Chip resistor and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-11189403-B2
Application number	US-202017039041-A
Country	US
Kind code	B2
Filing date	Sep 30, 2020
Priority date	Feb 19, 2015
Publication date	Nov 30, 2021
Grant date	Nov 30, 2021

Abstract

A chip resistor includes an upper electrode provided on a substrate, a resistor element connected to the upper electrode, and a side electrode connected to the upper electrode. The side electrode, arranged on a side surface of the substrate, has two portions overlapping with the obverse surface and reverse surface of the substrate, respectively. An intermediate electrode covers the side electrode, and an external electrode covers the intermediate electrode. A first protective layer is disposed between the upper electrode and the intermediate electrode, and held in contact with the upper electrode and the side electrode. The first protective layer is more resistant to sulfurization than the upper electrode. A second protective layer is disposed between the first protective layer and intermediate electrode, and held in contact with the first protective layer, side electrode and intermediate electrode.

First claim

The invention claimed is:

1. A chip resistor comprising:
a substrate having a first surface, a second surface and a side surface, the first and the second surfaces being spaced apart from each other in a thickness direction of the substrate, the side surface being located between the first surface and the second surface;
an upper electrode provided on the first surface of the substrate;
a resistor element arranged on the first surface of the substrate and electrically connected to the upper electrode;
a side electrode electrically connected to the upper electrode and having a first, a second and a third portion, the first portion being arranged on the side surface of the substrate, the second portion and the third portion overlapping with the first surface and the second surface in the thickness direction, respectively;
an intermediate electrode covering the side electrode;
an external electrode covering the intermediate electrode;
a first protective layer located between the upper electrode and the intermediate electrode, the first protective layer being in contact with the upper electrode and the side electrode and being more resistant to sulfurization than the upper electrode, the first protective layer as a whole being spaced apart from the resistor element with a gap intervening therebetween in a direction perpendicular to the thickness direction, with no part of the first protective layer overlapping with the resistor element as viewed in the thickness direction; and
an electroconductive second protective layer located between the first protective layer and the intermediate electrode, the second protective layer being in contact with the first protective layer and the intermediate electrode,
wherein the upper electrode includes a first portion that overlaps with the resistor element in a plan view and that is located between the first surface and the resistor element, and the upper electrode includes a second portion that overlaps with the side electrode in the plan view and that is located between the first surface and the side electrode.

2. The chip resistor according to claim 1 , wherein the first protective layer contains carbon particles.

3. The chip resistor according to claim 1 , wherein the first protective layer is an electrical insulator.

4. The chip resistor according to claim 1 , wherein the second protective layer contains Ag.

5. The chip resistor according to claim 1 , wherein the side electrode is made of Ni—Cr alloy.

6. The chip resistor according to claim 1 further comprising a rear electrode provided on the second surface of the substrate, wherein the side electrode is electrically connected to the rear electrode.

7. The chip resistor according to claim 6 , wherein the rear electrode is covered with the intermediate electrode.

8. The chip resistor according to claim 6 , wherein the rear electrode includes a lower surface that is in contact with the intermediate electrode and the side electrode.

9. The chip resistor according to claim 1 , wherein the substrate is an electrical insulator.

10. The chip resistor according to claim 9 , wherein the substrate is made of alumina.

11. The chip resistor according to claim 1 , wherein the resistor element has a serpentine shape.

12. The chip resistor according to claim 1 , wherein the resistor element includes at least one of RuO 2 or Ag—Pd alloy.

13. The chip resistor according to claim 1 , wherein the resistor element is provided with a trimming groove.

14. The chip resistor according to claim 1 , wherein the intermediate electrode and the external electrode are each made of a plating layer.

15. The chip resistor according to claim 14 , wherein the intermediate electrode is a Ni plating layer.

16. The chip resistor according to claim 14 , wherein the external electrode is made of a Sn plating layer.

17. The chip resistor according to claim 1 further comprising a protective film covering the resistor element and a part of the upper electrode.

18. The chip resistor according to claim 17 , wherein a part of the first protective layer is covered with the protective film.

19. The chip resistor according to claim 17 , wherein the protective film includes a lower protective film and an upper protective film.

20. The chip resistor according to claim 19 , wherein the lower protective film contains glass.

Assignees

• Rohm Co Ltd

Inventors

• Shinoura Takanori
• Imahashi Wataru

Classifications

• H01C17/006

  adapted for manufacturing resistor chips · CPC title

• H01C17/02

  adapted for manufacturing resistors with envelope or housing (apparatus or processes for filling or compressing insulating material in heating element tubes H05B3/52) · CPC title

• H01C17/28

  adapted for applying terminals · CPC title

• H01C1/02

  Housing; Enclosing; Embedding; Filling the housing or enclosure · CPC title

• H01C1/142 Primary

  the terminals or tapping points being coated on the resistive element · CPC title