High conductivity electrostatic chuck

US9692325B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9692325-B2
Application numberUS-201113818339-A
CountryUS
Kind codeB2
Filing dateSep 8, 2011
Priority dateSep 8, 2010
Publication dateJun 27, 2017
Grant dateJun 27, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

In accordance with an embodiment of the invention, there is provided an electrostatic chuck comprising a conductive path covering at least a portion of a workpiece-contacting surface of a gas seal ring of the electrostatic chuck, the conductive path comprising at least a portion of an electrical path to ground; and a main field area of a workpiece-contacting surface of the electrostatic chuck comprising a surface resistivity in the range of from about 10 8 to about 10 12 ohms per square.

First claim

Opening claim text (preview).

What is claimed is: 1. An electrostatic chuck, comprising: a conductive path covering at least a portion of a workpiece-contacting surface of a gas seal ring of the electrostatic chuck, the conductive path comprising a coating covering at least a portion of an outside edge of the gas seal ring and at least a portion of an outside edge of the electrostatic chuck and comprising at least a portion of an electrical path to ground, the conductive path comprising a surface resistivity in the range of from about 10 5 ohms per square to about 10 7 ohms per square; and a main field area of a workpiece-contacting surface of the electrostatic chuck comprising a surface resistivity in the range of from about 10 8 to about 10 12 ohms per square, the main field area comprising at least one embossment extending above surrounding portions of the main field area; and a conductive coating on a workpiece-contacting surface of the at least one embossment. 2. An electrostatic chuck according to claim 1 , wherein the conductive path comprises diamond-like carbon. 3. An electrostatic chuck according to claim 2 , wherein the conductive path comprises doped diamond-like carbon. 4. An electrostatic chuck according to claim 3 , wherein the conductive path comprises hydrogenated carbon doped with nitrogen. 5. An electrostatic chuck according to claim 1 , wherein the conductive path comprises a coating of a thickness less than about 1 micron. 6. An electrostatic chuck according to claim 1 , wherein the conductive path wraps underneath an insulator layer of the electrostatic chuck. 7. An electrostatic chuck according to claim 1 , wherein the main field area comprises silicon carbide. 8. An electrostatic chuck according to claim 7 , wherein the main field area comprises a surface resistivity in the range of from about 10 9 to about 10 11 ohms per square. 9. An electrostatic chuck according to claim 1 , wherein the electrostatic chuck comprises a conductive grounding layer, at least a portion of which is underneath an insulator layer of the electrostatic chuck, the conductive grounding layer electrically contacting the conductive path. 10. An electrostatic chuck according to claim 9 , wherein at least a portion of an outside edge of the conductive grounding layer is covered by the conductive path. 11. An electrostatic chuck according to claim 9 , wherein the conductive grounding layer electrically contacts a grounding pin of the electrostatic chuck. 12. An electrostatic chuck according to claim 9 , further comprising an electrically conductive epoxy layer underlying at least a portion of the conductive grounding layer. 13. An electrostatic chuck according to claim 1 , wherein the conductive path of the electrostatic chuck and the conductive coating on the workpiece-contacting surface of the at least one embossment each comprise a diamond like carbon coating. 14. An electrostatic chuck according to claim 1 , wherein a base of the electrostatic chuck comprises a chamfered area on one or more edges of the base. 15. An electrostatic chuck according to claim 14 , wherein the conductive path electrically contacts the base through a conductive epoxy in the chamfered area. 16. An electrostatic chuck according to claim 15 , wherein the conductive path comprises a coating covering at least a portion of an outside edge of the electrostatic chuck, the conductive path wrapping underneath an insulator layer of the electrostatic chuck. 17. An electrostatic chuck according to claim 1 , further comprising at least one conductive pattern on the workpiece-contacting surface of the electrostatic chuck, the at least one conductive pattern electrically contacting the conductive path. 18. An electrostatic chuck according to claim 17 , wherein the at least one conductive pattern comprises a metal coated with a conductive coating. 19. An electrostatic chuck according to claim 17 , wherein the at least one conductive pattern comprises at least one of: a spoke extending towards the center of the electrostatic chuck; a ring around a gas hole of the electrostatic chuck; and a trace between two embossments on the workpiece-contacting surface of the electrostatic chuck. 20. An electrostatic chuck according to claim 1 , wherein the main field area of the electrostatic chuck comprises a polymer. 21. An electrostatic chuck according to claim 20 , wherein the main field area comprises at least one embossment extending above surrounding portions of the main field area, the at least one embossment comprising a polymer. 22. An electrostatic chuck according to claim 20 , wherein the main field area comprises a surface resistivity in the range of from about 10 8 to about 10 10 ohms per square. 23. An electrostatic chuck according to claim 20 , wherein the conductive path comprises a conductive coating, the conductive coating also covering at least a portion of the main field area. 24. An electrostatic chuck, comprising: a conductive path electrically connected to at least a portion of a workpiece-contacting surface of the electrostatic chuck, the conductive path comprising a coating covering at least a portion of an outside edge of the electrostatic chuck and comprising at least a portion of an electrical path to ground; and a main field area of a workpiece-contacting surface of the electrostatic chuck comprising a surface resistivity in the range of from about 10 8 to about 10 10 ohms per square, the main field area comprising a blanket layer and at least one embossment extending above surrounding portions of the main field area, the blanket layer and the at least one embossment each comprising a polymer comprising carbon nanotubes; the conductive path further comprising a portion extending from under the blanket layer to the coating covering the at least a portion of the outside edge of the electrostatic chuck; and a conductive coating on a workpiece-contacting surface of the at least one embossment. 25. An electrostatic chuck according to claim 24 , wherein the polymer comprises at least one of: carbon nanotube filled polyether imide; carbon nanotube filled polyether ether ketone; and carbon nanotube filled polyimide.

Assignees

Inventors

Classifications

  • Details of electrostatic chucks · CPC title

  • using electrostatic chucks · CPC title

  • using mechanical means, e.g. clamps or pinches · CPC title

  • H10P72/70Primary

    for supporting or gripping · CPC title

  • H02N13/00Primary

    Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9692325B2 cover?
In accordance with an embodiment of the invention, there is provided an electrostatic chuck comprising a conductive path covering at least a portion of a workpiece-contacting surface of a gas seal ring of the electrostatic chuck, the conductive path comprising at least a portion of an electrical path to ground; and a main field area of a workpiece-contacting surface of the electrostatic chuck c…
Who is the assignee on this patent?
Suuronen David, Stone Lyudmila, Blake Julian, and 6 more
What technology area does this patent fall under?
Primary CPC classification H10P72/70. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 27 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).