Core ball, solder paste, formed-solder, flux-coated core ball and solder joint

Patent metadata

Field	Value
Publication number	US-9278409-B2
Application number	US-201514613175-A
Country	US
Kind code	B2
Filing date	Feb 3, 2015
Priority date	Feb 4, 2014
Publication date	Mar 8, 2016
Grant date	Mar 8, 2016

Abstract

A core ball wherein a junction melting temperature and a low alpha dose are set for suppressing a soft error generation and solving a mounting problem. A metallic powder as a core is a sphere. A pure degree of a Cu ball of the metallic powder is equal to or higher than 99.9% but equal to or less than 99.995%. A contained amount of one of Pb and Bi or a total contained amount of Pb and Bi is equal to or higher than 1 ppm. A sphericity of the Cu ball is at least 0.95. A solder plating film for coating the Cu ball comprises Sn—Bi based alloy. U contained in the solder plating film is equal to or less than 5 ppb and Th is equal to or less than 5 ppb. An alpha dose of the core ball is equal to or less than 0.0200 cph/cm 2 .

First claim

What is claimed is:

1. A core ball, comprising:
a sphere-shaped metallic powder forming a core; and
a solder plating film coating the surface of said metallic powder;
wherein said metallic powder is a sphere in which a metallic degree of purity is equal to or higher than 99.9% but equal to or less than 99.995%, a total contained amount of Pb and/or Bi is equal to or larger than 1 ppm and its sphericity is equal to or higher than 0.95;
said solder plating film is a Sn—Bi based Pb-free solder alloy including Bi in an amount of 40-60 mass percent and in which a contained amount of U and Th is equal to or less than 5 ppb respectively; and
the alpha dose of said core ball is equal to or less than 0.0200 cph/cm 2 .

2. The core ball according to claim 1 characterized in that the alpha dose of said solder plating film is equal to or less than 0.0020 cph/cm 2 .

3. The core ball according to claim 1 characterized in that the alpha dose of said solder plating film is equal to or less than 0.0010 cph/cm 2 .

4. The core ball according to claim 1 characterized in that said metallic powder is a Cu ball.

5. The core ball according to claim 1 characterized in that said metallic powder includes a plating layer comprising at least one element selected from the group comprising Ni and Co inside said solder plating film.

6. The core ball according to claim 1 characterized in that said Sn—Bi based alloy comprises a Sn—Bi alloy or a Sn—Bi alloy containing at least one element selected from the group comprising Ag, Cu, Ni, In, Zn, Sb, Ge, Co, P and Fe.

7. A flux coated core ball comprising a flux layer coating the core ball of claim 1 .

8. A solder paste including the core ball of claim 1 .

9. A formed solder including the core ball of claim 1 .

10. A solder joint formed by using the core ball of claim 1 .

11. A core ball, comprising:
a sphere-shaped metallic powder forming a core; and
a solder plating film coating the surface of said metallic powder;
wherein said metallic powder is a sphere in which a metallic degree of purity is equal to or higher than 99.9% but equal to or less than 99.995%, a contained amount of U is equal to or less than 5 ppb, a contained amount of Th is equal to or less than 5 ppb, a total contained amount of Pb and/or Bi is equal to or larger than 1 ppm, its alpha dose is equal to or less than 0.0200 cph/cm 2 , and its sphericity is equal to or higher than 0.95; and
said solder plating film is a Sn—Bi based Pb-free solder alloy including Bi in an amount of 40-60 mass percent.

12. The core ball according to claim 11 characterized in that said solder plating film contains U and Th in amounts that are equal to or less than 5 ppb respectively and its alpha dose is equal to or less than 0.0200 cph/cm 2 .

13. The core ball according to claim 12 characterized in that the alpha dose of said solder plating film is equal to or less than 0.0020 cph/cm 2 .

14. The core ball according to claim 12 characterized in that the alpha dose of said solder plating film is equal to or less than 0.0010 cph/cm 2 .

15. The core ball according to claim 11 characterized in that said metallic powder is a Cu ball.

16. The core ball according to claim 11 characterized in that said metallic powder includes a plating layer comprising at least one element selected from the group comprising Ni and Co inside said solder plating film.

17. The core ball according to claim 11 characterized in that said Sn—Bi based alloy comprises a Sn—Bi alloy or a Sn—Bi alloy containing at least one element selected from the group comprising Ag, Cu, Ni, In, Zn, Sb, Ge, Co, P and Fe.

18. A flux coated core ball comprising a flux layer coating the core ball of claim 11 .

19. A solder paste including the core ball of claim 11 .

20. A formed solder including the core ball of claim 11 .

21. A solder joint formed by using the core ball of claim 11 .

Assignees

• Senju Metal Industry Co

Inventors

• Kawasaki Hiroyoshi
• Kondo Shigeki
• Ikeda Atsushi
• Roppongi Takahiro
• Soma Daisuke
• Sato Isamu

Classifications

• H10W72/255

  of outermost layers of multilayered bumps, e.g. material of a coating · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W72/245

  of outermost layers of multilayered bumps, e.g. bump coating being only on a part of a bump core · CPC title

• H10W72/232

  Plan-view shape, i.e. in top view · CPC title

• B23K35/262

  Sn as the principal constituent · CPC title