Fluid-cooled package having shielding layer
US-11862533-B2 · Jan 2, 2024 · US
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Strass Achim patents
Strass Achim is listed as an inventor on 8 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Strass Achim |
| Total patents | 8 |
| First publication | Feb 8, 2018 |
| Latest publication | Jan 2, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Fluid-Cooled Package Having Shielding Layer
US-2022115293-A1 · Apr 14, 2022 · US
Package cooled with cooling fluid and comprising shielding layer
US-11244886-B2 · Feb 8, 2022 · US
Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet
US-10615097-B2 · Apr 7, 2020 · US
Package with partially encapsulated cooling channel for cooling an encapsulated chip
US-10461017-B2 · Oct 29, 2019 · US
Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet
US-2018102302-A1 · Apr 12, 2018 · US
Package cooled with cooling fluid and comprising shielding layer
US-2018082925-A1 · Mar 22, 2018 · US
Package with partially encapsulated cooling channel for cooling an encapsulated chip
US-2018040537-A1 · Feb 8, 2018 · US
Recent patents
Latest publications not already listed above.
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/884 | 8 |
| H10W90/756 | 8 |
| H10W90/736 | 8 |
| H10W90/734 | 8 |
| H10W72/352 | 8 |