Apparatus and method for handling wafer carrier doors

Patent metadata

Field	Value
Publication number	US-11270900-B2
Application number	US-202016834290-A
Country	US
Kind code	B2
Filing date	Mar 30, 2020
Priority date	Aug 30, 2017
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers; an opening mechanism configured to open the first door of the wafer carrier; and a door storage space configured to store the first door. The apparatus may be either located on a floor of the FAB or physically coupled to a ceiling of the FAB.

First claim

What is claimed is:

1. An Apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB), comprising:
a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers;
an opening mechanism configured to open the first door of the wafer carrier;
a door storage space configured to store the first door;
a housing comprising an input gateway configured for the wafer carrier to pass through; and
a controller configured to control the table to move the wafer carrier through the input gateway and into a buffering space, wherein the buffering space is configured for a processing tool to process at least one wafer contained in the wafer carrier, wherein:
the wafer carrier is lowered by the transport tool onto a top surface of the table; and
wherein the controller is further configured to control the table to load the wafer carrier whose door has been stored in the door storage space, into a processing tool to process at least one wafer in the wafer carrier.

2. The apparatus of claim 1 , wherein:
the controller is further configured to control the table to unload the wafer carrier after the at least one wafer is processed; and
the apparatus further comprises a closing mechanism configured to
retrieve a second door having a same model as the first door from the door storage space, and
close the second door onto the wafer carrier that has been unloaded.

3. The apparatus of claim 1 , further comprising:
a light shutter located over the table and configured to capture light information of a wafer transport path between the light shutter and the table; and
a first sensor configured to determine whether there is an obstacle on the wafer transport path based on the light information, wherein the first sensor is further configured to inform a second sensor on the transport tool when there is an obstacle on the wafer transport path, to stop the transport tool from transporting wafer carriers to the apparatus.

4. The apparatus of claim 1 , wherein the opening mechanism comprises:
a vacuum pin configured to hold the first door;
a latch key configured to open the first door; and
a moving mechanism configured to move the first door away from the wafer carrier along a first direction, wherein:
the door storage space includes at least one storage unit for door storage; and
the moving mechanism is further configured to:
move the first door, along a second direction that is different from the first direction, to the at least one storage unit that is not attached with any door, and
attach the first door to the at least one storage unit by an alignment pin.

5. The apparatus of claim 4 , further comprising:
a plurality of buffering spaces configured to buffer wafer carriers, whose doors have been opened and stored in the door storage space, before any wafer in the buffered wafer carriers is processed by the processing tool; and
a controller configured to control the table to move the wafer carrier into one of the plurality of buffering spaces along at least one of: the first direction and a third direction that is different from the first direction.

6. The apparatus of claim 1 , further comprising one or more holding mechanisms configured to hold the apparatus to the ceiling of the FAB.

7. The apparatus of claim 1 , wherein the apparatus is associated with a processing tool configured to perform a semiconductor manufacturing process on at least one wafer in the wafer carrier.

8. The apparatus of claim 1 , the table is configured to receive the wafer carrier from vehicle that is physically coupled to a ceiling of a room in which the apparatus is located.

9. The apparatus of claim 1 , further comprising a sensor to detect an object located on a transport path of the wafer carrier.

10. A method for handling wafer carriers by a device located on a floor of a FAB, comprising:
receiving a wafer carrier having a first door and operable to hold a plurality of wafers, wherein the wafer carrier is transported by a transport tool that is physically coupled to a ceiling of the FAB and is located higher than the device;
opening the first door of the wafer carrier along a first direction;
storing the first door in a door storage space of the device;
loading the wafer carrier whose door has been stored in the door storage space, into a processing tool to process at least one wafer in the wafer carrier;
capturing light information of a wafer transport path through which the wafer carrier is received;
determining whether there is an obstacle on the wafer transport path based on the light information; and
informing the transport tool when there is an obstacle on the wafer transport path, to stop the transport tool from transporting wafer carriers to the device.

11. The method of claim 10 , further comprising:
unloading the wafer carrier that has been loaded;
retrieving a second door having a same model as the first door from the door storage space, and
closing the second door onto the wafer carrier that has been unloaded.

12. The method of claim 10 , further comprising:
moving the wafer carrier, along at least one of: the first direction and a second direction that is different from the first direction, into a buffering space in the device; and
buffering the wafer carrier, whose door has been opened and stored in the door storage space, in the buffering space before any wafer in the wafer carrier is processed.

13. The method of claim 12 , wherein:
a controller controls a table upon which the wafer carrier rests to move the wafer carrier into the buffering space.

14. The method of claim 10 , wherein:
opening the first door further comprises:
holding the first door,
opening the first door when the first door is being held, and
moving the first door away from the wafer carrier along the first direction;

the door storage space includes at least one storage unit for door storage.

15. The method of claim 14 , further comprising:
moving the first door, along a third direction that is different from the first direction, to the at least one storage unit that is not attached with any door; and
attaching the first door onto the at least one storage unit.

16. A method for handling wafer carriers by a device in a FAB, comprising:
receiving a wafer carrier having a first door and operable to hold a plurality of wafers;
opening the first door of the wafer carrier;
storing the first door in a door storage space of the device; and
moving the wafer carrier through an input gateway of the device into a buffering space of the device, wherein the buffering space is configured for a processing tool to process at least one wafer contained in the wafer carrier.

17. The method of claim 16 , wherein the wafer carrier is configured to be loaded by a load port for the processing tool to perform a semiconductor manufacturing process on the at least one wafer in the wafer carrier.

18. The method of claim 17 , further comprising:
receiving the wafer carrier that has been unloaded by the load port after wafer processing;
retrieving a second door having a same model as the first door from the door storage space; and
closing the second door onto the wafer carrier that has been unloaded by the load port.

19. The method of claim 16 , wherein:
opening the first door of the wafer carrier comprises:
holding the first door,
opening the first door when the first door is being held, and
moving the first door away from the wafer carrier along a first direction;

the door

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Kuo Tsung-Sheng
• Chu Yang-Ann
• Yang Alan
• Huang Vic
• Liu Hsu-Shui
• Pai Jiun-Rong

Classifications

• H10P72/3406

  involving removal of lid, door or cover · CPC title

• H10P72/3222

  Loading to or unloading from a conveyor · CPC title

• H10P72/3221 Primary

  Overhead conveying · CPC title

• H10P72/70

  for supporting or gripping · CPC title

• H10P72/53

  using optical controlling means · CPC title