Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots

Patent metadata

Field	Value
Publication number	US-11130701-B2
Application number	US-202016910266-A
Country	US
Kind code	B2
Filing date	Jun 24, 2020
Priority date	Sep 30, 2016
Publication date	Sep 28, 2021
Grant date	Sep 28, 2021

Abstract

A method for laser processing a transparent workpiece includes forming a contour line that includes defects, by directing a pulsed laser beam output by a beam source through an aspheric optical element positioned offset in a radial direction from the beam pathway and into the transparent workpiece such that the portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece that produces a defect within the transparent workpiece. The portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, an effective spot size wo,eff, and a non-axisymmetric beam cross section having a minimum Rayleigh range ZRx,min in an x-direction and a minimum Rayleigh range ZRy,min in a y-direction. Further, the smaller of ZRx,min and ZRy,min is greater thanFD=π⁢⁢w0,eff2λ,where FD is a dimensionless divergence factor comprising a value of 10 or greater.

First claim

What is claimed is:

1. A method for laser processing a transparent workpiece, the method comprising:
forming a contour line in the transparent workpiece, the contour line comprising defects in the transparent workpiece, wherein forming the contour line comprises:
directing a pulsed laser beam oriented along a beam pathway and output by a beam source into the transparent workpiece, the pulsed laser beam generating an induced absorption within the transparent workpiece, the induced absorption producing a defect within the transparent workpiece, the pulsed laser beam comprising:
a wavelength λ; and
an effective spot size w o,eff ; and
a non-axisymmetric beam cross section that comprises a minimum Rayleigh range Z Rx,min in a cross-sectional x-direction and a minimum Rayleigh range Z Ry,min in a cross-sectional y-direction, wherein the smaller of Z Rx,min and Z Ry,min is greater than

F
D

⁢

π
⁢

w

0
,
eff

2

λ

,

where F D is a dimensionless divergence factor with a value of 10 or greater; and
a first portion and a second portion, the first portion being incoherent with respect to the second portion.

2. The method of claim 1 , wherein the non-axisymmetric beam cross section of the portion of the pulsed laser beam directed into the transparent workpiece comprises a long axis with spot size parameter w o,max and a short axis with spot size parameter w o,min , wherein w o,max is longer than w o,min and an aspect ratio of w o,max to w o,min is greater than 1.3.

3. The method of claim 2 , wherein the aspect ratio is greater than 2.

4. The method of claim 1 , wherein the laser beam comprises a first portion and a second portion, the first portion being incoherent with respect to the second portion.

5. The method of claim 1 , wherein the laser beam is directed through an aspheric optical element.

6. The method of claim 5 , wherein the aspheric optical element comprises a refractive axicon, a reflective axicon, waxicon, negative axicon, a spatial light modulator, a diffractive optic, or a cubically shaped optical element.

7. The method of claim 5 , wherein the aspheric optical element is positioned offset in a radial direction from the beam pathway.

8. The method of claim 7 , wherein:
the aspheric optical element is offset from the beam pathway in the radial direction by an offset distance; and
the offset distance is a distance from about 10% to about 75% of a cross sectional diameter of the pulsed laser beam at a contact location between the pulsed laser beam and the aspheric optical element.

9. The method of claim 5 , further comprising directing the laser beam beyond an optical blocking element, the aspheric optical element and the optical blocking element positioned between the beam source and the transparent workpiece.

10. The method of claim 9 , wherein the optical blocking element is positioned between the aspheric optical element and the transparent workpiece.

11. The method of claim 9 , wherein the optical blocking element is positioned between the beam source and the aspheric optical element.

12. The method of claim 9 , wherein:
a first lens and a second lens are each positioned between the beam source and the transparent workpiece within the beam pathway; and
the optical blocking element is positioned between the first lens and the second lens.

13. The method of claim 9 , wherein the optical blocking element is positioned within the beam pathway, such that the optical blocking element blocks from about 25% to about 80% of an intensity of the pulsed laser beam.

14. The method of claim 9 , wherein the optical blocking element is positioned within the beam pathway such that the optical blocking element blocks a cross-sectional chord portion of the pulsed laser beam.

15. The method claim 1 , wherein the dimensionless divergence factor F D has a value of from about 50 to about 1500.

16. The method of claim 1 , wherein the defect comprises a central defect region and at least one radial arm that extends outward from the central defect region along a long axis of the non-axisymmetric beam cross section.

17. The method of claim 1 , wherein the beam source comprises a pulsed beam source that produces pulse bursts with from about 1 pulse per pulse burst to about 30 pulses per pulse burst and a pulse burst energy is from about 100 μJ to about 600 μJ per pulse burst.

18. The method of claim 1 , further comprising translating the transparent workpiece and the pulsed laser beam relative to each other along the contour line, thereby laser forming a plurality of defects along the contour line within the transparent workpiece.

19. The method of claim 18 , further comprising directing an infrared laser beam onto the transparent workpiece along or near the contour line to separate the transparent workpiece along the contour line.

20. A method for laser processing a transparent workpiece, the method comprising:
forming a contour line in the transparent workpiece, the contour line comprising defects in the transparent workpiece, wherein forming the contour line comprises:
directing a pulsed laser beam oriented along a beam pathway and output by a beam source through an aspheric optical element into the transparent workpiece, the pulsed laser beam generating an induced absorption within the transparent workpiece, the induced absorption producing a defect within the transparent workpiece, the pulsed laser beam comprising:
a wavelength λ;
an effective spot size w o,eff ; and
a non-axisymmetric beam cross section that comprises a minimum Rayleigh range Z Rx,min in a cross-sectional x-direction and a minimum Rayleigh range Z Ry,min in a cross-sectional y-direction, wherein the smaller of Z Rx,min and Z Ry,min is greater than

F
D

=

π
⁢

⁢

w

0
,
eff

2

λ

,

where F D is a dimensionless divergence factor with a value of 10 or greater; and
rotating the aspheric optical element about the beam pathway.

Assignees

• Corning Inc

Inventors

• Akarapu Ravindra Kumar
• Piech Garrett Andrew
• Tsuda Sergio
• West James Andrew

Classifications

• B23K26/53

  for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks · CPC title

• B23K26/073

  Shaping the laser spot · CPC title

• B23K26/0648 Primary

  comprising lenses · CPC title

• B23K26/06

  Shaping the laser beam, e.g. by masks or multi-focusing · CPC title

• B23K26/00 Primary

  Working by laser beam, e.g. welding, cutting or boring · CPC title