Method for manufacturing of display device

Patent metadata

Field	Value
Publication number	US-11205768-B2
Application number	US-202016823934-A
Country	US
Kind code	B2
Filing date	Mar 19, 2020
Priority date	Sep 15, 2017
Publication date	Dec 21, 2021
Grant date	Dec 21, 2021

Abstract

A method for manufacturing a display device is provided. A process of forming an inspection pattern, in which a protective film unit is partially removed in a thickness direction, in a pad area portion of the protective film unit, which corresponds to a pad area of a display unit, may be performed, and then, a process of delaminating the pad area portion of the protective film unit may be performed. A process of checking whether the inspection pattern exists may be performed to check whether the delamination has succeeded, and, at the same time, a process of measuring distances from an alignment mark to each of a long side and a short side of the display unit may be performed.

First claim

What is claimed is:

1. A method for manufacturing a display device, the method comprising:
providing a work panel comprising a work substrate comprising a plurality of display units each comprising a display area and a pad area, and a work protective film attached onto the work substrate;
forming a cutting line in the work protective film so as to correspond to a boundary between the display area and the pad area and along a thickness direction of the work protective film;
forming an inspection pattern by partially removing the work protective film along the thickness direction of the work protective film overlapping the pad area;
cutting the work panel to separate into the display units;
delaminating the work protective film overlapping the pad area in the display units; and
checking whether the inspection pattern exists in the pad area of the display units.

2. The method of claim 1 , wherein the pad area comprises a plurality of wires and a plurality of alignment marks, and
the inspection pattern overlaps at least one of the plurality of alignment marks.

3. The method of claim 2 , wherein the inspection pattern overlaps at least one of the plurality of wires.

4. The method of claim 2 , wherein the plurality of alignment marks is formed on a same layer as that of a wire of the plurality of wires.

5. The method of claim 2 , further comprising measuring distances from an alignment mark of the plurality of alignment marks to each of a long side and a short side of the display unit.

6. The method of claim 5 , wherein measuring distances from the alignment mark to each of the long side and the short side of the display unit and checking whether the inspection pattern exists are performed at the same time.

7. The method of claim 1 , wherein an adhesive layer is between the work panel and the work protective film, and
wherein the cutting line is formed by completely removing the work protective film in the thickness direction of the work protective film along the boundary between the display area and the pad area and exposing the adhesive layer to the outside.

8. The method of claim 7 , wherein a thickness in the adhesive layer overlapping the cutting line is 25 μm to about 40 μm.

9. The method of claim 1 , wherein each of the display units comprises a base substrate, a circuit element layer, a display element layer, and a thin-film encapsulation layer, which are sequentially laminated.

10. A method for manufacturing a display device, the method comprising:
providing a work panel comprising a work substrate comprising a plurality of display units each comprising a display area and a pad area, a work protective film on the work panel, and an adhesive member disposed between the work panel and the work protective film to bond the work panel and the work protective film;
forming a cutting line in the work protective film so as to correspond to a boundary between the display area and the pad area;
forming an inspection pattern in the work protective film overlapping the pad area; and
cutting the work panel to separate into the display units,
wherein the cutting line is formed by completely removing the work protective film in a thickness direction of the work protective film along the boundary between the display area and the pad area and exposing the adhesive member to the outside, and the inspection pattern is formed by partially removing the work protective film in the thickness direction of the work protective film.

11. The method of claim 10 , further comprising delaminating the work protective film overlapping the pad area in the display units; and
checking whether the inspection pattern exists in the pad area of the display units.

12. The method of claim 11 , wherein the pad area comprises a plurality of wires and a plurality of alignment marks, and
the inspection pattern overlaps at least one of the plurality of alignment marks.

13. The method of claim 12 , wherein the inspection pattern overlaps at least one of the plurality of wires.

14. The method of claim 12 , wherein the plurality of alignment marks is formed on a same layer as that of a wire of the plurality of wires.

15. The method of claim 12 , further comprising measuring distances from an alignment mark of the plurality of alignment marks to each of a long side and a short side of the display unit.

16. The method of claim 11 , wherein a thickness in the adhesive member overlapping the cutting line is 25 μm to about 40 μm.

Assignees

• Samsung Display Co Ltd

Inventors

• Cheon Beomjun
• Kim Kyungsik
• Eo Yun-Seok
• Lee Sang-Geun
• Lee Seungkuk
• Lim Sehee
• Choi Jinsoo

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/0606

  Position monitoring, e.g. misposition detection or presence detection · CPC title

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H10W46/603

  Formed on wafers or substrates before dicing and remaining on chips after dicing · CPC title

• H10W46/301

  for alignment · CPC title