Semiconductor package
US-2021398916-A1 · Dec 23, 2021 · US
Gaseous fillings
Gaseous fillings · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W76/43 |
| Official title | Gaseous fillings |
| Display label | Gaseous fillings |
| Total patents | 113 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 1 |
| 2016 | 9 |
| 2017 | 7 |
| 2018 | 11 |
| 2019 | 13 |
| 2020 | 11 |
| 2021 | 13 |
| 2022 | 11 |
| 2023 | 14 |
| 2024 | 14 |
| 2025 | 7 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Vapor cell and vapor cell manufacturing method
US-2021341717-A1 · Nov 4, 2021 · US
Bypass thyristor device with gas expansion cavity within a contact plate
US-11139219-B2 · Oct 5, 2021 · US
Semiconductor device with a layered protection mechanism and associated systems, devices, and methods
US-11114415-B2 · Sep 7, 2021 · US
Semiconductor package with inner and outer cavities
US-11081413-B2 · Aug 3, 2021 · US
Ball grid array underfilling systems
US-2021225748-A1 · Jul 22, 2021 · US
Semiconductor devices and methods of manufacturing semiconductor devices
US-2021193539-A1 · Jun 24, 2021 · US
Integrated circuit packages to minimize stress on a semiconductor die
US-2021183790-A1 · Jun 17, 2021 · US
Device with chemical reaction chamber
US-2020411398-A1 · Dec 31, 2020 · US
Bonded structures
US-10879210-B2 · Dec 29, 2020 · US
Seal ring structures and methods of forming same
US-2020350302-A1 · Nov 5, 2020 · US
Low stress integrated device packages
US-10800651-B2 · Oct 13, 2020 · US
Semiconductor package
US-2020312789-A1 · Oct 1, 2020 · US
Oscillator, electronic apparatus, and vehicle
US-10720886-B2 · Jul 21, 2020 · US
Semiconductor device with a layered protection mechanism and associated systems, devices, and methods
US-2020219851-A1 · Jul 9, 2020 · US
Bonded structures
US-2020144217-A1 · May 7, 2020 · US
Bypass thyristor device with gas expansion cavity within a contact plate
US-2020144141-A1 · May 7, 2020 · US
Semiconductor device with a layered protection mechanism and associated systems, devices, and methods
US-10615150-B2 · Apr 7, 2020 · US
Package structure and antenna device using the same
US-2020036081-A1 · Jan 30, 2020 · US
Bonded structures
US-10522499-B2 · Dec 31, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W76/43?
- CPC H10W76/43 is the Cooperative Patent Classification code for “Gaseous fillings.”
- How many patents are filed under CPC H10W76/43 (Gaseous fillings)?
- Our database includes 113 publications tagged with this CPC code.
- Is patent activity under CPC H10W76/43 growing?
- Publication counts under this code: 14 in 2024 vs 7 in 2025 (latest complete years).