Die stack arrangement comprising a die-attach-film tape and method for producing same
US-10861818-B2 · Dec 8, 2020 · US
Alignment aids, e.g. alignment marks
Alignment aids, e.g. alignment marks · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W72/385 |
| Official title | {Alignment aids, e.g. alignment marks} |
| Display label | Alignment aids, e.g. alignment marks |
| Total patents | 128 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 14 |
| 2016 | 10 |
| 2017 | 5 |
| 2018 | 4 |
| 2019 | 9 |
| 2020 | 18 |
| 2021 | 22 |
| 2022 | 12 |
| 2023 | 13 |
| 2024 | 11 |
| 2025 | 7 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Semiconductor device
US-10818630-B2 · Oct 27, 2020 · US
Semiconductor package structure
US-10812017-B1 · Oct 20, 2020 · US
Imaging module can easily and stably connect an imaging-sensing device to a coaxial cable
US-10804620-B2 · Oct 13, 2020 · US
Semiconductor packages including die over-shift indicating patterns
US-2020286838-A1 · Sep 10, 2020 · US
Semiconductor device
US-2020286840-A1 · Sep 10, 2020 · US
Semiconductor device package and method of manufacturing the same
US-2020251353-A1 · Aug 6, 2020 · US
Package Structure and Method and Equipment for Forming the Same
US-2020219786-A1 · Jul 9, 2020 · US
Semiconductor package with die stacked on surface mounted devices
US-2020219799-A1 · Jul 9, 2020 · US
Method of manufacturing light source device and light source device
US-2020203589-A1 · Jun 25, 2020 · US
Semiconductor packages including die over-shift indicating patterns
US-10692816-B2 · Jun 23, 2020 · US
Integrated Circuit Package and Method
US-2020111729-A1 · Apr 9, 2020 · US
Chip package structure and method for forming the same
US-2020058614-A1 · Feb 20, 2020 · US
Semiconductor device, method for manufacturing the same, and power conversion device
US-2020043887-A1 · Feb 6, 2020 · US
Lead frame for a die
US-2020043833-A1 · Feb 6, 2020 · US
Light-emittng device
US-2020044115-A1 · Feb 6, 2020 · US
Four D Device Process and Structure
US-2020009844-A1 · Jan 9, 2020 · US
Semiconductor device, chip-shaped semiconductor element, electronic device provided with semiconductor device, and method of manufacturing semiconductor device
US-2020006207-A1 · Jan 2, 2020 · US
Semiconductor device
US-2019378810-A1 · Dec 12, 2019 · US
Integrated circuit package and method
US-10504824-B1 · Dec 10, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W72/385?
- CPC H10W72/385 is the Cooperative Patent Classification code for “Alignment aids, e.g. alignment marks.”
- How many patents are filed under CPC H10W72/385 (Alignment aids, e.g. alignment marks)?
- Our database includes 128 publications tagged with this CPC code.
- Is patent activity under CPC H10W72/385 growing?
- Publication counts under this code: 11 in 2024 vs 7 in 2025 (latest complete years).