceramic capacitor, manufacturing method thereof and board for mounting the same thereon

Patent metadata

Field	Value
Publication number	US-9520234-B2
Application number	US-201314099650-A
Country	US
Kind code	B2
Filing date	Dec 6, 2013
Priority date	Sep 12, 2013
Publication date	Dec 13, 2016
Grant date	Dec 13, 2016

Abstract

A multilayer ceramic capacitor and manufacturing method therefor, in which the capacitor includes a ceramic body including dielectric layers and internal electrodes; electrode layers connected to the internal electrodes; and a conductive resin layer formed on the electrode layers and including a first conductor, a second conductor having a fiber shape, and a base resin.

First claim

What is claimed is:

1. A multilayer ceramic capacitor comprising:
a ceramic body including dielectric layers and internal electrodes forming capacitance;
external electrode layers connected to the internal electrodes; and
a conductive resin layer formed on the external electrode layers and including a first conductor, a second conductor having a fiber shape, and a base resin.

2. The multilayer ceramic capacitor of claim 1 , wherein the first conductor has a spherical shape or a flake shape.

3. The multilayer ceramic capacitor of claim 1 , wherein the second conductor is flexible.

4. The multilayer ceramic capacitor of claim 1 , wherein L/D≧1.0, in which a diameter of the second conductor is defined as D and a length of the second conductor is defined as L.

5. The multilayer ceramic capacitor of claim 1 , wherein 1 nm≦D≦100 nm, in which a diameter of the second conductor is defined as D.

6. The multilayer ceramic capacitor of claim 1 , wherein the second conductor is a carbon nanotube.

7. The multilayer ceramic capacitor of claim 1 , wherein the second conductor is a single-walled carbon nanotube (SWNT).

8. The multilayer ceramic capacitor of claim 1 , wherein the second conductor is a multi-walled carbon nanotube (MWNT).

9. The multilayer ceramic capacitor of claim 1 , wherein the base resin is a thermosetting resin.

10. The multilayer ceramic capacitor of claim 1 , further comprising a plating layer formed on the conductive resin layer.

11. A manufacturing method of a multilayer ceramic capacitor, comprising:
forming a ceramic body including dielectric layers and internal electrodes;
forming electrode layers to be connected to the internal electrodes;
applying a conductive paste including a first conductor, a second conductor having a fiber shape, and a base resin to the electrode layers; and
curing the conductive paste to form a conductive resin layer.

12. A board for mounting a multilayer ceramic capacitor thereon comprising:
a printed circuit board having first and second electrode pads disposed thereon; and
a multilayer ceramic capacitor installed on the printed circuit board,
wherein the multilayer ceramic capacitor includes
a ceramic body including dielectric layers and internal electrodes forming capacitance;
external electrode layers connected to the internal electrodes; and
a conductive resin layer formed on the external electrode layers and including a first conductor, a second conductor having a fiber shape, and a base resin.

13. A multilayer ceramic capacitor comprising:
a ceramic body including dielectric layers and internal electrodes;
external electrode layers disposed on outer surfaces of the ceramic body and connected to the internal electrodes forming capacitance; and
a conductive resin layer disposed on the external electrode layers and including a first conductive material, a second conductive material having a fiber shape different to shape of the first conductive material, and a base resin.

14. The multilayer ceramic capacitor of claim 13 , wherein the first conductive material has a particle shape.

15. A manufacturing method of a multilayer ceramic capacitor, comprising: forming a ceramic body including a plurality of dielectric layers and internal electrodes; forming external electrode layers on the outer surfaces of the ceramic body to be connected to the internal electrodes;
applying a conductive paste including a first conductive material, a second conductive material having a fiber shape different to shape of the first conductive material, and a base resin to the electrode layers; and
curing the conductive paste to form a conductive resin layer.

16. The manufacturing method of a multilayer ceramic capacitor of claim 15 , wherein the first conductive material has a particle shape.

Assignees

• Samsung Electro Mech

Inventors

• Kang Sim Chung
• Yoo Seung Hee
• Kim Jun Hyeong
• Choi Eun Joo
• Lee Kyu Ha

Classifications

• Y10T29/43

  Electric condenser making · CPC title

• H05K2201/10636

  Leadless chip, e.g. chip capacitor or resistor · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title

• H05K3/3442

  having edge contacts, e.g. leadless chip capacitors, chip carriers · CPC title

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title