Flux and solder paste

Patent metadata

Field	Value
Publication number	US-10857630-B2
Application number	US-201816754415-A
Country	US
Kind code	B2
Filing date	Oct 10, 2018
Priority date	Oct 11, 2017
Publication date	Dec 8, 2020
Grant date	Dec 8, 2020

Abstract

Provided are a flux having improved wetting and spreading properties and capable of suppressing the occurrence of dewetting and a solder paste using this flux. The flux includes a total amount of 0.5 wt % or more and 20 wt % or less of: any of a dimer acid which is a reaction product of oleic acid and linoleic acid, a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by adding hydrogen to a dimer acid which is a reaction product of oleic acid and linoleic acid, or a hydrogenated trimer acid obtained by adding hydrogen to a trimer acid which is a reaction product of oleic acid and linoleic acid; or two or more of a dimer acid which is a reaction product of oleic acid and linoleic acid, a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by adding hydrogen to a dimer acid which is a reaction product of oleic acid and linoleic acid, and a hydrogenated trimer acid obtained by adding hydrogen to a trimer acid which is a reaction product of oleic acid and linoleic acid. The solder paste includes this flux and a metal powder.

First claim

The invention claimed is:

1. A flux comprising
a total amount of 0.5 wt % or more and 20 wt % or less of a dimer acid and/or a trimer acid,
wherein the dimer acid is selected from a dimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated dimer acid obtained by adding hydrogen to a dimer acid which is a reaction product of oleic acid and linoleic acid, and a combination thereof, and
the trimer acid is selected from a trimer acid which is a reaction product of oleic acid and linoleic acid, a hydrogenated trimer acid obtained by adding hydrogen to a trimer acid which is a reaction product of oleic acid and linoleic acid, and a combination thereof.

2. The flux according to claim 1 , further comprising:
30 wt % or more and 60 wt % or less of a rosin; and
29 wt % or more and 60 wt % or less of a solvent.

3. The flux according to claim 1 , further comprising:
0 wt % or more and 10 wt % or less of an organic acid;
0 wt % or more and 5 wt % or less of an organic halogen compound; and
0 wt % or more and 5 wt % or less of an amine hydrohalide salt, as an activator.

4. The flux according to claim 1 , further comprising
0 wt % or more and 10 wt % or less of an amine as an activator.

5. The flux according to claim 1 , further comprising
0 wt % or more and 10 wt % or less of a thixotropic agent.

6. The flux according to claim 4 , comprising
0.1 wt % or more and 10 wt % or less of an amine.

7. The flux according to claim 4 , comprising
0.5 wt % or more and 10 wt % or less of an amine.

8. A solder paste comprising
the flux according to claim 1 and a metal powder.

9. The flux according to claim 2 , further comprising:
0 wt % or more and 10 wt % or less of an organic acid;
0 wt % or more and 5 wt % or less of an organic halogen compound; and
0 wt % or more and 5 wt % or less of an amine hydrohalide salt, as an activator.

10. The flux according to claim 2 , further comprising
0 wt % or more and 10 wt % or less of an amine as an activator.

11. The flux according to claim 3 , further comprising
0 wt % or more and 10 wt % or less of an amine as an activator.

12. The flux according to claim 2 , further comprising
0 wt % or more and 10 wt % or less of a thixotropic agent.

13. The flux according to claim 3 , further comprising
0 wt % or more and 10 wt % or less of a thixotropic agent.

14. The flux according to claim 4 , further comprising
0 wt % or more and 10 wt % or less of a thixotropic agent.

15. A solder paste comprising
the flux according to claim 2 and a metal powder.

16. A solder paste comprising
the flux according to claim 3 and a metal powder.

17. A solder paste comprising
the flux according to claim 4 and a metal powder.

18. A solder paste comprising
the flux according to claim 5 and a metal powder.

Assignees

• Senju Metal Industry Co

Inventors

• Takagi Yoshinori
• Kawasaki Hiroyoshi
• Nishizaki Takahiro

Classifications

• C22C13/00

  Alloys based on tin · CPC title

• B23K35/365 Primary

  Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials · CPC title

• B23K35/262

  Sn as the principal constituent · CPC title

• B23K35/025

  Pastes, creams or slurries · CPC title

• B23K35/362 Primary

  Selection of compositions of fluxes (B23K35/365, B23K35/368 take precedence) · CPC title