Amplifier die with elongated side pads, and amplifier modules that incorporate such amplifier die
US-10284146-B2 · May 7, 2019 · US
US11233483B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11233483-B2 |
| Application number | US-201916530293-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 2, 2019 |
| Priority date | Feb 2, 2017 |
| Publication date | Jan 25, 2022 |
| Grant date | Jan 25, 2022 |
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Apparatus and methods for a modified Doherty amplifier operating at gigahertz frequencies are described. The combining of signals from a main amplifier and a peaking amplifier occur prior to impedance matching of the amplifier's output to a load. An integrated distributed inductor may be used in an impedance inverter to combine the signals. A size of the impedance element can be selected by patterning during manufacture to tune the amplifier and to allow power scaling for the amplifier.
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What is claimed is: 1. A Doherty amplifier comprising: an RF input; a main amplifier connected to the RF input; a peaking amplifier connected to the RF input, the peaking amplifier comprising a combining node at which an output from the main amplifier combines with an output from the peaking amplifier at a drain bonding pad of the peaking amplifier; and an impedance inverter comprising a first integrated distributed inductor, a second integrated distributed inductor, and a capacitor connected in series between the first integrated distributed inductor and the second integrated distributed inductor, at least one of the first integrated distributed inductor or the second integrated distributed inductor comprising a conductive strip line having a width and a length integrated on a substrate. 2. The Doherty amplifier of claim 1 , wherein the impedance inverter comprises one or more bond wires connected between the impedance inverter and the output of the main amplifier. 3. The Doherty amplifier of claim 2 , wherein the impedance inverter further comprises one or more additional bond wires connected between the impedance inverter and the combining node of the peaking amplifier. 4. The Doherty amplifier of claim 1 , wherein there are no impedance-matching elements connected between the main amplifier and the impedance inverter to match an output impedance of the main amplifier to 50 ohms. 5. The Doherty amplifier of claim 1 , wherein the impedance inverter rotates a phase of a first signal amplified by the main amplifier by no more than 95 degrees with respect to a phase of a second signal amplified by the peaking amplifier. 6. The Doherty amplifier of claim 1 , wherein the impedance inverter further comprises bond wires or conductive interconnects connected between the conductive strip line and outputs of the main amplifier and the peaking amplifier. 7. The Doherty amplifier of claim 1 , wherein the width is between approximately 100 microns and approximately 1000 microns. 8. The Doherty amplifier of claim 1 , wherein the length is between approximately 2 millimeters and approximately 6 millimeters. 9. The Doherty amplifier of claim 1 , wherein the main amplifier and peaking amplifier are integrated on a same substrate as the conductive strip line. 10. The Doherty amplifier of claim 1 , wherein the substrate comprises a high-frequency laminate. 11. The Doherty amplifier of claim 1 , wherein the substrate comprises a semiconductor. 12. The Doherty amplifier of claim 1 , wherein one or both of the main amplifier and peaking amplifier comprises gallium-nitride transistors. 13. The Doherty amplifier of claim 1 , wherein the impedance inverter consists essentially of: a first conductive strip line having a width and a length integrated on a substrate; a second conductive strip line having a width and a length integrated on the substrate; the capacitor connected in series between the first conductive strip line and the second conductive strip line; bond wires connected between the outputs from the main amplifier and the peaking amplifier and the impedance inverter; and drain-to-source capacitances of the main amplifier and the peaking amplifier. 14. The Doherty amplifier of claim 1 , further comprising an impedance-matching element connected between the combining node and an output port of the Doherty amplifier. 15. The Doherty amplifier of claim 14 , wherein the impedance-matching element provides an output impedance of approximately 50 ohms for the Doherty amplifier. 16. The Doherty amplifier of claim 14 , wherein the impedance-matching element comprises a double-section impedance-matching element. 17. The Doherty amplifier of claim 14 , wherein an RF fractional bandwidth for the Doherty amplifier is between approximately 6% and approximately 18%. 18. The Doherty amplifier of claim 17 , wherein an operating frequency for the Doherty amplifier is between approximately 500 MHz and approximately 6 GHz. 19. The Doherty amplifier of claim 1 , wherein a rated output power level from the combining node is between approximately 20 Watts and approximately 100 Watts. 20. The Doherty amplifier of claim 1 connected to a cellular transmitter. 21. The Doherty amplifier of claim 1 , wherein the integrated distributed inductor comprises two strip lines separated by the at least one capacitive element. 22. The Doherty amplifier of claim 1 , wherein the integrated distributed inductor comprises two separated strip lines, and the at least one capacitive element is electrically coupled in series between the two separated strip lines.
Arrangements for impedance matching · CPC title
Wires · CPC title
at high-frequency [HF] or radio frequency [RF] · CPC title
in integrated circuits · CPC title
using a main and one or several auxiliary peaking amplifiers whereby the load is connected to the main amplifier using an impedance inverter, e.g. Doherty amplifiers · CPC title
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