Grounding mechanism for multi-layer for electrostatic chuck, and related methods

Patent metadata

Field	Value
Publication number	US-11309207-B2
Application number	US-202016938547-A
Country	US
Kind code	B2
Filing date	Jul 24, 2020
Priority date	Jul 24, 2019
Publication date	Apr 19, 2022
Grant date	Apr 19, 2022

Abstract

Described are multi-layer electrostatic chucks used to secure and support a wafer substrate during wafer processing, and related methods, wherein the chuck includes a grounding structure that includes a grounding layer and a grounding pin.

First claim

What is claimed is:

1. A multi-layer electrostatic chuck assembly comprising:
a dielectric layer;
a conductive field coating above the dielectric layer;
an electrode layer below the dielectric layer;
an insulator layer below the electrode layer;
a polymeric bonding layer below the dielectric layer and above the insulator layer;
a grounding layer above the polymeric bonding layer, below the dielectric layer, and electrically connected to the conductive field coating;
a grounding pin opening extending from a location of the insulator, through the polymeric bonding layer to the grounding layer; and
a grounding pin located in the grounding pin opening, the grounding pin being electrically connected to the grounding layer.

2. The assembly of claim 1 , wherein the grounding layer contacts an upper surface of the polymeric bonding layer and a lower surface of the dielectric layer.

3. The assembly of claim 1 , wherein the grounding layer is an electrically conducting deposited thin film.

4. The assembly of claim 1 , wherein the grounding layer is a deposited thin film comprising nickel, nickel alloy, titanium, aluminum, zirconium, titanium nitride, zirconium nitride, or conductive carbon.

5. The assembly of claim 1 , wherein the grounding layer has a thickness in a range from 100 nanometers to 10 micrometers and a width in a range from 10 nanometers to 100 micrometers.

6. The assembly of claim 1 , wherein the grounding layer extends without interruption around a complete perimeter of the assembly.

7. The assembly of claim 1 , wherein the grounding layer is electrically connected to the conductive field coating by a conductive ground path that extends from the conductive field coating and over an outer diameter surface of the dielectric layer, to connect to the grounding layer.

8. The assembly of claim 1 , further comprising a base below the insulator, that supports the insulator.

9. The assembly of claim 1 , further comprising embossments at an upper surface.

10. A method comprising:
forming a grounding pin opening in a multi-layer structure including a dielectric layer, an electrode layer disposed below the dielectric layer, an insulator layer below the electrode layer, a polymeric bonding layer disposed below the dielectric layer and the electrode layer and above the insulator layer, and a grounding layer disposed above the polymeric bonding layer, below the dielectric layer, and electrically connected to the field coating, the grounding pin opening extending from a location of the insulator layer, through the polymeric bonding layer and to the grounding layer; and
inserting a grounding pin into the grounding pin opening and electrically connecting the grounding pin to the grounding layer.

11. The method of claim 10 , wherein the multi-layer structure comprises a conductive field coating above the dielectric layer, and the grounding layer is electrically connected to the conductive field coating.

Assignees

• Entegris Inc

Inventors

• Donnell Steven
• Rybczynski Jakub
• Chan Chun Wang
• Liu Yan

Classifications

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title

• H01L21/6833 Primary

  Electricity · mapped topic