Electron beam apparatus
US-10522319-B2 · Dec 31, 2019 · US
US11205555B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11205555-B2 |
| Application number | US-202017103316-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 24, 2020 |
| Priority date | Dec 9, 2019 |
| Publication date | Dec 21, 2021 |
| Grant date | Dec 21, 2021 |
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An electron emission element of the present invention includes a lower electrode, a surface electrode, and a silicone resin layer disposed between the lower electrode and the surface electrode, wherein the surface electrode includes a silver layer, and the silver layer is in contact with the silicone resin layer.
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What is claimed is: 1. An electron emission element comprising: a lower electrode; a surface electrode; a silicone resin layer disposed between the lower electrode and the surface electrode, wherein the surface electrode includes a silver layer, and the silver layer is in contact with the silicone resin layer. 2. The electron emission element according to claim 1 , wherein the silver layer is a silver sputtering layer or a silver-deposited film. 3. The electron emission element according to claim 1 , wherein a thickness of the silicone resin layer is 0.5 μm or more and 1.25 μm or less, and a thickness of the silver layer is more than 5 nm and 30 nm or less. 4. The electron emission element according to claim 1 , wherein the surface electrode is a laminated electrode in which the silver layer and a gold layer or a platinum layer are laminated. 5. The electron emission element according to claim 4 , wherein a thickness of the gold layer or a thickness of the platinum layer is 10 nm or more and 20 nm or less. 6. The electron emission element according to claim 1 , further comprising a substrate, wherein the lower electrode is disposed on the substrate, the silicone resin layer is disposed on the lower electrode, and the surface electrode is disposed on the silicone resin layer.
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