Implementing reworkable strain relief packaging structure for electronic component interconnects

Patent metadata

Field	Value
Publication number	US-10111322-B2
Application number	US-201615373511-A
Country	US
Kind code	B2
Filing date	Dec 9, 2016
Priority date	Dec 9, 2016
Publication date	Oct 23, 2018
Grant date	Oct 23, 2018

Abstract

A method and structure are provided for implementing enhanced reworkable strain relief packaging for electronic component interconnects. A plurality of custom strain relief pads is provided with a component footprint wiring layout on a component carrier or a component. The custom strain relief pads are disposed at component body perimeter locations. A solder mask is applied around these pad locations to provide a constrained area for a fusible surface coating. A fusible surface coating material is applied in the to the custom strain relief pads in the constrained area and then soldering of components is performed. Then a structural adhesive material is applied to the custom strain relief pad locations.

First claim

What is claimed is:

1. A structure for implementing enhanced reworkable strain relief packaging for electronic component interconnects comprising:
a component carrier;
a plurality of custom strain relief pads provided with a component footprint wiring layout on the component carrier, said custom strain relief pads disposed at component body perimeter locations;
a solder mask applied around said pad locations, said solder mask providing a constrained area for a fusible surface coating;
said fusible surface coating covering said custom strain relief pads in the constrained area;
a component soldered to said component carrier; and
a structural adhesive material carried by said fusible surface coating at custom strain relief pad locations, residing partially outside a component body perimeter and partially underneath a component body to accommodate optimized fillet formation of strain relief structural adhesive material to the custom coated strain relief pad surfaces, to a bottom surface face of the component body perimeter, and to vertical sidewalls of the component body perimeter.

2. The structure as recited in claim 1 wherein said fusible surface coating material is formed of a selected material having a melting temperature at or below a melting temperature of said component solder.

3. The structure as recited in claim 1 wherein said structural adhesive material provides a rigid structural adhesive.

4. The structure as recited in claim 3 wherein said rigid structural adhesive ruggerdizes and provides strain relief for said component.

5. The structure as recited in claim 1 wherein said structural adhesive material is cured using a selected one of a heat cure and an ultraviolet (UV) cure.

6. The structure as recited in claim 1 wherein said component soldered to said component carrier uses a selected one of a reflow solder method and a surface-mount technology (SMT) assembly method.

7. The structure as recited in claim 1 wherein said structural adhesive material carried by said fusible surface coating is removed with said component by a local heating.

Assignees

• IBM

Inventors

• Hoffmeyer Mark K

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/01365

  Thermally treating (reflowing H10W72/01357) · CPC title

• H10W72/073

  of die-attach connectors · CPC title