Modular electronic prototyping platforms
US-12177969-B2 · Dec 24, 2024 · US
Wiring board and method for manufacturing the same
US8971053B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8971053-B2 |
| Application number | US-201414160766-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 22, 2014 |
| Priority date | Mar 30, 2010 |
| Publication date | Mar 3, 2015 |
| Grant date | Mar 3, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A wiring board includes a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on a surface of the first substrate and including interlayer resin insulation layers and wiring layers, the built-up layer having an opening portion communicated with the penetrating hole of the first substrate and opened to the outermost surface of the built-up layer, an interposer accommodated in the opening portion of the built-up layer and including a second substrate and a wiring layer formed on the second substrate, the wiring layer of the interposer including conductive circuits for being connected to semiconductor elements, a filler filling the opening portion such that the interposer is held in the opening portion of the built-up layer, and mounting pads formed on the first substrate and positioned to mount the semiconductor elements. The mounting pads are positioned to form a matrix on the first substrate.
First claim
Opening claim text (preview).
What is claimed is: 1. A wiring board, comprising: a first substrate having a first opening portion penetrating through the first substrate; a built-up layer formed on a surface of the first substrate and comprising a plurality of interlayer resin insulation layers and a plurality of wiring layers, the built-up layer having a second opening portion communicated with the first opening portion of the first substrate and opened to an outermost surface of the built-up layer on an op…
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US8971053B2 cover?
- A wiring board includes a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on a surface of the first substrate and including interlayer resin insulation layers and wiring layers, the built-up layer having an opening portion communicated with the penetrating hole of the first substrate and opened to the outermost surface of the built-up l…
- Who is the assignee on this patent?
- Ibiden Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K1/181. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 03 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).