Treatment agent for inhibiting substrate pattern collapse and treatment method of substrate
US-2018068863-A1 · Mar 8, 2018 · US
Substrate treating method and substrate treating apparatus
US11133175B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11133175-B2 |
| Application number | US-201716475146-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 10, 2017 |
| Priority date | Jan 6, 2017 |
| Publication date | Sep 28, 2021 |
| Grant date | Sep 28, 2021 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A substrate treating method and a substrate treating apparatus which can reduce the collapse of a pattern on a substrate. The substrate treating method includes a supply step of supplying a process liquid including a sublimable substance in a molten state to a pattern-formed surface of a substrate; a solidification step of solidifying the process liquid on the pattern-formed surface so as to form a solidified body; a sublimation step of subliming the solidified body so as to remove the solidified body from the pattern-formed surface; and an organic substance removal step of removing, when the solidified body is sublimed, an organic substance precipitated on a sublimation interface, and the organic substance removal step is performed so as to overlap at least part of the sublimation step.
First claim
Opening claim text (preview).
The invention claimed is: 1. A substrate treating method comprising: a supply step of supplying a process liquid including a sublimable substance to a pattern-formed surface of a substrate; a solidification step of solidifying the process liquid on the pattern-formed surface so as to form a solidified body; a sublimation step of subliming the solidified body so as to remove the solidified body from the pattern-formed surface; and an organic substance removal step of removing, when the solidified body is sublimed, organic substances before the organic substances become aggregated during the sublimation of the solidified body, the organic substances being precipitated on a sublimation interface of the solidified body and not being sublimable in the sublimation step, wherein the organic substance removal step is performed so as to overlap at least part of the sublimation step, and wherein the organic substance removal step comprises at least one of the following: irradiating ultraviolet rays to the sublimation interface of the solidified body in the sublimation step; and directing ozone gas into contact with the sublimation interface of the solidified body in the sublimation step. 2. The substrate treating method according to claim 1 , wherein the organic substance removal step is started before start of the sublimation step, at a time of the start of the sublimation step or during the sublimation step. 3. The substrate treating method according to claim 1 , wherein the organic substance removal step is completed during the sublimation step, at a time of completion of the sublimation step or after the completion of the sublimation step. 4. The substrate treating method according to claim 1 , wherein the organic substance removal step is continuously performed. 5. The substrate treating method according to claim 1 , wherein the sublimation step is started during the solidification step.
Assignees
Inventors
Classifications
for wet cleaning or washing · CPC title
- H10P70/20Primary
Cleaning during device manufacture · CPC title
Temperature monitoring · CPC title
Apparatus for applying a liquid, a resin, an ink or the like · CPC title
Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title
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Frequently asked questions
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- What does patent US11133175B2 cover?
- A substrate treating method and a substrate treating apparatus which can reduce the collapse of a pattern on a substrate. The substrate treating method includes a supply step of supplying a process liquid including a sublimable substance in a molten state to a pattern-formed surface of a substrate; a solidification step of solidifying the process liquid on the pattern-formed surface so as to fo…
- Who is the assignee on this patent?
- Screen Holdings Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P70/20. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Sep 28 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).